Abstract: A system which automatically provisions teleconferencing equipment with virtually all necessary settings is provided. The need for end users to spend time manually configuring such equipment to use the services of a teleconferencing service provider is, in most cases, eliminated.

Abstract: A flip-chip image-sensor package includes a substrate, a coverglass, a conductive layer, and an image sensor. The substrate has an aperture therethrough and a first region and a second region each at least partially surrounding the aperture. The aperture has a first width defined by a boundary of the first region, and a second width defined by a boundary of the second region, wherein the second width exceeds the first width. The coverglass spans the aperture and is located on a top surface of the first region. The conductive layer adjoins the substrate. The image sensor is located beneath the coverglass and is electrically connected to the conductive layer.

Abstract: A digital image capturing module assembly and method of fabricating the same is proposed, which is used for the assembly of a digital image capturing module from a photosensitive printed circuit board and a lens holder. The proposed assembly method is characterized by the provision of a ring plane between focusing plane and corner-located aligning posts on the lens holder so as to allow the coated adhesive layer over the ring plane to provide a sealed light impenetrable effect at the junction between the photosensitive printed circuit board and the lens holder. This feature allows the captured image by the digital image capturing module to be substantially free of sidelight effect and thus more assured in picture quality. Moreover, it can simplify the assembly process to help increase the yield of the fabrication of digital image capturing modules.

Abstract: An integrated lens assembly is provided, including: 1) a casing having an opening; 2) a lens having a forward end received in the opening of the casing; 3) a lens protection device embedded in the casing via the opening to encapsulate the forward end of the lens, wherein the lens protection device partially protrudes from the casing; 4) an image processing unit optically connected to the lens for electrically acquiring images; 5) and a power source electrically connected to the image processing unit to supply power to the image processing unit for operating the image processing unit. The forward end of the lens can be flush or protrude from with the casing. The above integrated lens assembly reduces a prior-art gap between the lens and the lens protection device, thereby facilitating miniaturization of the integrated lens assembly.

Abstract: A digital image capturing module assembly and method of fabricating the same is proposed, which is used to fabricate a digital image capturing module assembly from a photosensitive printed circuit board and a lens holder. The proposed assembly method is characterized by the attachment of a light-impenetrable reinforcement plate to the photosensitive printed circuit board to provide both a light-impenetrable effect and an reinforcement effect to the photosensitive printed circuit board, which allows the enclosed photosensitive device to be shielded from sidelight and backlight, and further allows the photosensitive printed circuit board to be reinforced in structural strength that can prevent it from deformation or cracking during fabrication and transportation. This feature allows the finished product of digital image capturing module to be more assured in its optical quality of captured images during actual application, and also allows the fabrication thereof to have a high rate of yield during assembly.

Abstract: A digital image capturing module assembly and method of fabricating the same is proposed, which is designed for the assembly of a digital image capturing module from a photosensitive printed circuit board and a lens holder. The proposed module assembly is characterized by the provision of a shouldered portion and a grooved portion in the lens holder's inner wall around the focusing plane of the lens holder wherein an adhesive layer is coated in the grooved portion to adhere the photosensitive printed circuit board to the lens holder. This feature allows the junction between the photosensitive printed circuit board and the lens holder to have a sealed light-impenetrable quality, so that the captured image by the digital image capturing module would be substantially free of sidelight effect. Moreover, it allows the finished product of digital image capturing module to be more compact in size than prior art.