Abstract: A method for calibration including determining a temperature induced offset in a pedestal of a process module under a temperature condition for a process. The method includes delivering a wafer to the pedestal of the process module by a robot, and detecting an entry offset. The method includes rotating the wafer over the pedestal by an angle. The method includes removing the wafer from the pedestal by the robot and measuring an exit offset. The method includes determining a magnitude and direction of the temperature induced offset using the entry offset and exit offset.

Abstract: A method for calibration including determining a temperature induced offset in a pedestal of a process module under a temperature condition for a process. The method includes delivering a wafer to the pedestal of the process module by a robot, and detecting an entry offset. The method includes rotating the wafer over the pedestal by an angle. The method includes removing the wafer from the pedestal by the robot and measuring an exit offset. The method includes determining a magnitude and direction of the temperature induced offset using the entry offset and exit offset.

Abstract: A robot calibration system includes a calibration fixture configured to be mounted on a substrate processing chamber. The calibration fixture includes at least one camera arranged to capture an image including an outer edge of a test substrate and an edge ring surrounding the test substrate. A controller is configured to receive the captured image, analyze the captured image to measure a distance between the outer edge of the test substrate and the edge ring, calculate a center of the test substrate based on the measured distance, and calibrate a robot configured to transfer substrate to and from the substrate processing chamber based on the calculated center of the test substrate.

Abstract: A method for calibration including determining a temperature induced offset in a pedestal of a process module under a temperature condition for a process. The method includes delivering a wafer to the pedestal of the process module by a robot, and detecting an entry offset. The method includes rotating the wafer over the pedestal by an angle. The method includes removing the wafer from the pedestal by the robot and measuring an exit offset. The method includes determining a magnitude and direction of the temperature induced offset using the entry offset and exit offset.

Abstract: A method for calibration including determining a temperature induced offset in a pedestal of a process module under a temperature condition for a process. The method includes delivering a wafer to the pedestal of the process module by a robot, and detecting an entry offset. The method includes rotating the wafer over the pedestal by an angle. The method includes removing the wafer from the pedestal by the robot and measuring an exit offset. The method includes determining a magnitude and direction of the temperature induced offset using the entry offset and exit offset.

Abstract: A method for calibration including determining a temperature induced offset in a pedestal of a process module under a temperature condition for a process. The method includes delivering a wafer to the pedestal of the process module by a robot, and detecting an entry offset. The method includes rotating the wafer over the pedestal by an angle. The method includes removing the wafer from the pedestal by the robot and measuring an exit offset. The method includes determining a magnitude and direction of the temperature induced offset using the entry offset and exit offset.

Abstract: A method for calibration including determining a temperature induced offset in a pedestal of a process module under a temperature condition for a process. The method includes delivering a wafer to the pedestal of the process module by a robot, and detecting an entry offset. The method includes rotating the wafer over the pedestal by an angle. The method includes removing the wafer from the pedestal by the robot and measuring an exit offset. The method includes determining a magnitude and direction of the temperature induced offset using the entry offset and exit offset.

Abstract: A method for calibration including determining a temperature induced offset in a pedestal of a process module under a temperature condition for a process. The method includes delivering a wafer to the pedestal of the process module by a robot, and detecting an entry offset. The method includes rotating the wafer over the pedestal by an angle. The method includes removing the wafer from the pedestal by the robot and measuring an exit offset. The method includes determining a magnitude and direction of the temperature induced offset using the entry offset and exit offset.

Abstract: A wafer alignment system includes an image capture device that captures an image of a wafer positioned on a pedestal. An image analysis module analyzes the image to detect an edge of the wafer and a notch formed in the edge of the wafer and calculates, based on a position of the notch, first and second edge positions corresponding to the edge of the wafer. An offset calculation module calculates an angular offset of the wafer based on the first position and the second edge positions. A system control module controls transfer of the wafer from the pedestal to a process cell based on the angular offset.

Abstract: A wafer alignment system includes an image capture device that captures an image of a wafer positioned on a pedestal. An image analysis module analyzes the image to detect an edge of the wafer and a notch formed in the edge of the wafer and calculates, based on a position of the notch, first and second edge positions corresponding to the edge of the wafer. An offset calculation module that calculates an angular offset of the wafer based on the first position and the second edge positions. A system control module controls transfer of the wafer from the pedestal to a process cell based on the angular offset.

Abstract: A work piece handling apparatus moves workpieces with a plurality of independently movable load cups that have combined multiple axes of motion. The apparatus can load and unload work pieces from a wet process station and move work pieces between wet process stations and maintain wet chemistry delivery to the workpiece without involving a robot. A method of work piece handling using the apparatus provides a significant throughput improvement by reducing the inherent time lag of pneumatic systems and eliminating multiple steps involving the robot during inter-station wafer transfer.

Abstract: Torque control capability is provided to a position controlled robot by calculating joint position inputs from transformation of the desired joint torques. This is based on calculating the transfer function 1/E(s), which relates the desired joint torque to joint position. Here E(s) is a servo transfer function D(s) or an effective servo transfer function D*(s). The use of an effective servo transfer function D*s) is helpful in cases where joint nonlinearities are significant. The effective servo transfer function D*(s) is defined with respect to an ideal joint transfer function G*(s)=1/(Ieffs2+beffs), where Ieff is an effective moment of inertia and beff is an effective damping coefficient.

Abstract: Torque control capability is provided to a position controlled robot by calculating joint position inputs from transformation of the desired joint torques. This is based on calculating the transfer function 1/E(s), which relates the desired joint torque to joint position. Here E(s) is a servo transfer function D(s) or an effective servo transfer function D*(s). The use of an effective servo transfer function D*s) is helpful in cases where joint nonlinearities are significant. The effective servo transfer function D*(s) is defined with respect to an ideal joint transfer function G*(s)=1/(Ieffs2+beffs), where Ieff is an effective moment of inertia and beff is an effective damping coefficient.

Abstract: Torque control capability is provided to a position controlled robot by calculating joint position inputs from transformation of the desired joint torques. This is based on calculating the transfer function 1/E(s), which relates the desired joint torque to joint position. Here E(s) is a servo transfer function D(s) or an effective servo transfer function D*(s). The use of an effective servo transfer function D*s) is helpful in cases where joint nonlinearities are significant. The effective servo transfer function D*(s) is defined with respect to an ideal joint transfer function G*(s)=1/(Ieffs2+beffs), where Ieff is an effective moment of inertia and beff is an effective damping coefficient.

Abstract: Torque control capability is provided to a position controlled robot by calculating joint position inputs from transformation of the desired joint torques. This is based on calculating the transfer function 1/E(s), which relates the desired joint torque to joint position. Here E(s) is a servo transfer function D(s) or an effective servo transfer function D*(s). The use of an effective servo transfer function D*s) is helpful in cases where joint nonlinearities are significant. The effective servo transfer function D*(s) is defined with respect to an ideal joint transfer function G*(s)=1/(Ieffs2+beffs) , where Ieff is an effective moment of inertia and beff is an effective damping coefficient.