Abstract: The present invention relates to the field of selective metallization, and in particular to preparing a polymer article for selective metallization by submerging the article in a first liquid, and while submerged irradiate the article by a laser beam the area of the article on which the metal is to be deposited. An activation step, prior to the selective metallization, comprises submerging the article in an activation liquid for depositing seed particles in the selected area. The irradiation of the selected area is proportionate so as to cause a temporary melting of the polymer in the surface of the selected area of the polymer article. The invention is advantageous in that the preparation may be performed with a relatively high scan rate across the polymer article, and in that a quite limited use of toxic chemicals.

Abstract: A method of manufacturing a mould part (8) for forming an article. The method comprises: providing a master (1) of an aluminium alloy or a zinc alloy with a surface (7) corresponding to the surface of the article to be formed by the mould part. A copper layer (3) is deposited on top of the master surface (7). Then a mould part layer (4) of nickel, a nickel alloy, cobalt or a cobalt alloy is plated on top of the copper layer. The master (1) is dissolved in a solution. The copper layer (3) is selectively etched from the mould part layer (4) in an alkaline etchant comprising free Cu(II) ions, a first complexing agent forming strong complexes with Cu(I) ions but not Ni ions or Co ions, a second complexing agent forming strong complexes with Cu(II) ions but not Ni ions or Co ions. Oxygen is supplied to the etchant for oxidizing Cu(I) ions to Cu (II) ions.

Abstract: The present invention relates to the field of selective metallization, and in particular to preparing a polymer article for selective metallization by submerging the article in a first liquid, and while submerged irradiate the article by a laser beam the area of the article on which the metal is to be deposited. An activation step, prior to the selective metallization, comprises submerging the article in an activation liquid for depositing seed particles in the selected area. The irradiation of the selected area is proportionate so as to cause a temporary melting of the polymer in the surface of the selected area of the polymer article. The invention is advantageous in that the preparation may be performed with a relatively high scan rate across the polymer article, and in that a quite limited use of toxic chemicals.

Abstract: The invention is a microporous layer to be used in metal forming processes providing lower friction and improved resistance against galling. The layer is a thin, porous metallic film, which is electrochemically deposited on a metallic substrate, whereafter one of the metals of the deposited film is selectively removed by chemical etching, thereby leaving a micro- or even nanoporous layer on the surface of the substrate, which enhances lubricant entrapment leading to improved lubrication during metal forming processes.

Abstract: An electroplating method of forming platings of nickel, cobalt, nickel alloys or cobalt alloys with reduced stress in a Watts bath, a chloride bath or a combination thereof, by employing pulse plating with periodic reverse pulses and a sulfonated naphthalene additive. This method makes it possible to deposit nickel, cobalt, nickel alloy or cobalt alloy platings without internal stress.