Abstract: Aspects include creating a knowledge base that identifies experts in a set of domains. Front-end processing is provided to an issue tracking system. The front-end processing includes receiving a report of an issue related to one of the domains, and accessing the knowledge base to locate an expert in the domain. The front-end processing also includes instructing the issue tracking system to route the received report of the issue to the located expert in the domain. The issue tracking system executes on a different processor than the front-end processing. Data collected from operation of the issue tracking system is monitored, and the knowledge base is updated based at least in part on the data collected from the operation of the issue tracking system.

Abstract: An electrically conducting, vertically displacing microelectromechanical system (MEMS) is formed on a first integrated circuit chip. The first integrated circuit chip is physically connected to a three-dimensional packaging structure. The three-dimensional packaging structure maintains a fixed distance between the first integrated circuit chip and a second integrated circuit chip. A control circuit is operatively connected to the MEMS. The control circuit directs movement of the MEMS between a first position and a second position. The MEMS makes contact with a contact pad on the second integrated circuit chip when it is in the second position forming a conductive path and providing electrical communication between the first integrated circuit chip and the second integrated circuit chip. The MEMS avoids making contact with the contact pad on the second integrated circuit chip when it is in the first position.

Abstract: Structures and methods for self-powered devices are disclosed herein. Specifically, disclosed herein is a stacked, three-dimensional integrated circuit including a power generation die including a power source. The integrated circuit also includes a functional system die including one or more functional components that are powered by power generated by the power source. The power generation die and the functional system die are stacked in a three-dimensional structure.

Abstract: An electrically conducting, vertically displacing microelectromechanical system (MEMS) is formed on a first integrated circuit chip. The first integrated circuit chip is physically connected to a three-dimensional packaging structure. The three-dimensional packaging structure maintains a fixed distance between the first integrated circuit chip and a second integrated circuit chip. A control circuit is operatively connected to the MEMS. The control circuit directs movement of the MEMS between a first position and a second position. The MEMS makes contact with a contact pad on the second integrated circuit chip when it is in the second position forming a conductive path and providing electrical communication between the first integrated circuit chip and the second integrated circuit chip. The MEMS avoids making contact with the contact pad on the second integrated circuit chip when it is in the first position.

Abstract: An electrically conducting, vertically displacing microelectromechanical system (MEMS) is formed on a first integrated circuit chip. The first integrated circuit chip is physically connected to a three-dimensional packaging structure. The three-dimensional packaging structure maintains a fixed distance between the first integrated circuit chip and a second integrated circuit chip. A control circuit is operatively connected to the MEMS. The control circuit directs movement of the MEMS between a first position and a second position. The MEMS makes contact with a contact pad on the second integrated circuit chip when it is in the second position forming a conductive path and providing electrical communication between the first integrated circuit chip and the second integrated circuit chip. The MEMS avoids making contact with the contact pad on the second integrated circuit chip when it is in the first position.

Abstract: Structures and methods for self-powered devices are disclosed herein. Specifically, disclosed herein is a stacked, three-dimensional integrated circuit including a power generation die including a power source. The integrated circuit also includes a functional system die including one or more functional components that are powered by power generated by the power source. The power generation die and the functional system die are stacked in a three-dimensional structure.

Abstract: An electrically conducting, vertically displacing microelectromechanical system (MEMS) is formed on a first integrated circuit chip. The first integrated circuit chip is physically connected to a three-dimensional packaging structure. The three-dimensional packaging structure maintains a fixed distance between the first integrated circuit chip and a second integrated circuit chip. A control circuit is operatively connected to the MEMS. The control circuit directs movement of the MEMS between a first position and a second position. The MEMS makes contact with a contact pad on the second integrated circuit chip when it is in the second position forming a conductive path and providing electrical communication between the first integrated circuit chip and the second integrated circuit chip. The MEMS avoids making contact with the contact pad on the second integrated circuit chip when it is in the first position.

Abstract: Systems and methods for selectively utilizing secondary power sources during peak power times are provided for. The method includes receiving a notification of a peak power time, and discontinuing use of a primary power supply and beginning use of a secondary power supply based upon the notification.

Abstract: A MEMS component is monitored to determine its status. Sensors are deployed to sense the MEMS component and produce detection signals that are analyzed to determine the MEMS component state. An indicator device alerts a user of the status, particularly if the MEMS component has failed. Additionally, the MEMS component monitoring system may be practiced as a design structure encoded on computer readable storage media as part of a circuit design system.

Abstract: An integrated circuit (IC) including a warranty and enforcement system, and a related design structure and HDL design structure are disclosed. In one embodiment, an IC includes a parameter obtainer for obtaining a value of a parameter of the IC; a warranty data storage system for storing warranty limit data regarding the IC; a comparator for determining whether a warranty limit has been exceeded by comparing the value of the parameter to a corresponding warranty limit; and an action taker for taking a prescribed action in response to the warranty limit being exceeded.

Abstract: Structures and methods are provided for performing non-destructive and secure disablement of integrated circuit (IC) functionality. A structure for enabling non-destructive and secure disablement and re-enablement of the IC includes a micro-electrical mechanical structure (MEMS) initially set to a chip enable state. The structure also includes an activation circuit operable to set the MEMS device to an error state based on a detected predetermined condition of the IC. The IC is disabled when the MEMS device is in the error state.

Abstract: A method configures a plurality of circuit elements for execution of an application in a first configuration. The method monitors the execution of the application on the plurality of circuit elements to produce monitoring information, using a computerized device, and stores the monitoring information in a storage structure. The method selectively communicates the monitoring information to an external element separate from the computerized device. The external element transforms the first configuration into a second configuration based on the monitoring information. The computerized device receives the second configuration from the external element and reconfigures the plurality of elements into the second configuration.

Abstract: Systems and methods for selectively utilizing secondary power sources during peak power times are provided for. The method includes receiving a notification of a peak power time, and discontinuing use of a primary power supply and beginning use of a secondary power supply based upon the notification.

Abstract: The invention generally relates to the utilization of electric power, and more particularly to systems and methods for selectively utilizing secondary power sources during peak power times. A method includes receiving a notification of a peak power time, and discontinuing use of a primary power supply and beginning use of a secondary power supply based upon the notification.

Abstract: Disclosed are embodiments of on-chip identification circuitry. In one embodiment, pairs of conductors (e.g., metal pads, vias, lines) are formed within one or more metallization layers. The distance between the conductors in each pair is predetermined so that, given known across chip line variations, there is a random chance (i.e., an approximately 50/50 chance) of a short. In another embodiment different masks form first conductors (e.g., metal lines separated by varying distances and having different widths) and second conductors (e.g., metal vias separated by varying distances and having equal widths). The first and second conductors alternate across the chip. Due to the different separation distances and widths of the first conductors, the different separation distances of the second conductors and, random mask alignment variations, each first conductor can short to up to two second conductors.

Abstract: Structures and methods are provided for performing non-destructive and secure disablement of integrated circuit (IC) functionality. A structure for enabling non-destructive and secure disablement and re-enablement of the IC includes a micro-electrical mechanical structure (MEMS) initially set to a chip enable state. The structure also includes an activation circuit operable to set the MEMS device to an error state based on a detected predetermined condition of the IC. The IC is disabled when the MEMS device is in the error state.

Abstract: A MEMS component is monitored to determine its status. Sensors are deployed to sense the MEMS component and produce detection signals that are analyzed to determine the MEMS component state. An indicator device alerts a user of the status, particularly if the MEMS component has failed. Additionally, the MEMS component monitoring system may be practiced as a design structure encoded on computer readable storage media as part of a circuit design system.

Abstract: Method for correcting timing failures in an integrated circuit and device for monitoring an integrated circuit. The method includes placing a first and second latch near a critical path. The first latch has an input comprising a data value on the critical path. The method further includes generating a delayed data value from the data value, latching the delayed data value in the second latch, comparing the data value with the delayed data value to determine whether the critical path comprises a timing failure condition, and executing a predetermined corrective measure for the critical path. The invention is also directed to a design structure on which a circuit resides.

Abstract: A circuit that selectively connects an integrated circuit to elements external to the integrated circuits. The circuit includes an input/output element that selectively connects an input/output pin as a function of a power requirement or a signal bandwidth requirement of the integrated circuit. The input/output element includes one or more switching devices that connect the input/output pin to an external element, such as a power supply or external signal path. The input/output element also includes one or more switching devices that connect the input/output pin to an internal element, such as a power network or internal signal line.

Abstract: Disclosed are a power management system and associated method that not only initiate a “greenout” to avoid the negative impact of high loads (i.e., to avoid high power cost, negative environmental impact, brownouts, and ultimately blackouts), but can also predict the initiation of such a “greenout”. Predicting the initiation of a “greenout” and communicating the prediction to one or more of the various electronic devices connected to the power grid allows the electronic device(s) to take preparatory action to avoid and/or limit any negative impact that may be caused by the “greenout”.