Abstract: A semiconductor component and a method for manufacturing such a semiconductor component which has a resistance behavior which depends heavily on the temperature. This resistance behavior is obtained by a special multi-layer structure of the semiconductor component, one layer being designed in such a way that, for example, multiple p-doped regions are present in an n-doped region, said regions being short-circuited on one side via a metal-plated layer. For example, the semiconductor component may be used for reducing current peaks, by being integrated into a conductor. In the cold state, the semiconductor component has a high resistance which becomes significantly lower when the semiconductor component is heated as a result of the flowing current.

Abstract: An apparatus for securing a small item to clothing includes an elongated pin being needle slim, having a hook end and a free end. A mechanism at the hook end of the elongated pin is for mounting the elongated pin to the small item, whereby the elongated pin can be retained to the clothing for holding and hiding the small item thereto. The length of the elongated pin 116 is from three to five times the length of the mounting mechanism.

Abstract: An airborne plow is provided for destroying unwanted vegetation and for clearing mines which includes an elongated arm. A mechanism on the elongated arm is for engaging with the unwanted vegetation. Another mechanism is for suspending the elongated arm from the underside of a helicopter or a slow flying object. The helicopter can maneuver the elongated arm, so that the engaging mechanism can plow the unwanted vegetation, opium plant and the unwanted mines.

Abstract: Electric motor (10), in particular for adjusting moving parts in a motor vehicle, comprising an electronic unit (70) with a sandwich construction, which contains a first electrically conductive substrate (71) and a second electric conductive substrate (72), between which power components are located and electrically connected to both substrates (71, 72), and a side (84) of the second substrate (72) facing away from the first substrate (71) is equipped with additional electronic components (56), wherein the first substrate (71) is embodied as a punched grid (44), which together with the second substrate (72) is extrusion coated with a plastic body (95) in such a way that the extensions (97) of the punched grid (44) protrude from the plastic body (95), forming an electrical and/or mechanical interface (98) for connecting additional motor components (99, 38, 40, 104, 102, 80).

Abstract: An electrical component, e.g., a press-in diode, is provided, which is suited for high currents and which ensures reverse-polarity protection. The electrical component includes at least one chip which is connected via soldering layers to a lead wire and a base. In the event of a rising temperature caused by polarity reversal, the clamp-type connection between the individual parts of the electrical component, e.g., the lead wire and the base, is released since the connecting plastic sheath softens, resulting in the release of the clamp-type connection, thereby interrupting the electrical connection and thus a current flow. At normal operating temperature, the clamp-type connection between the individual parts of the diode is ensured via a plastic sheath and a plastic sleeve, with bulges of the lead wire and the base protruding into the plastic sheath, thereby making the connection particularly stable.

Abstract: A semiconductor component and a method for manufacturing such a semiconductor component which has a resistance behavior which depends heavily on the temperature. This resistance behavior is obtained by a special multi-layer structure of the semiconductor component, one layer being designed in such a way that, for example, multiple p-doped regions are present in an n-doped region, said regions being short-circuited on one side via a metal-plated layer. For example, the semiconductor component may be used for reducing current peaks, by being integrated into a conductor. In the cold state, the semiconductor component has a high resistance which becomes significantly lower when the semiconductor component is heated as a result of the flowing current.

Abstract: Electric motor (10), in particular for adjusting moving parts in a motor vehicle, comprising an electronic unit (70) with a sandwich construction, which contains a first electrically conductive substrate (71) and a second electric conductive substrate (72), between which power components are located and electrically connected to both substrates (71, 72), and a side (84) of the second substrate (72) facing away from the first substrate (71) is equipped with additional electronic components (56), wherein the first substrate (71) is embodied as a punched grid (44), which together with the second substrate (72) is extrusion coated with a plastic body (95) in such a way that the extensions (97) of the punched grid (44) protrude from the plastic body (95), forming an electrical and/or mechanical interface (98) for connecting additional motor components (99, 38, 40, 104, 102, 80).

Abstract: A converter module is described having a positive terminal (2), a negative terminal (4), and a phase terminal (3), as well as a first semiconductor chip (9) and a second semiconductor chip (9), the terminals (2-4) and the semiconductor chips (9) being situated on top of one another in a stack. A particularly simple and cost-effective converter module may produced in that the positive terminal (2), the negative terminal (4), or the phase terminal (3) are made up of a contact plate (5), including a bar-shaped terminal lug (6) which is positioned asymmetrically on the contact plate (5), and an auxiliary element (7) is provided at its end which prevents the terminal (2-4) from tilting.

Abstract: System and method for detecting defects on a sample such as a lithography mask blank or a semiconductor substrate. The con-focal imaging system uses dual beam interference to enhance signal contrast from a light scattering defect on a sample surface. An incoming light beam is split into a probe beam and a reference beam. Destructive interference between the probe beam and the reference beam is established by moving a movable portion of a mirror system, to tune the system. The system is then used to detect defects on the surface of the sample, wherein intensity detected by a detector indicates the presence of a defect on the sample. Destructive interference is used to cancel out and eliminate the directly reflected light, without blocking out the scattered light, resulting in a detection signal that is more sensitive to scattered light than conventional con-focal microscopes.

Abstract: A method is proposed for fastening at least one electrical component to a substrate using solder, in which elevations are produced in the solder substrate, the elevations being at least as high as the thickness of a solder layer to be produced. In another step, the solder is laid upon the elevations, and in a further step, the elevations are pressed down until they have reached approximately the height of the solder, so that a soldering procedure may follow. The method is used for producing exactly specified thicknesses of solder layers having tolerances less than 10 micrometers.

Abstract: An electrical component, e.g., a press-in diode, is provided, which is suited for high currents and which ensures reverse-polarity protection. The electrical component includes at least one chip which is connected via soldering layers to a lead wire and a base. In the event of a rising temperature caused by polarity reversal, the clamp-type connection between the individual parts of the electrical component, e.g., the lead wire and the base, is released since the connecting plastic sheath softens, resulting in the release of the clamp-type connection, thereby interrupting the electrical connection and thus a current flow. At normal operating temperature, the clamp-type connection between the individual parts of the diode is ensured via a plastic sheath and a plastic sleeve, with bulges of the lead wire and the base protruding into the plastic sheath, thereby making the connection particularly stable.

Abstract: The invention relates to an electrical machine, preferably a rotary-current generator (10) for motor vehicles, having a rectifier unit (11) on a bearing plate (23) of the machine, in which bearing plate a rotating fan (28) is disposed; the rectifier unit is secured in heat-conducting fashion to a heat-conducting annular portion (23a) of the bearing plate (23), and the annular portion surrounds a region (23b) of the bearing plate (23) that is provided with openings (27) through which the cooling air aspirated by the fan (28) flows. The negative and positive diodes of each diode bridge of the rectifier unit are disposed, with an input-side connection part inserted between them, between a common positive and negative connection plate (15, 17) and with them forms the rectifier unit.

Abstract: The invention relates to an electrical machine, preferably an alternator (10) for motor vehicles, comprising a rectifier assembly (11a) that is fixed to an end shield (23) of the machine. Said rectifier assembly is cooled by a fan (27) that operates in the end shield (23), the diodes being positioned on a negative connecting plate (15) and a positive connecting plate (17) of the rectifier assembly (11). The aim of the invention is to evacuate the dissipated heat from the rectifier assembly (11a) in an advantageous manner. To achieve this, the rectifier assembly is located in an opening in the front face (32) of the end shield (23) and is connected in an electrically and thermally conductive manner by one of its two connecting plates (15 and 17) to a cooling body (33), which is connected to the exterior of the end shield (23) and covers the opening (32).

Abstract: A power converter having at least two semiconductor substrates is provided. Each of the substrates has at least two contact surfaces, and the converter also has two thermally conductive mounting plates carrying the semiconductor substrates, which each have an electrical terminal, an attachment arrangement implemented on one of the mounting plates, and having at least one third electrical terminal, which is distinguished in that the mounting plates and the semiconductor substrates form stacks, the mounting plates receiving the semiconductor substrates between themselves, and an electrically and thermally conductive insert, which has at least the third terminal, is arranged between the semiconductor substrates.

Abstract: The invention relates to an electrical machine, preferably an alternator (10) for motor vehicles, comprising a rectifier assembly (11a) that is fixed to an end shield (23) of the machine. Said rectifier assembly is cooled by a fan (27) that operates in the end shield (23), the diodes being positioned on a negative connecting plate (15) and a positive connecting plate (17) of the rectifier assembly (11). The aim of the invention is to evacuate the dissipated heat from the rectifier assembly (11a) in an advantageous manner. To achieve this, the rectifier assembly is located in an opening in the front face (32) of the end shield (23) and is connected in an electrically and thermally conductive manner by one of its two connecting plates (15 and 17) to a cooling body (33), which is connected to the exterior of the end shield (23) and covers the opening (32).

Abstract: Disclosed in a power semiconductor module which includes a stack of carrier substrates, disposed one above the other in multiple layers and provided with at least one conductor track on at least one main surface, in which at least one electronic semiconductor component is disposed between two adjacent carrier substrates of the stack and is contacted electrically and heat-conductively to at least one conductor track of a carrier substrate disposed in the stack above the semiconductor component and to at least one further conductor track of a carrier substrate disposed in the stack below the semiconductor component. To both improve heat output and provide a compact design, the two outer carrier substrates of the stack are embodied as one upper and one lower housing wall of a closed housing part surrounding the at least one semiconductor component, and the interstices between the stacked carrier substrates are tightly closed by an encompassing wall secured to the carrier substrates.

Abstract: A method is proposed for fastening at least one electrical component to a substrate using solder, in which elevations are produced in the solder substrate, the elevations being at least as high as the thickness of a solder layer to be produced, in a further step the solder, especially a solder foil, is laid upon the elevations, and in a further step, the elevations are pressed down until they have reached approximately the height of the solder, so that a soldering procedure may follow. The method is used for producing exactly specified thicknesses of solder layers having tolerances less than 10 micrometer.

Abstract: A power converter (1) is described having at least two semiconductor substrates (15), each of which has at least two contact surfaces (16, 17), two thermally conductive mounting plates (11, 12), carrying the semiconductor substrates (15), which each have an electrical terminal (B+, B−), an attachment means (22) implemented on one of the mounting plates (11, 12), and having at least one third electrical terminal (U, V, W), which is distinguished in that the mounting plates (11, 12) and the semiconductor substrates (15) form stacks (20), the mounting plates (11, 12) receive the semiconductor substrates (15) between themselves, and an electrically and thermally conductive insert (18), which has at least the third terminal (U, V, W), is arranged between the semiconductor substrates (15).

Abstract: The present invention provides a heterogeneous catalyst based on silicon dioxide, as well as, a method for manufacturing same. The catalyst of the present invention is constructed from a porous material produced from large-surface glass bodies containing catalytically active additives by leaching with mineral acid and the additives are incorporated into the network of the glass body in the form of metal oxides insoluble in hot mineral acid. The catalyst exhibits a high active surface and is universally employable because it contains only a slight amount of undesired impurities, is highly reactive, and has a high structural stability up to about 1000.degree. C.

Abstract: The invention concerns a process for the manufacture of substrates from carbon-coated SiO.sub.2 fabric that can be used for large-surface silicon bodies, in which mineral materials or waste containing SiO.sub.2 are used as starting materials and a mixture of Al.sub.2 O.sub.3 and oxides of the alkaline and/or alkaline earth metals is used as a flux for the transformation into the glass phase. The glass fibers made from the homogenous glass melt are processed into a glass fabric, which is then subjected to an acid leaching process and coated with carbon. The process is used for the low-cost production of substrates for silicon bodies that are manufactured according to the strip-coating process for use in solar cells.