Patents by Inventor Peter Ursu

Peter Ursu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Test socket for semiconductor integrated circuits
    Patent number: 12210036
    Abstract: A test socket for an IC includes a socket body, a rotational contact, and an elastomer retainer. The socket body includes a top surface that faces the IC, and a bottom surface that faces a load board. The socket body defines a slot extending from the top surface to an aperture in the bottom surface. The rotational contact is positioned in the slot. The elastomer retainer captures the rotational contact in the socket body and includes a round section about which the rotational contact rotates. The elastomer retainer compresses under translatory force from the rotational contact when translating from the free state to the pre-load state upon engagement with the load board, and compresses under rotational force from the rotational contact when rotating from the pre-load state to the loaded state upon engagement with the IC.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: January 28, 2025
    Assignee: Smiths Interconnect Americas, Inc.
    Inventors: Peter Ursu, Jiachun Zhou, Siang Soh, Justin Bahaj
  • TEST SOCKET FOR SEMICONDUCTOR INTEGRATED CIRCUITS
    Publication number: 20230143660
    Abstract: A test socket for an IC includes a socket body, a rotational contact, and an elastomer retainer. The socket body includes a top surface that faces the IC, and a bottom surface that faces a load board. The socket body defines a slot extending from the top surface to an aperture in the bottom surface. The rotational contact is positioned in the slot. The elastomer retainer captures the rotational contact in the socket body and includes a round section about which the rotational contact rotates. The elastomer retainer compresses under translatory force from the rotational contact when translating from the free state to the pre-load state upon engagement with the load board, and compresses under rotational force from the rotational contact when rotating from the pre-load state to the loaded state upon engagement with the IC.
    Type: Application
    Filed: April 6, 2021
    Publication date: May 11, 2023
    Inventors: Peter Ursu, Jiachun Zhou, Siang Soh, Justin Bahaj