Abstract: The invention relates to a semiconductor device for surface mounting with a substrate carrier having a surface provided with a groove with walls on which conductor tracks are present, which conductor tracks continue on the surface of the substrate carrier and form connection conductors of the device which is provided with a semiconductor element arranged in the groove with its main surface parallel to a wall which semiconductor element makes electrical contact with the conductor tracks on the wall, while the groove is filled with a protective material and the substrate carrier is provided with a side wall interconnecting mutually opposed walls of the groove on either side of the semiconductor element.

Abstract: A semiconductor device comprising a support (1) provided with a groove (2) having walls (3 and 4), on which conductors (6 and 7) are present, which conductors extend at least partially around the support (1), and with a semiconductor element (11) which is present in the groove and makes electrical contact with the conductors on the walls. The semiconductor element (11) is clamped in the groove (2), thus making electrical contact with conductors (6 and 7) on walls (3 and 4). Since the semiconductor element (11) is held clamped-in between the conductors (6 and 7) on the walls (3 and 4), it is achieved that both a mechanical and an electrical connection is realized between semiconductor element (11) and support (1) in a single process step and in a simple manner.

Abstract: A semiconductor laser device includes a support having a substantially annular assembly block of a metal having a good thermal conductivity, which assembly block includes positioning means on its outer circumference for accurately locating the optical axis of said laser element and a sector-shaped supporting part which extends towards the center line of the block and which has a connection and mounting face for a laser element extending through the center line and accurately located with respect to the positioning means. A base includes mutually-insulated electrical conductors and a photodiode which is secured on the side of the assembly block remote from the supporting part, and a cap having a light-transmitting window is secured to the assembly block so as to form a hermetic envelope.