Patents by Inventor Peter W. Robinson
Peter W. Robinson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140014239Abstract: A process for manufacturing copper-nickel-silicon alloys includes the sequential steps of casting the copper alloy; hot working the cast copper-base alloy to effect a first reduction in cross-sectional area; solutionizing the cast copper-base alloy at a temperature and for a time effective to substantially form a single phase alloy; first age annealing the alloy at a temperature and for a time effective to precipitate an amount of a second phase effective to form a multi-phase alloy having silicides; cold working the multi-phase alloy to effect a second reduction in cross-sectional area; and second age annealing the multiphase alloy at a temperature and for a time effective to precipitate additional silicides thereby raising conductivity, wherein the second age annealing temperature is less than the first age annealing temperature.Type: ApplicationFiled: April 17, 2013Publication date: January 16, 2014Applicants: Wieland-Werke AG, GBC Metals, LLCInventors: Frank N. Mandigo, Peter W. Robinson, Derek E. Tyler, Andreas Boegel, Hans-Achim Kuhn, Frank M. Keppeler, Joerg Seeger
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Patent number: 8430979Abstract: A copper alloy having an improved combination of yield strength and electrical conductivity contains, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ratio of (Ni+Co)/Si of between 3.5 and 6, and the balance copper and inevitable impurities wherein the wrought copper alloy has an electrical conductivity in excess of 40% IACS. A further increase in the combination of yield strength and electrical conductivity as well as enhanced resistance to stress relaxation is obtained by a further inclusion of up to 1% of silver.Type: GrantFiled: October 26, 2006Date of Patent: April 30, 2013Assignee: GBC Metals, LLCInventors: Frank N. Mandigo, Peter W. Robinson, Derek E. Tyler, Andreas Boegel, Hans-Achim Kuhn, Frank M. Keppeler, Joerg Seeger
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Patent number: 8257515Abstract: A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ratio of (Ni+Co)/Si of between 3.5 and 6, and the balance copper and inevitable impurities wherein the wrought copper alloy has an electrical conductivity in excess of 40% IACS. A further increase in the combination of yield strength and electrical conductivity as well as enhanced resistance to stress relaxation is obtained by a further inclusion of up 1% of silver. A process to manufacture the alloys of the invention as well as other copper-nickel-silicon alloys includes the sequential steps of (a). casting the copper alloy; (b). hot working the cast copper-base alloy to effect a first reduction in cross-sectional area; (c).Type: GrantFiled: October 7, 2005Date of Patent: September 4, 2012Assignees: GBC Metals, LLC, Wieland-Werke, AGInventors: Frank N. Mandigo, Peter W. Robinson, Derek E. Tyler, Andreas Boegel, Hans-Achim Kuhn, Frank M. Keppeler, Joerg Seeger
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Patent number: 7891299Abstract: A frangible projectile for expelling from an industrial ballistic tool may be formed by a powder metallurgy process. A preferred embodiment of slug consists essentially of compacted and optionally sintered material and comprises up to 35% ferrotungsten in particulate form, up to 3% lubricant, and the balance iron in particulate form with inevitable impurities.Type: GrantFiled: February 12, 2008Date of Patent: February 22, 2011Assignee: Olin CorporationInventors: Peter W. Robinson, Jack D. Dippold
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Publication number: 20110017050Abstract: A frangible projectile for expelling from an industrial ballistic tool may be formed by a powder metallurgy process. A preferred embodiment of slug consists essentially of compacted and optionally sintered material and comprises up to 35% ferrotungsten in particulate form, up to 3% lubricant, and the balance iron in particulate form with inevitable impurities.Type: ApplicationFiled: February 12, 2008Publication date: January 27, 2011Inventors: Peter W. Robinson, Jack D. Dippold
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Publication number: 20090017327Abstract: A coated electrically conductive substrate has particular utility where there are multiple closely spaced leads and tin whiskers constitute a potential short circuit. Such substrates include leadframes, terminal pins and circuit traces such as on printed circuit boards and flexible circuits. This electrically conductive substrate has a plurality of leads separated by a distance capable of bridging by a tin whisker, a silver or silver-base alloy layer coating at least one surface of at least one of the plurality of leads, and a fine grain tin or tin-base alloy layer directly coating said silver layer. An alternative coated electrically conductive substrate has particular utility where debris from fretting wear may oxidize and increase electrical resistivity, such an in a connector assembly. This electrically conductive substrate has a barrier layer deposited on the substrate that is effective to inhibit diffusion of constituents the substrate into a plurality of subsequently deposited layers.Type: ApplicationFiled: June 24, 2008Publication date: January 15, 2009Inventors: Szuchain F. Chen, Nicole A. Lasiuk, John E. Gerfen, Peter W. Robinson, Abid A. Khan
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Patent number: 7391116Abstract: A coated electrically conductive substrate has particular utility where there are multiple closely spaced leads and tin whiskers constitute a potential short circuit. This electrically conductive substrate has a plurality of leads separated by a distance capable of bridging by a tin whisker, a silver or silver-base alloy layer coating at least one surface of at least one of the plurality of leads, and a fine grain tin or tin-base alloy layer directly coating said silver layer. An alternative coated electrically conductive substrate has utility where debris from fretting wear may increase electrical resistivity. This electrically conductive substrate has a barrier layer deposited on the substrate that is effective to inhibit diffusion of the substrate into a subsequently deposited layers, which include a sacrificial layer deposited on the barrier layer that is effective to form intermetallic compounds with tin, and a low resistivity oxide metal layer deposited on the sacrificial layer.Type: GrantFiled: October 12, 2004Date of Patent: June 24, 2008Assignee: GBC Metals, LLCInventors: Szuchain F. Chen, Nicole A. Lasiuk, John E. Gerfen, Peter W. Robinson, Abid A. Khan
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Patent number: 7328658Abstract: A frangible projectile for expelling from an industrial ballistic tool may be formed by a powder metallurgy process. A preferred embodiment of slug consists essentially of compacted and optionally sintered material and comprises up to 35% ferrotungsten in particulate form, up to 3% lubricant, and the balance iron in particulate form with inevitable impurities.Type: GrantFiled: January 9, 2007Date of Patent: February 12, 2008Assignee: Olin CorporationInventors: Peter W. Robinson, Jack D. Dippold
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Patent number: 7182823Abstract: A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, from 0.5% to 1.5% of silicon, and the balance is copper and inevitable impurities. Further, the total nickel plus cobalt content is from 1.7% to 4.3%, the ratio of nickel to cobalt is from 1.01:1 to 2.6:1, the amount of (Ni+Co)/Si is between 3.5 and 6, the electrical conductivity is in excess of 40% IACS and the yield strength is in excess of 95 ksi. An optional inclusion is up 1% of silver. A process to manufacture the alloy includes the sequential steps of (a). casting; (b). hot working; (c). solutionizing; (d). first age annealing; (e). cold working; and (f). second age annealing wherein the second age annealing temperature is less than the first age annealing temperature.Type: GrantFiled: June 30, 2003Date of Patent: February 27, 2007Assignee: Olin CorporationInventors: Frank N. Mandigo, Peter W. Robinson, Derek E. Tyler, Andreas Boegel, Hans-Achim Kuhn, Frank M. Keppeler, Joerg Seeger
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Patent number: 7159519Abstract: A frangible projectile for expelling from an industrial ballistic tool may be formed by a powder metallurgy process. A preferred embodiment of slug consists essentially of compacted and optionally sintered material and comprises up to 35% ferrotungsten in particulate form, up to 3% lubricant, and the balance iron in particulate form with inevitable impurities.Type: GrantFiled: September 2, 2003Date of Patent: January 9, 2007Assignee: Olin CorporationInventors: Peter W. Robinson, Jack D. Dippold
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Publication number: 20040211292Abstract: A relatively high carbon, water-atomized, steel shot is softened via annealing to render it suitable for ballistic use. The annealing preferably includes decarburization from a surface layer or throughout and preferably provides the shot with a surface Knoop hardness of less than 250.Type: ApplicationFiled: May 17, 2004Publication date: October 28, 2004Applicant: Olin Corporation, a Company of the State of Illinois.Inventors: Morris C. Buenemann, Jack D. Dippold, Brian Mravic, Howard Muldrow, Peter W. Robinson
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Publication number: 20040200340Abstract: A frangible projectile for expelling from an industrial ballistic tool may be formed by a powder metallurgy process. A preferred embodiment of slug consists essentially of compacted and optionally sintered material and comprises up to 35% ferrotungsten in particulate form, up to 3% lubricant, and the balance iron in particulate form with inevitable impurities.Type: ApplicationFiled: September 2, 2003Publication date: October 14, 2004Inventors: Peter W. Robinson, Jack D. Dippold
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Publication number: 20040166017Abstract: An age-hardening copper-base alloy and processing method to make a commercially useful strip product for applications requiring high yield strength and moderately high electrical conductivity, in a strip, plate, wire, foil, tube, powder or cast form. The alloys are particularly suited for use in electrical connectors and interconnections. The alloys contain Cu—Ti—X where X is selected from Ni, Fe, Sn, P, Al, Zn, Si, Pb, Be, Mn, Mg, Ag, As, Sb, Zr, B, Cr and Co. and combinations thereof. The alloys offer excellent combinations of yield strength, and electrical conductivity, with excellent stress relaxation resistance. The yield strength is at least of 105 ksi and the electrical conductivity is at least 50% IACS.Type: ApplicationFiled: September 5, 2003Publication date: August 26, 2004Applicants: Olin Corporation, Wieland-Werke AGInventors: Ronald N. Caron, Peter W. Robinson, Derek E. Tyler, Andreas Boegel, Doris Humpenoder-Bogel, Hans-Achim Kuhn, Joerg Seeger
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Patent number: 6749662Abstract: A relatively high carbon, water-atomized, steel shot is softened via annealing to render it suitable for ballistic use. The annealing preferably includes decarburization from a surface layer or throughout and preferably provides the shot with a surface Knoop hardness of less than 250.Type: GrantFiled: July 9, 2001Date of Patent: June 15, 2004Assignee: Olin CorporationInventors: Morris C Bueneman, Jack D. Dippold, Brian Mravic, Howard Muldrow, Peter W. Robinson
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Publication number: 20040079456Abstract: A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ratio of (Ni+Co)/Si of between 3.5 and 6, and the balance copper and inevitable impurities wherein the wrought copper alloy has an electrical conductivity in excess of 40% IACS. A further increase in the combination of yield strength and electrical conductivity as well as enhanced resistance to stress relaxation is obtained by a further inclusion of up 1% of silver.Type: ApplicationFiled: June 30, 2003Publication date: April 29, 2004Applicants: Onlin Corporation, Wieland Werke A.G.Inventors: Frank N. Mandigo, Peter W. Robinson, Derek E. Tyler, Andreas Boegel, Hans-Achim Kuhn, Frank M. Keppeler, Joerg Seeger
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Patent number: 6640724Abstract: A frangible projectile for expelling from an industrial ballistic tool may be formed by a powder metallurgy process. A preferred embodiment of slug consists essentially of compacted and optionally sintered material and comprises up to 35% ferrotungsten in particulate form, up to 3% lubricant, and the balance iron in particulate form with inevitable impurities.Type: GrantFiled: August 4, 1999Date of Patent: November 4, 2003Assignee: Olin CorporationInventors: Peter W. Robinson, Jack D. Dippold
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Patent number: 6632300Abstract: A copper alloy having improved stress relaxation resistance is formed from a copper base alloy that consists, by weight, essentially of 1.8%-3.0% iron, 0.01%-1.0% zinc, 0.001 %-0.25% phosphorus, 0.1 %-0.35% magnesium and the balance is copper and unavoidable impurities. When compared to other copper base alloys that include iron, zinc and phosphorous, the disclosed alloy has improved resistance to stress relaxation. In addition, directionality of stress relaxation resistance (where stress relaxation resistance is typically poorer in a transverse strip direction relative to a longitudinal strip direction for a copper alloy that is strengthened by cold rolling) is reduced to being nearly equivalent, regardless of strip direction. The alloy is particularly useful for electronic applications, such as being formed into an electrical connectors.Type: GrantFiled: June 12, 2001Date of Patent: October 14, 2003Assignee: Olin CorporationInventors: John F. Breedis, Dennis R. Brauer, Peter W. Robinson
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Publication number: 20020044881Abstract: A copper alloy having improved stress relaxation resistance is formed from a copper base alloy that consists, by weight, essentially of 1.8%-3.0% iron, 0.01%-1.0% zinc, 0.001 %-0.25% phosphorus, 0.1 %-0.35% magnesium and the balance is copper and unavoidable impurities. When compared to other copper base alloys that include iron, zinc and phosphorous, the disclosed alloy has improved resistance to stress relaxation. In addition, directionality of stress relaxation resistance (where stress relaxation resistance is typically poorer in a transverse strip direction relative to a longitudinal strip direction for a copper alloy that is strengthened by cold rolling) is reduced to being nearly equivalent, regardless of strip direction. The alloy is particularly useful for electronic applications, such as being formed into an electrical connectors.Type: ApplicationFiled: June 12, 2001Publication date: April 18, 2002Applicant: OLIN CORPORATIONInventors: John F. Breedis, Dennis R. Brauer, Peter W. Robinson
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Publication number: 20020026967Abstract: A relatively high carbon, water-atomized, steel shot is softened via annealing to render it suitable for ballistic use. The annealing preferably includes decarburization from a surface layer or throughout and preferably provides the shot with a surface Knoop hardness of less than 250.Type: ApplicationFiled: July 9, 2001Publication date: March 7, 2002Applicant: Olin CorporationInventors: Morris C. Buenemann, Jack D. Dippold, Brian Mravic, Howard Muldrow, Peter W. Robinson
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Patent number: 6258316Abstract: A relatively high carbon, water-atomized, steel shot is softened via annealing to render it suitable for ballistic use. The annealing preferably includes decarburization from a surface layer or throughout and preferably provides the shot with a surface Knoop hardness of less than 250.Type: GrantFiled: June 10, 1999Date of Patent: July 10, 2001Assignee: Olin CorporationInventors: Morris C. Buenemann, Jr., Jack D. Dippold, Howard Muldrow, Peter W. Robinson, Brian Mravic