Patents by Inventor Peter W. Wyatt

Peter W. Wyatt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wide band and radio frequency waveguide and hybrid integration in a silicon package
    Patent number: 8587106
    Abstract: A device includes a device wafer having a circuit component formed thereon and having vias formed therein and a cap wafer bonded to the device wafer. The cap wafer has a cavity therein. The cavity has a post formed therein, and the post is positioned to mechanically support the vias formed in the device wafer. The cavity has a volume, the volume substantially enclosing the circuit component formed on the device wafer. The cavity has a width and height such that an impedance of a transmission line is dependent upon the width and height of the cavity, or the impedance of a transmission line is dependent upon the width of a center conductor within the cavity.
    Type: Grant
    Filed: June 11, 2007
    Date of Patent: November 19, 2013
    Assignee: Massachusetts Institute of Technology
    Inventors: Carl O. Bozler, Jeremy Muldavin, Peter W. Wyatt, Craig L. Keast, Steven Rabe
  • WIDE BAND AND RADIO FREQUENCY WAVEGUIDE AND HYBRID INTEGRATION IN A SILICON PACKAGE
    Publication number: 20100019872
    Abstract: A device includes a device wafer having a circuit component formed thereon and having vias formed therein and a cap wafer bonded to the device wafer. The cap wafer has a cavity therein. The cavity has a post formed therein, and the post is positioned to mechanically support the vias formed in the device wafer. The cavity has a volume, the volume substantially enclosing the circuit component formed on the device wafer. The cavity has a width and height such that an impedance of a transmission line is dependent upon the width and height of the cavity, or the impedance of a transmission line is dependent upon the width of a center conductor within the cavity.
    Type: Application
    Filed: June 11, 2007
    Publication date: January 28, 2010
    Inventors: Carl O. Bozler, Jeremy Muldavin, Peter W. Wyatt, Craig L. Keast, Steven Rabe
  • Voltage programmable links for integrated circuits
    Patent number: 5641703
    Abstract: Methods and systems are discussed for fabricating electrically programmable link structures by fabricating a first metal conductor of a refractory conductive material, composite, or an aluminum alloy which has been modified with a refractory material, then fabricating an insulating link material over the first conductor, and subsequently, depositing a second conductor over the link material. In use, an electrical path can be formed between the first and second conductors by applying a voltage between such conductors across at least one selected region of the insulator, such that the insulating link material is transformed in the region and rendered conductive to form an electrical signal path.
    Type: Grant
    Filed: April 28, 1995
    Date of Patent: June 24, 1997
    Assignee: Massachusetts Institute of Technology
    Inventors: Simon S. Cohen, Jack I. Raffel, Peter W. Wyatt