Abstract: The invention relates to synergistic mixtures of o-phenylphenol with other microbicidally active compounds, such as bronopol (2-bromo-2-nitro-1,3-propanedial), 2-methyl-2H-isothiazol-3-one, 1,2-dibromo-2,4-dicyanobutane.

Abstract: The invention relates to synergistic mixtures of o-phenylphenol with other microbicidally active compounds, such as bronopol (2-bromo-2-nitro-1,3-propanedial), 2-methyl-2H-isothiazol-3-one, 1,2-dibromo-2,4-dicyanobutane.

Abstract: A semiconductor device with a first (101) and a second (111) semiconductor chip assembled on an insulating flexible interposer (120). The interposer, preferably about 25 to 50 ?m thick, has conductive traces (121), a central planar rectangular area and on each side of the rectangle a wing bent at an angle from the central plane. The central area has metal studs (122, 123) on the top and the bottom surface, which match the terminals of the chips, further conductive vias of a pitch center-to-center about 50 ?m or less. The side wings have contact pads (130) with metallic connectors (131) on the bottom surface; the connectors may be solder balls, metal studs, or anisotropic conductive films. The second chip is adhesively attached to a substrate, whereby the interposer faces away from the substrate. The interposer side wings have a convex bending (150) downwardly along the second chip and a concave bending (151) over the substrate; the side wing connectors are attached to the matching substrate sites.

Abstract: A semiconductor device with a first (101) and a second (111) semiconductor chip assembled on an insulating flexible interposer (120). The interposer, preferably about 25 to 50 ?m thick, has conductive traces (121), a central planar rectangular area and on each side of the rectangle a wing bent at an angle from the central plane. The central area has metal studs (122, 123) on the top and the bottom surface, which match the terminals of the chips, further conductive vias of a pitch center-to-center about 50 ?m or less. The side wings have contact pads (130) with metallic connectors (131) on the bottom surface; the connectors may be solder balls, metal studs, or anisotropic conductive films. The second chip is adhesively attached to a substrate, whereby the interposer faces away from the substrate. The interposer side wings have a convex bending (150) downwardly along the second chip and a concave bending (151) over the substrate; the side wing connectors are attached to the matching substrate sites.

Abstract: A process flow employing a liquid cleaning agent (510) such as flux to penetrate the interface between the glassy coats (402) and the surface of metal (120) and to delaminate the coats from the metal, and then, at elevated temperatures, to use the agent's vapor pressure to break up the glassy coats into smaller pieces (403). The glassy coats are prevented by their low density to penetrate into the molten solder. Finally, at ambient temperature, the floating filler debris is water-washed and rinsed away. Cleaning agents include low-viscosity liquids (oils) and flux, which do not decompose at elevated temperatures and are mixed with components operable to provide, at the elevated temperatures, the fumes for sufficient vapor pressure to break up and dislodge the coats from the metal contacts.

Abstract: The present invention relates to storage-stable, synergistically acting combinations comprising glutaraldehyde (GDA) and 2-methyl-2H-isothiazol-3-one (methylisothiazolinone, MIT) and, where appropriate, 2-bromo-2-nitropropane-1,3-diol (bronopol) and/or other active substances for protecting industrials materials.

Abstract: The invention relates to synergistic mixtures of o-phenylphenol with other microbicidally active compounds, such as bronopol (2-bromo-2-nitro-1,3-propanedial), 2-methyl-2H-isothiazol-3-one, 1,2-dibromo-2,4-dicyanobutane.

Abstract: A semiconductor device with a first (101) and a second (111) semiconductor chip assembled on an insulating flexible interposer (120). The interposer, preferably about 25 to 50 ?m thick, has conductive traces (121), a central planar rectangular area and on each side of the rectangle a wing bent at an angle from the central plane. The central area has metal studs (122, 123) on the top and the bottom surface, which match the terminals of the chips, further conductive vias of a pitch center-to-center about 50 ?m or less. The side wings have contact pads (130) with metallic connectors (131) on the bottom surface; the connectors may be solder balls, metal studs, or anisotropic conductive films. The second chip is adhesively attached to a substrate, whereby the interposer faces away from the substrate. The interposer side wings have a convex bending (150) downwardly along the second chip and a concave bending (151) over the substrate; the side wing connectors are attached to the matching substrate sites.

Abstract: Aqueous formulations having a pH of >10 of 1,2-benzoisothiazolin-3-one (BIT) and/or its alkali metal salts and tetramethylolacetylenediurea (TMAD) are outstandingly suitable for protecting industrial materials and products from infection and destruction by microorganisms.

Abstract: The invention relates to novel biocidal active substance mixtures containing o-phenylphenol and amines, methods for the production thereof the use thereof for protecting technical materials and products from being infested and destroyed by microorganisms, and microbicidal agents based on said novel mixtures.

Abstract: The present invention relates to novel difluoromethylthiazolylcarboxanilides of the formula (I) in which R1, R2, R3, R4 and R5 are as defined in the disclosure, to a plurality of processes for preparing these substances and their use for controlling unwanted microorganisms, and to novel intermediates and their preparation.

Abstract: The invention relates to antimicrobially treated plasterboards which are treated with OPP in the gypsum core and may contain further biocidal components, either in the gypsum core or in one or both paper outer layers, for enhancing the effect.

Abstract: There are described the use of ?-(4-chlorophenyl)-?-(1-cyclopropylethyl)-1H-1,2,4-triazole-1-ethanol as a microbicide for the protection of industrial materials, and compositions containing this compound.

Abstract: The antimicrobially finished aqueous preparations of water-insoluble solids comprising 1,2-benzisothiazolin-3-one (BIT) and at least one further biocidally active compound are distinguished by rapid onset of action with good long-term action (even at low concentration of the biocide mixtures used) and good environmental compatibility.

Abstract: There are described the use of ?-(4-chlorophenyl)-?-(1-cyclopropylethyl)-1H-1,2,4-triazole-1-ethanol as a microbicide for the protection of industrial materials, and compositions containing this compound.

Abstract: The invention relates to antimicrobial, synergistically active mixtures of p-chloro-m-cresol (CMC) and/or its sodium or potassium salt and 2-methyl-2H-isothiazol-3-one (MIT)

Abstract: The novel and known thiazines and thiazoles of the formula (I) in which R1, R2 and n are as defined in the description, are highly suitable for use as biocides for protecting industrial materials.

Abstract: The novel compounds of the formula (I) in which R1 and R2 are as defined in the description are highly suitable for protecting industrial materials against attack and destruction by microorganisms.

Abstract: The novel 2-oxyamino-1-cyclopentene-1-nitriles of the formula (I) in which the substituents R1 and R2 are as defined in the description are highly suitable for protecting industrial materials against infestation and destruction by microorganisms.

Abstract: The invention relates to antimicrobial, synergistically active mixtures of 1,2-benzisothiazolinone (BIT) and tetramethylolacetylenediurea (TMAD).