Patents by Inventor Peter Wapenski

Peter Wapenski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7572131
    Abstract: An electrical interconnect system for providing electrical connection between two or more opposing arrays of contact areas, the electrical interconnect having a conductive substrate and conductors electrically isolated from the substrate.
    Type: Grant
    Filed: March 13, 2007
    Date of Patent: August 11, 2009
    Assignee: Tyco Electronics Corporation
    Inventors: Wayne S. Alden, III, Jeffery W. Mason, Peter Wapenski, Curtis G. Knaub
  • Patent number: 7549870
    Abstract: An electrical interconnect device includes a substrate having opposite outer surfaces and an array of conductive elastomeric columns held by the substrate. Each of the columns have opposite ends that extend beyond respective ones of the outer surfaces of the substrate. Conductive contact caps are disposed over the opposite ends of each said column. An electrical path is defined from one of the contact caps, through the conductive elastomeric column, to another of the contact caps. Optionally, the contact caps may be sized and shaped substantially similarly as the ends of the elastomeric columns. The contact caps may be adhered to the ends of the columns, or alternatively, the contact caps may be adhered to the substrate.
    Type: Grant
    Filed: January 3, 2007
    Date of Patent: June 23, 2009
    Assignee: Tyco Electronics Corporation
    Inventors: Jeffery W. Mason, Wayne Stewart Alden, III, Chuan Yue, Shiraz Sameja, Peter Wapenski, Vishwa N. Shukla, Edward MacPherson, Robert D. Hilty, George Chou
  • Patent number: 7448883
    Abstract: A socket connector includes an insulator having a plurality of apertures. A plurality of contacts are held by the insulator and arranged in groups. Each group includes plural contacts disposed around a periphery of a respective aperture. Each contact includes a polymer contact body having first and second opposite contact tips. A conductive coating extends on the contact body from the first contact tip to the second contact tip.
    Type: Grant
    Filed: February 5, 2007
    Date of Patent: November 11, 2008
    Assignee: Tyco Electronics Corporation
    Inventors: Wayne Stewart Alden, III, Jeffery W. Mason, Peter Wapenski
  • Publication number: 20080227307
    Abstract: An electrical interconnect system for providing electrical connection between two or more opposing arrays of contact areas, the electrical interconnect having a conductive substrate and conductors electrically isolated from the substrate.
    Type: Application
    Filed: March 13, 2007
    Publication date: September 18, 2008
    Applicant: Tyco Electronics Corporation
    Inventors: Wayne S. Alden, Jeffrey W. Mason, Peter Wapenski, Curtis G. Knaub
  • Publication number: 20080188127
    Abstract: A socket connector includes an insulator having a plurality of apertures. A plurality of contacts are held by the insulator and arranged in groups. Each group includes plural contacts disposed around a periphery of a respective aperture. Each contact includes a polymer contact body having first and second opposite contact tips. A conductive coating extends on the contact body from the first contact tip to the second contact tip.
    Type: Application
    Filed: February 5, 2007
    Publication date: August 7, 2008
    Inventors: Wayne Stewart Alden, Jeffery W. Mason, Peter Wapenski
  • Publication number: 20080160794
    Abstract: An electrical interconnect device includes a substrate having opposite outer surfaces and an array of conductive elastomeric columns held by the substrate. Each of the columns have opposite ends that extend beyond respective ones of the outer surfaces of the substrate. Conductive contact caps are disposed over the opposite ends of each said column. An electrical path is defined from one of the contact caps, through the conductive elastomeric column, to another of the contact caps. Optionally, the contact caps may be sized and shaped substantially similarly as the ends of the elastomeric columns. The contact caps may be adhered to the ends of the columns, or alternatively, the contact caps may be adhered to the substrate.
    Type: Application
    Filed: January 3, 2007
    Publication date: July 3, 2008
    Inventors: Jeffery W. Mason, Wayne Stewart Alden, Chuan Yue, Shiraz Sameja, Peter Wapenski, Vishwa N. Shukla, Edward MacPherson, Robert D. Hilty, George Chou
  • Patent number: 6434012
    Abstract: Interconnection apparatus is provided which is especially useful to mount and connect circuit boards having a contact assembly of resilient compressive contacts to a backplane or other mateable board or device. The apparatus includes an enclosure having guide channels for each board to be housed in the enclosure, a contact assembly for providing compressive contact between the contact ends of each board and corresponding contacts of the backplane, and elements for seating each board into engagement with the backplane.
    Type: Grant
    Filed: December 5, 2000
    Date of Patent: August 13, 2002
    Assignee: Tyco Electronics Logistics AG
    Inventors: Wayne S. Alden, William Petrocelli, Peter Wapenski, Arthur G. Michaud, Michael Kirkman, Jeffery Mason, Brian Paul Sharp
  • Publication number: 20010030854
    Abstract: Interconnection apparatus is provided which is especially useful to mount and connect circuit boards having a contact assembly of resilient compressive contacts to a backplane or other mateable board or device. The apparatus includes an enclosure having guide channels for each board to be housed in the enclosure, a contact assembly for providing compressive contact between the contact ends of each board and corresponding contacts of the backplane, and elements for seating each board into engagement with the backplane.
    Type: Application
    Filed: December 5, 2000
    Publication date: October 18, 2001
    Applicant: TYCO ELECTRONICS LOGISTICS AG
    Inventors: Wayne S. Alden, William Petrocelli, Peter Wapenski, Arthur G. Michaud, Michael Kirkman, Jeffery Mason, Brian Paul Sharp