Abstract: A method, system and apparatus for routing of data transmitted from a mobile electronic device to a first host of a plurality of hosts in a communication network using a Border Gateway Protocol (BGP) is provided. It is determined, at a network element having a same address as a first host of a plurality of network hosts, that the first host has failed via receipt of BGP (Border Gateway Protocol) rerouted data, the BGP rerouted data originally transmitted to the first host from a communication device. A negative acknowledgement (NACK), identifiable as having been transmitted by the network element, is transmitted to the communication device to trigger the communication device to transmit data that was to be transmitted to the first host to another of the plurality of network hosts.

Abstract: A method, system and apparatus for routing of data transmitted from a mobile electronic device to a first host of a plurality of hosts in a communication network using a Border Gateway Protocol (BGP) is provided. It is determined, at a network element having a same address as a first host of a plurality of network hosts, that the first host has failed via receipt of BGP (Border Gateway Protocol) rerouted data, the BGP rerouted data originally transmitted to the first host from a communication device. A negative acknowledgement (NACK), identifiable as having been transmitted by the network element, is transmitted to the communication device to trigger the communication device to transmit data that was to be transmitted to the first host to another of the plurality of network hosts.

Abstract: A method, system and apparatus for routing of data transmitted from a mobile electronic device to a first host of a plurality of hosts in a communication network using a Border Gateway Protocol (BGP) is provided. It is determined that the first host has failed via receipt of BGP rerouted data at least one network element, the BGP rerouted data originally intended for the first host. A negative acknowledgement (NACK) is transmitted to the mobile electronic device from the at least one network element, the NACK enabled to trigger the mobile electronic device to transmit data that was to be transmitted to the first host to another of the plurality of hosts and wherein the NACK is identifiable by the mobile electronic device as having been transmitted by the at least one network element.

Abstract: A method, system and apparatus for routing of data transmitted from a mobile electronic device to a first host of a plurality of hosts in a communication network using a Border Gateway Protocol (BGP) is provided. It is determined that the first host has failed via receipt of BGP rerouted data at least one network element, the BGP rerouted data originally intended for the first host. A negative acknowledgement (NACK) is transmitted to the mobile electronic device from the at least one network element, the NACK enabled to trigger the mobile electronic device to transmit data that was to be transmitted to the first host to another of the plurality of hosts and wherein the NACK is identifiable by the mobile electronic device as having been transmitted by the at least one network element.

Abstract: The use of a protective colloid-stabilized polymer is described, comprising a protective colloid and a polymer, for coating of a substrate, said coating being a double dot coating.

Abstract: Particulate materials are cold molded by preheating a binder and the material to be bound to a temperature of from 160 to 240° C., and then press molding at a temperature less than 80° C. and at a pressure of from 1 to 120 bar to give a molding, wherein the binder contains a polymer powder or aqueous polymer dispersion thereof, the polymer having a glass transition temperature Tg greater than 80° C. and a complex viscosity less than 15,000 Pa·s at 190° C., and derived from one or more comonomer units from the group of vinyl esters of optionally branched C1-18 alkylcarboxylic acids, (meth)acrylic esters of optionally branched C1-15 alcohols, dienes, olefins, vinylaromatics, and vinyl halides. The moldings exhibit excellent properties including resistance to sagging at elevated temperatures, and are recyclable.

Abstract: A process for reducing odor emission in aqueous polymer dispersions and in polymer powders comprises admixing an aqueous dispersion of a polymer obtained by free-radical polymerization of one or more ethylenically unsaturated monomers, after conclusion of the polymerization, with an odor-reducing composition containing a) one or more water-soluble compounds selected from metal salts of copper(II), silver, aluminum, zinc and iron(III), potassium permanganate, imidazoline, and imidazoline derivatives, optionally in combination with b) one or more water-soluble reducing agents selected from ascorbic acid, isoascorbic acid, iron(II) salts, zinc formaldehydesulfoxylate and alkali metal formaldehydesulfoxylate, and optionally drying the thus treated aqueous polymer dispersion to form a polymer powder.

Abstract: A process for reducing odor emission in aqueous polymer dispersions and in polymer powders comprises admixing an aqueous dispersion of a polymer obtained by free-radical polymerization of one or more ethylenically unsaturated monomers, after conclusion of the polymerization, with an odor-reducing composition containing

Abstract: Pulverulent compositions for binding particulates, comprise A) 10 to 99.99 parts of at least one pulverulent interpolymer having a glass transition temperature Tg or a melting temperature of ≧30° C. and containing units derived from a1) comonomer(s) of vinyl esters of optionally branched C1-18 alkylcarboxylic acids, (meth)acrylic esters of optionally branched C1-15 alcohols, dienes, olefins, vinyl aromatics or vinyl halides, and a2) from 0.1 to 50% by weight, based on the total comonomer weight, of ethylenically unsaturated functional comonomers; B) 0 to 89.99 parts by weight of a pulverulent compound which bears two or more functional groups capable of reacting with functional groups of interpolymer A); and C) 0.01 to 90 parts by weight of a melt viscosity depressant having a glass transition temperature Tg or a melting temperature of ≦150° C.

Abstract: Particulate materials are cold molded by preheating a binder and the material to be bound to a temperature of from 160 to 240° C., and then press molding at a temperature less than 80° C. and at a pressure of from 1 to 120 bar to give a molding, wherein the binder contains a polymer powder or aqueous polymer dispersion thereof, the polymer having a glass transition temperature Tg greater than 80° C. and a complex viscosity less than 15,000 Pa.s at 190° C., and derived from one or more comonomer units from the group of vinyl esters of optionally branched C1-18 alkylcarboxylic acids, (meth)acrylic esters of optionally branched C1-15 alcohols, dienes, olefins, vinylaromatics, and vinyl halides. The moldings exhibit excellent properties including resistance to sagging at elevated temperatures, and are recyclable.

Abstract: The invention provides for the use of non-copolymerizable hydroperoxides of the formula R—O—O—H as regulators in the free-radically initiated polymerization of ethylenically unsaturated monomers, where R is H, a C1-C18-alkyl radical, a C7-C22-aralkyl radical or a saturated or unsaturated carbocyclic or heterocyclic ring having from 3 to 18 carbon atoms, and may be substituted or unsubstituted.

Abstract: The invention provides for the use of non-copolymerizable hydroperoxides of the formula R—O—O—H as regulators in the free-radically initiated polymerization of ethylenically unsaturated monomers, where R is H, a C1-C18-alkyl radical, a C7-C22-aralkyl radical or a saturated or unsaturated carbocyclic or heterocyclic ring having from 3 to 18 carbon atoms, and may be substituted or unsubstituted.

Abstract: A semiconductor bond pad prevents cratering by including an etch stop layer which is formed between the field oxide layer and the first dielectric layer to prevent erosion of the field oxide while allowing etching and removal of the first dielectric layer to prevent cratering.

Abstract: A semiconductor fabrication process is provided which prevents the cratering of the bond pads of an integrated circuit by including in a semiconductor process an etch stop layer which is formed between the field oxide layer and the first dielectric layer to prevent erosion of the field oxide while allowing etching and removal of the first dielectric layer to prevent cratering.