Abstract: Apparatus for providing power includes a charge controller, an inverter, a power storage subsystem, and a relay control subsystem. The apparatus further includes a first, second, and third input coupling a first power source, a second power source, and the power storage subsystem, respectively, to the inverter. The apparatus further includes a first output coupling the power storage subsystem to the charge controller and inverter, and a second output coupling a load to the inverter. The first power source provides DC power, the second power source provides AC power, and the power storage subsystem provides DC power. The apparatus further includes a housing, which supports the charge controller, inverter, power storage subsystem, relay control subsystem, inputs, and outputs. The relay control subsystem may be coupled to a user device, allowing remote control of the relay control subsystem. A user may control transmission of power to outlets with the user device.

Abstract: The method provides importing advertising information into a telephone connection and providing an advertising dialogue system configured to assist in importing the advertising information into the telephone connection and to manage the advertising information and an advertising action which are looped into the telephone connection. The method further provides assigning at least one action indicator and a start action instruction to the advertising information. The at least one action indicator is configured to indicate the advertising action possible with the advertising information. The start action instruction is configured to start the advertising action, the start action instruction being triggerable by a user and activating the advertising action associated with the advertising information managed by the advertising dialogue system. The advertising dialogue system provides any service associated with the advertising action as automatically available to the user.

Abstract: Semiconductor power module, including a substantially prismatic plastic housing with a lower surface having a recess with a shoulder-like step formed in the periphery thereof, a ceramic plate being inserted into the step and having an outer flat surface extending beyond the lower surface of the housing and an inner flat surface facing the interior of the housing, metallizations, semiconductor components and solder jumpers disposed on the inner surface of the ceramic plate, external contact elements being disposed on the inner surface of the ceramic plate and being freely accessible from on top of the housing, the housing including a frame having an open top and bottom, a central fastening part having a lower surface and having a hole formed therethrough for fastening the module to a heat sink, and radially-directed spokes extended between the frame and the central fastening part, the ceramic plate being braced against the lower surface of the central fastening part and having a breakthrough formed therein in