Abstract: An ultrasonic imaging system which uses transform beamforming in a two-dimensional context includes a two-dimensional array of transducer elements, a plurality of groups of local busses, and a plurality of sets of switching circuits. Each transducer element has a signal electrode coupled to a corresponding set of switching circuits which is controlled so that a particular transducer element is selectively coupled to one of the associated group of local busses. Each local bus provides an output signal that is sent from the probe to the console via a respective coaxial cable for each group of local busses. The number of connections that are necessary to be made through each coaxial cable is reduced by the ratio of the number of transducer elements coupled to a set of local busses and the number of busses in that set. Each set of local busses provides the input transform signals to one transform section of the transform preprocessor.

Abstract: The present invention discloses a method and system for laser ultrasonic imaging an object. In the present invention, a synthetic aperture focusing technique (SAFT) is used to generate a high resolution subsurface images of the object. In addition, the present invention filters low frequency components from detected laser ultrasound waveform data to further enhance resolution, SNR, and contrast. Geometric knowledge permits the present invention to generate images of objects having a complex and arbitrary-shape.

Abstract: The present invention discloses a method and system for inspecting a surface of an object with laser ultrasound. In the present invention, the surface is scanned with a source laser emitting a laser beam at a plurality of scanning positions. The emitted laser beam generates surface or Lamb waves at the plurality of scanning positions and transmits the waves throughout the surface. The surface of the object is scanned with a detector laser emitting a laser beam onto the object surface at the plurality of scanning positions. Surface displacement produced by the waves reflected from the surface is detected with a detector at each scanning position. The detected displacement at each scanning position contains signals representing a laser ultrasound waveform data set corresponding to a two-dimensional surface region along the object. The laser ultrasound waveform data sets at each scanning position are processed with a synthetic aperture focusing technique in order to generate high resolution images.

Abstract: The present invention discloses a high density interconnect for an ultrasonic phased array and method for making. The high density interconnect includes a backfill material having grooves formed therein. Each of the grooves are separated a predetermined distance from each other and have a predetermined groove depth. A conducting material is deposited in each of the grooves. The grooved backfill is cut or formed into sections having different lengths. The sections are then reconsolidated into an unitary structure, wherein one end of the structure is electrically conductive in one direction. One surface of the high density interconnect is metallized for bonding with an ultrasonic phased array transducer while the other side is patterned with solder bumps for connection to integrated circuit boards or flexible circuit boards.

Abstract: The present invention discloses an ultrasonic phased array transducer with an ultralow backfill and a method for making. The ultrasonic phased array includes a low density backfill material having an ultralow acoustic impedance. The backfill material is either an aerogel, a carbon aerogel, an xerogel, or a carbon xerogel. A piezoelectric ceramic material and two matching layers are bonded to the backfill material. In one embodiment, a plurality of interconnect vias are formed in the backfill material with conducting material deposited in the vias. A portion of the bonded matching layers, the piezoelectric ceramic material, and the backfill material have isolation cuts therethrough to form an array of electrically and acoustically isolated individual elements. In a second embodiment, the backfill material is bonded to an electronic layer at a face opposite to the piezoelectric ceramic material and the matching layers.

Abstract: The present invention discloses an acoustic composite material for an ultrasonic phased array and a method for making. The acoustic composite material is formed from a microcapillary array having a plurality of holes of a constant cross-section and volume fraction. In each of the plurality of holes of the microcapillary array, a polymer fill is deposited therein. The polymer filled microcapillary array is cut at an axis perpendicular to the microcapillary array into a plurality of sections. Each of the plurality of sections are then ground into a predetermined thickness and bonded to a phased array of piezoelectric elements and backfill material.

Abstract: The present invention discloses a high density integrated ultrasonic phased array transducer and method for making. The high density integrated ultrasonic phased array includes a backfill material having an array of holes formed therein. Each of the holes are separated a predetermined distance apart from each other and have a predetermined hole depth. Each of the holes contain a conducting material deposited therein forming a high density interconnect with uniaxial conductivity. A piezoelectric ceramic material is bonded to the backfill material at a surface opposite the array of conducting holes. Matching layers are bonded to the piezoelectric ceramic material. The surface opposite the array of conducting holes is cut through a portion of the matching layers, the piezoelectric ceramic material, and the backfill material, forming an array of isolated individual elements each having multiple electrical connections therein.