Abstract: An IC device test probe has one or more clusters of a plurality of tapered probe tips that taper upon a taper plane that is orthogonal to a seating direction or force vector of the IC device test probe toward the IC device. Each of the plurality of tapered probe tips is seated against one contact of the IC device. In this manner, the IC device test probe is seated against multiple contacts and may therefore apply test signal(s) to these contacts serially, simultaneously, or the like. The IC device test probe allows the seating to small pitch IC devices and associated testing thereof. This allows for electrical characterization of the IC device by the same test signal(s) through the IC device test probe and ultimately through multiple contacts. The forces associated with seating the IC device test probe against the IC device contacts is effectively spread across multiple contacts.

Abstract: An IC device test probe has one or more clusters of a plurality of tapered probe tips that taper upon a taper plane that is orthogonal to a seating direction or force vector of the IC device test probe toward the IC device. Each of the plurality of tapered probe tips is seated against one contact of the IC device. In this manner, the IC device test probe is seated against multiple contacts and may therefore apply test signal(s) to these contacts serially, simultaneously, or the like. The IC device test probe allows the seating to small pitch IC devices and associated testing thereof. This allows for electrical characterization of the IC device by the same test signal(s) through the IC device test probe and ultimately through multiple contacts. The forces associated with seating the IC device test probe against the IC device contacts is effectively spread across multiple contacts.

Abstract: Aspects of the invention include a wafer test device with a conformal laminate and rigid probes extending from the laminate to form an electrical connection with a microcircuit under test. The wafer test device also includes a spring plate on a side of the laminate that is opposite a side from which the rigid probes extend. The spring plate includes a conformal inner frame and a rigid outer frame. The laminate is attached to the inner frame of the spring plate.

Abstract: Aspects of the invention include a wafer test device with a conformal laminate and rigid probes extending from the laminate to form an electrical connection with a microcircuit under test. The wafer test device also includes a spring plate on a side of the laminate that is opposite a side from which the rigid probes extend. The spring plate includes a conformal inner frame and a rigid outer frame. The laminate is attached to the inner frame of the spring plate.

Abstract: A wafer test device includes a test interconnect to interface with a microcircuit of the wafer at a first side and an interposer to interface with the test interconnect at a second side of the test interconnect, opposite the first side. The interposer connects the test interconnect, via a printed circuit board (PCB), to a test apparatus that determines and controls test patterns that are applied to the microcircuit via the test interconnect. A support structure supports the test interconnect and the interposer. The support structure includes an inner bearing to tilt the test interconnect to match a tilt of a surface of the microcircuit. An elastomer between the test interconnect and the interposer reduces deflection of the test interconnect during a process of connecting the test interconnect to the microcircuit.

Abstract: A wafer test device includes a test interconnect to interface with a microcircuit of the wafer at a first side and an interposer to interface with the test interconnect at a second side of the test interconnect, opposite the first side. The interposer connects the test interconnect, via a printed circuit board (PCB), to a test apparatus that determines and controls test patterns that are applied to the microcircuit via the test interconnect. A support structure supports the test interconnect and the interposer. The support structure includes an inner bearing to tilt the test interconnect to match a tilt of a surface of the microcircuit. An elastomer between the test interconnect and the interposer reduces deflection of the test interconnect during a process of connecting the test interconnect to the microcircuit.