Abstract: Methods and systems are disclosed for structurally analyzing and/or three-dimensional printing a part. The method may comprise receiving a model of the part for three-dimensional printing from a material comprising a matrix, receiving one or more properties for the material, and using the model, determining a print head tool path for use during the three-dimensional printing of the part. The method may also comprise determining a trajectory of at least one stiffness-contributing portion of the material based at least in part on the print head tool path, determining a performance of the part based at least in part on the one or more properties and the trajectory, and electronically outputting the performance of the part.

Abstract: A substrate support for a substrate processing system is provided and includes a body and mesas. The mesas are distributed across and extending from and in a direction away from the body. The mesas are configured to support a substrate. Each of the mesas includes a surface area that contacts and supports the substrate. Areal density of the mesas monotonically increases as a radial distance from a center of the substrate support increases.

Abstract: The present disclosure provides methods and systems for performing analysis on a part for printing. The method may comprise receiving, in computer memory, a computer model of the part and partitioning the computer model of the part into at least (i) a first region comprising one or more voids and (ii) a second region that is filled with a representation of a material for forming the part, to yield a partitioned computer model. At least a first mesh may be generated in the first region and at least a second mesh may be generated in the second region to yield a mesh array in the partitioned computer model. The mesh array, including the first mesh and the second mesh, may be to determine one or more properties of the part. The mesh array may be used to generate a print head toolpath usable to print the part.

Abstract: Methods and systems are disclosed for structurally analyzing and/or three-dimensional printing a part. The method may comprise receiving a model of the part for three-dimensional printing from a material comprising a matrix, receiving one or more properties for the material, and using the model, determining a print head tool path for use during the three-dimensional printing of the part. The method may also comprise determining a trajectory of at least one stiffness-contributing portion of the material based at least in part on the print head tool path, determining a performance of the part based at least in part on the one or more properties and the trajectory, and electronically outputting the performance of the part.

Abstract: A substrate support for a substrate processing system is provided and includes a body and mesas. The mesas are distributed across and extending from and in a direction away from the body. The mesas are configured to support a substrate. Each of the mesas includes a surface area that contacts and supports the substrate. Areal density of the mesas monotonically increases as a radial distance from a center of the substrate support increases.

Abstract: Methods and systems are disclosed for structurally analyzing and/or three-dimensional printing a part. The method may comprise receiving a model of the part for three-dimensional printing from a material comprising a matrix, receiving one or more properties for the material, and using the model, determining a print head tool path for use during the three-dimensional printing of the part. The method may also comprise determining a trajectory of at least one stiffness-contributing portion of the material based at least in part on the print head tool path, determining a performance of the part based at least in part on the one or more properties and the trajectory, and electronically outputting the performance of the part.

Abstract: Provided herein are assemblies that, when coupled to an object, are capable of keeping the object at a uniform elevated temperature while removing large amounts of heat from an external source. Applications include various integrated circuit fabrication processes that use such external sources to expose wafers to radiation. In certain embodiments, the assemblies include a pedestal for supporting the wafer or other object. In certain embodiments, the assemblies include a calibrated heat resistance that allows heat be conducted away from the pedestal and wafer to maintain the desired set-point temperature. In certain embodiments, the pedestal may have one or more protrusions used to dissipate or transfer heat from the pedestal to a heat sink. Also, in certain embodiments, the pedestal surface is configured to have a spectral reflectivity of desired values in such way as to reflect the wavelengths that are emitted by an external radiant heat source.

Abstract: The present invention provides a heat transfer assembly that, when coupled to an object, is capable of keeping the object at a uniform elevated temperature while removing large amounts of heat from an external source. The assembly may be contained in a pedestal for use in a UV-cure chamber. The heat transfer assembly includes a heating element to control the wafer temperature and a cooling element to remove incident IR heat from the wafer and pedestal. A heat resistant layer having a calibrated heat resistance is located between the heating and cooling elements and between the wafer and the cooling elements. The heat resistant layer is able to sustain high temperature gradient from the wafer to the coolant so that the coolant does not boil while permitting enough heat to be conducted away from the wafer to maintain the desired set-point temperature.

Abstract: A plurality of receptacles in an irrigation controller removably receive a plurality of modules. At least one station module is configured for insertion into a first one of the receptacles and is connectable to a corresponding solenoid actuated valve through a dedicated field valve line and common return line. The station module includes at least one switching device for selectvely providing a first power signal that energizes the corresponding solenoid actuated valve. At least one encoder module is configured for insertion into a second one of the receptacles and is connectable to a multi-wire path for sending encoded signals and a second power signal along the multi-wire path for selectively energizing one of a plurality of solenoid actuated valves connected to corresponding decoder circuits connected along the multi-wire path. A processor executes the stored watering program and controls the station module and/or the encoder module in accordance with the stored watering program.

Abstract: This invention provides a method and a support device for a wafer transfer process which has a first vertical, second horizontal and third compound angled surfaces, as well as a pair of sidewalls all contiguously connected to one another. The third surface has at least two angled receiving surfaces whereby one of such angled receiving surfaces has a small angle of incline for initially receiving and delivering a wafer. The other angled receiving surface has a steep angle of incline for effectively receiving, holding and transporting a semiconductor wafer by increasing an effective coefficient of friction of the wafer to provide a secure resting point for such wafer during a transfer process while simultaneously increasing the speed thereof. Furthermore, a hole may be provided in the support device for attaching the support device, or a plurality of support devices having holes, to an end-effector.