Patents by Inventor Peter Y. Huang

Peter Y. Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and apparatus for stripping photoresist and polymer layers from a semiconductor stack in a non-corrosive environment
    Patent number: 6251568
    Abstract: The present invention relates to method and apparatus for removing photoresist material from a wafer surface. In particular, the present invention employs a dry strip process to remove photoresist material that remains after conductive material has been etched to form conductive features. The inventive process includes a reactive ion strip process that includes fluorine, which forms salts with conductive material embedded in the photoresist material. The salts are then removed from the wafer surface by dissolving them in a solvent such as deionized water.
    Type: Grant
    Filed: February 9, 1999
    Date of Patent: June 26, 2001
    Assignee: Conexant Systems Inc.
    Inventors: Shao-Wen Hsia, Peter Y. Huang