Patents by Inventor Peter Yu Fei Huang

Peter Yu Fei Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10777534
    Abstract: A three-dimensional stacking structure is described. The stacking structure includes at least a bottom die, a top die and a spacer protective structure. The bottom die includes contact pads in the non-bonding region. The top die is stacked on the bottom die without covering the contact pads of the bottom die and the bottom die is bonded with the top die through bonding structures there-between. The spacer protective structure is disposed on the bottom die and covers the top die to protect the top die. By forming an anti-bonding layer before stacking the top dies to the bottom dies, the top die can be partially removed to expose the contact pads of the bottom die for further connection.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: September 15, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Peter Yu Fei Huang, Chaochieh Tsai
  • Patent number: 10157885
    Abstract: A package structure and method for forming the same are provided. The package structure includes a first die, and the first die includes a first magnetic pad formed over a first substrate. The package structure includes a second die, and the second die includes a second magnetic pad formed over a second substrate. The package structure also includes a hybrid bonding structure formed between the first die and the second die of the second wafer. The hybrid bonding structure includes a magnetic bonding structure which is made of the first magnetic pad and the second magnetic layer.
    Type: Grant
    Filed: July 29, 2016
    Date of Patent: December 18, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Peter Yu-Fei Huang, Richard Burton Cassidy, II, Chaochieh Tsai
  • Publication number: 20180033773
    Abstract: A package structure and method for forming the same are provided. The package structure includes a first die, and the first die includes a first magnetic pad formed over a first substrate. The package structure includes a second die, and the second die includes a second magnetic pad formed over a second substrate. The package structure also includes a hybrid bonding structure formed between the first die and the second die of the second wafer. The hybrid bonding structure includes a magnetic bonding structure which is made of the first magnetic pad and the second magnetic layer.
    Type: Application
    Filed: July 29, 2016
    Publication date: February 1, 2018
    Inventors: Peter Yu-Fei HUANG, Richard Burton CASSIDY, II, Chaochieh TSAI
  • Publication number: 20180012868
    Abstract: A three-dimensional stacking structure is described. The stacking structure includes at least a bottom die, a top die and a spacer protective structure. The bottom die includes contact pads in the non-bonding region. The top die is stacked on the bottom die without covering the contact pads of the bottom die and the bottom die is bonded with the top die through bonding structures there-between. The spacer protective structure is disposed on the bottom die and covers the top die to protect the top die. By forming an anti-bonding layer before stacking the top dies to the bottom dies, the top die can be partially removed to expose the contact pads of the bottom die for further connection.
    Type: Application
    Filed: August 25, 2017
    Publication date: January 11, 2018
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Peter Yu Fei Huang, Chaochieh Tsai
  • Patent number: 9748206
    Abstract: A three-dimensional stacking structure and the manufacturing method(s) thereof are described. The stacking structure includes at least a bottom die, a top die and a spacer protective structure. The bottom die include contact pads in the non-bonding region. The top die is stacked on the bottom die without covering the contact pads of the bottom die and the bottom die is bonded with the top die through bonding structures there-between. The spacer protective structure is disposed on the bottom die and covers the top die to protect the top die. By forming an anti-bonding layer before stacking the top dies to the bottom dies, the top die can be partially removed to expose the contact pads of the bottom die for further connection.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: August 29, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Peter Yu Fei Huang, Chaochieh Tsai