Abstract: An electronic housing assembly includes a polymeric housing base and a metallic heat sink secured to the housing base with a snap-fit engagement. A printed circuit board is positioned within a cavity in the housing assembly and is protected within the housing by an environmental seal. The electronic housing assembly allows for expansion and contraction between the heat sink and the housing while maintaining the integrity of the seal.

Abstract: An electronic housing assembly includes a polymeric housing base and a metallic heat sink secured to the housing base with a snap-fit engagement. A printed circuit board is positioned within a cavity in the housing assembly and is protected within the housing by an environmental seal. The electronic housing assembly allows for expansion and contraction between the heat sink and the housing while maintaining the integrity of the seal.

Abstract: A polarizer assembly including first and second components having respective first and second channel portions. The first and second components are configured to flex between a pre-fastened state and a fastened state. In the pre-fastened state, a first flange face of a flange of the first component contacts an opposite facing second flange face of a flange of the second component at contact regions along respective edges of the first and second channel portions to form a nonuniform thickness gap between the first and second flange faces outwardly from the contact regions toward outer edges of the first and second components. In the fastened state, the first flange face is engaged flush with the second flange face to close the nonuniform thickness gap.

Abstract: A polarizer assembly including first and second components. The first component includes a first channel portion extending along a first component axis and having a plurality of first locking projections and/or first openings on opposite sides of the first channel portion. The second component includes a second channel portion extending along a second component axis and having a plurality of second locking projections and/or second openings on opposite sides of the second channel portion. The second component is rotatable relative to the first component about a common rotation axis between a pre-assembled position in which the second component axis is angularly offset from the first component axis, and an assembled position in which the second locking projections and/or second openings mate with the first locking projections and/or first openings and the first and second channel portions form a channel that functions to polarize waveforms.

Abstract: A polarizer assembly including first and second components having respective first and second channel portions. The first and second components are configured to flex between a pre-fastened state and a fastened state. In the pre-fastened state, a first flange face of a flange of the first component contacts an opposite facing second flange face of a flange of the second component at contact regions along respective edges of the first and second channel portions to form a nonuniform thickness gap between flange faces outwardly from the contact regions toward outer edges of the first and second components. In the fastened state, the first flange face is engaged flush with the second flange face to close the nonuniform thickness gap.

Abstract: A method for providing EMI shielding to an electronic circuit board using an electrically-conductive thermoplastic sheet containing a pre-applied electrically-conductive adhesive composition is disclosed. The adhesive composition is fluent and form-stable, and comprises a silicone adhesive, a compatible silane and electrically-conductive particles or fibers. The adhesive is conveniently pre-applied to the thermoplastic sheet and shipped to the customer for attachment to the integrated circuit board.

Abstract: An integrated assembly is provided for installation on a housing for electronic components. The integrated assembly includes a shielded window and a bezel overmolded onto the shielded window in an injection molding process. Since both the shielded window and the bezel have EMI resistant properties, the assembly represents an efficient method for providing high quality EMI shielding while eliminating the use of costly parts and assembly procedures.

Abstract: An integrated assembly is provided for installation on a housing for electronic components. The integrated assembly includes a shielded window and a bezel overmolded onto the shielded window in an injection molding process. Since both the shielded window and the bezel have EMI resistant properties, the assembly represents an efficient method for providing high quality EMI shielding while eliminating the use of costly parts and assembly procedures.