Patents by Inventor Peter Zorn

Peter Zorn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10748787
    Abstract: A semiconductor device includes an insulating carrier structure comprised of an insulating inorganic material. The carrier structure has a receptacle in which a semiconductor chip is disposed. The semiconductor chip has a first side, a second side and a lateral rim. The carrier structure laterally surrounds the semiconductor chip and the lateral rim. The semiconductor device also includes a metal structure on and in contact with the second side of the semiconductor chip and embedded in the carrier structure.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: August 18, 2020
    Assignee: Infineon Technologies AG
    Inventors: Carsten von Koblinski, Ulrike Fastner, Andre Brockmeier, Peter Zorn
  • Patent number: 10749216
    Abstract: A battery includes a first substrate having a first main surface, a second substrate made of a conducting material or semiconductor material, and a carrier of an insulating material. The carrier has a first and a second main surfaces, the second substrate being attached to the first main surface of the carrier. An opening is formed in the second main surface of the carrier to uncover a portion of a second main surface of the second substrate. The second main surface of the carrier is attached to the first substrate, thereby forming a cavity. The battery further includes an electrolyte disposed in the cavity.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: August 18, 2020
    Assignee: Infineon Technologies AG
    Inventors: Ravi Keshav Joshi, Alexander Breymesser, Bernhard Goller, Kamil Karlovsky, Francisco Javier Santos Rodriguez, Peter Zorn
  • Patent number: 10461031
    Abstract: According to various embodiments, a method for processing an electronic device may include: forming a patterned hard mask layer over a power metallization layer, the patterned hard mask layer exposing at least one surface region of the power metallization layer; and patterning the power metallization layer by wet etching of the exposed at least one surface region of the power metallization layer.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: October 29, 2019
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Petra Fischer, Johanna Schlaminger, Monika Cornelia Voerckel, Peter Zorn
  • Publication number: 20190023600
    Abstract: An array of glass members is arranged in a glass substrate includes a plurality of depressions formed in a first main surface of the glass substrate, and a plurality of openings formed in a second main surface of the glass substrate.
    Type: Application
    Filed: September 27, 2018
    Publication date: January 24, 2019
    Inventors: Andre Brockmeier, Alexander Breymesser, Carsten Von Koblinski, Francisco Javier Santos Rodriguez, Peter Zorn
  • Publication number: 20180358299
    Abstract: According to various embodiments, a method for processing an electronic device may include: forming a patterned hard mask layer over a power metallization layer, the patterned hard mask layer exposing at least one surface region of the power metallization layer; and patterning the power metallization layer by wet etching of the exposed at least one surface region of the power metallization layer.
    Type: Application
    Filed: June 8, 2018
    Publication date: December 13, 2018
    Inventors: Petra Fischer, Johanna Schlaminger, Monika Cornelia Voerckel, Peter Zorn
  • Patent number: 10112861
    Abstract: A method of manufacturing a plurality of glass members comprises bringing a first main surface of a glass substrate in contact with a first working surface of a first mold substrate, the first working surface being provided with a plurality of first protruding portions, and bringing a second main surface of the glass substrate in contact with a second working surface of a second mold substrate, the second working surface being provided with a plurality of second protruding portions. The method further comprises controlling a temperature of the glass substrate to a temperature above a glass-transition temperature to form the plurality of glass members, removing the first and the second mold substrates from the glass substrate, and separating adjacent ones of the plurality of glass members.
    Type: Grant
    Filed: July 30, 2015
    Date of Patent: October 30, 2018
    Assignee: Infineon Technologies AG
    Inventors: Andre Brockmeier, Alexander Breymesser, Carsten Von Koblinski, Francisco Javier Santos Rodriguez, Peter Zorn
  • Patent number: 9917333
    Abstract: A lithium ion battery includes a first substrate having a first main surface, and a lid including an insulating material. The lid is attached to the first main surface of the first substrate, and a cavity is defined between the first substrate and the lid. The lithium ion battery further includes an electrical interconnection element in the lid, the electrical interconnection element providing an electrical connection between a first main surface and a second main surface of the lid. The lithium ion battery further includes an electrolyte in the cavity, an anode at the first substrate, the anode including a component made of a semiconductor material, and a cathode at the lid.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: March 13, 2018
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Vijaye Kumar Rajaraman, Kamil Karlovsky, Thomas Neidhart, Karl Mayer, Rainer Leuschner, Christine Moser, Ravi Keshav Joshi, Alexander Breymesser, Bernhard Goller, Francisco Javier Santos Rodriguez, Peter Zorn
  • Publication number: 20180061671
    Abstract: A semiconductor device includes an insulating carrier structure comprised of an insulating inorganic material. The carrier structure has a receptacle in which a semiconductor chip is disposed. The semiconductor chip has a first side, a second side and a lateral rim. The carrier structure laterally surrounds the semiconductor chip and the lateral rim. The semiconductor device also includes a metal structure on and in contact with the second side of the semiconductor chip and embedded in the carrier structure.
    Type: Application
    Filed: October 26, 2017
    Publication date: March 1, 2018
    Inventors: Carsten von Koblinski, Ulrike Fastner, Andre Brockmeier, Peter Zorn
  • Patent number: 9847235
    Abstract: A carrier substrate having a plurality of receptacles each for receiving and carrying a semiconductor chip is provided. Semiconductor chips are arranged in the receptacles, and metal is plated in the receptacles to form a metal structure on and in contact with the semiconductor chips. The carrier substrate is cut to form separate semiconductor devices.
    Type: Grant
    Filed: February 26, 2014
    Date of Patent: December 19, 2017
    Assignee: Infineon Technologies AG
    Inventors: Carsten von Koblinski, Ulrike Fastner, Andre Brockmeier, Peter Zorn
  • Publication number: 20170029311
    Abstract: A method of manufacturing a plurality of glass members comprises bringing a first main surface of a glass substrate in contact with a first working surface of a first mold substrate, the first working surface being provided with a plurality of first protruding portions, and bringing a second main surface of the glass substrate in contact with a second working surface of a second mold substrate, the second working surface being provided with a plurality of second protruding portions. The method further comprises controlling a temperature of the glass substrate to a temperature above a glass-transition temperature to form the plurality of glass members, removing the first and the second mold substrates from the glass substrate, and separating adjacent ones of the plurality of glass members.
    Type: Application
    Filed: July 30, 2015
    Publication date: February 2, 2017
    Inventors: Andre Brockmeier, Alexander Breymesser, Carsten Von Koblinski, Francisco Javier Santos Rodriguez, Peter Zorn
  • Publication number: 20160332873
    Abstract: Methods, apparatuses and devices are described where a main wafer is irreversibly bonded to a carrier wafer and thinned to reduce a thickness of the main wafer, for example down to a thickness of 300 ?m or below.
    Type: Application
    Filed: July 29, 2016
    Publication date: November 17, 2016
    Inventors: Andre Brockmeier, Christian Kalousek, Katharina Maier, Peter Zorn, Kai-Alexander Schreiber, Francesco Solazzi
  • Patent number: 9428381
    Abstract: Methods, apparatuses and devices are described where a main wafer is irreversibly bonded to a carrier wafer and thinned to reduce a thickness of the main wafer, for example down to a thickness of 300 ?m or below.
    Type: Grant
    Filed: March 3, 2014
    Date of Patent: August 30, 2016
    Assignee: Infineon Technologies AG
    Inventors: Andre Brockmeier, Christian Griessler, Katharina Maier, Peter Zorn, Kai-Alexander Schreiber, Francesco Solazzi
  • Publication number: 20150280287
    Abstract: A battery includes a first substrate having a first main surface, a second substrate made of a conducting material or semiconductor material, and a carrier of an insulating material. The carrier has a first and a second main surfaces, the second substrate being attached to the first main surface of the carrier. An opening is formed in the second main surface of the carrier to uncover a portion of a second main surface of the second substrate. The second main surface of the carrier is attached to the first substrate, thereby forming a cavity. The battery further includes an electrolyte disposed in the cavity.
    Type: Application
    Filed: March 31, 2014
    Publication date: October 1, 2015
    Inventors: Ravi Keshav Joshi, Alexander Breymesser, Bernhard Goller, Kamil Karlovsky, Francisco Javier Santos Rodriguez, Peter Zorn
  • Publication number: 20150280288
    Abstract: A lithium ion battery includes a first substrate having a first main surface, and a lid including an insulating material. The lid is attached to the first main surface of the first substrate, and a cavity is defined between the first substrate and the lid. The lithium ion battery further includes an electrical interconnection element in the lid, the electrical interconnection element providing an electrical connection between a first main surface and a second main surface of the lid. The lithium ion battery further includes an electrolyte in the cavity, an anode at the first substrate, the anode including a component made of a semiconductor material, and a cathode at the lid.
    Type: Application
    Filed: March 31, 2014
    Publication date: October 1, 2015
    Inventors: Vijaye Kumar Rajaraman, Kamil Karlovsky, Thomas Neidhart, Karl Mayer, Rainer Leuschner, Christine Moser, Ravi Keshav Joshi, Alexander Breymesser, Bernhard Goller, Francisco Javier Santos Rodriguez, Peter Zorn
  • Publication number: 20150246809
    Abstract: Methods, apparatuses and devices are described where a main wafer is irreversibly bonded to a carrier wafer and thinned to reduce a thickness of the main wafer, for example down to a thickness of 300 ?m or below.
    Type: Application
    Filed: March 3, 2014
    Publication date: September 3, 2015
    Applicant: Infineon Technologies AG
    Inventors: Andre Brockmeier, Christian Griessler, Katharina Maier, Peter Zorn, Kai-Alexander Schreiber, Francesco Solazzi
  • Publication number: 20150243591
    Abstract: A carrier substrate having a plurality of receptacles each for receiving and carrying a semiconductor chip is provided. Semiconductor chips are arranged in the receptacles, and metal is plated in the receptacles to form a metal structure on and in contact with the semiconductor chips. The carrier substrate is cut to form separate semiconductor devices.
    Type: Application
    Filed: February 26, 2014
    Publication date: August 27, 2015
    Inventors: Carsten von Koblinski, Ulrike Fastner, Andre Brockmeier, Peter Zorn
  • Patent number: 9117801
    Abstract: A method for manufacturing semiconductor devices includes providing a stack having a semiconductor wafer and a glass substrate with openings and at least one trench attached to the semiconductor wafer. The semiconductor wafer includes a plurality of semiconductor devices. The openings of the glass substrate leave respective areas of the semiconductor devices uncovered by the glass substrate and the trench connects the openings. A metal layer is formed at least on exposed walls of the trench and the openings and on the uncovered areas of the semiconductor devices of the semiconductor wafer. A metal region is formed by electroplating metal in the openings and the trench and by subsequently grinding the glass substrate to remove the trenches. The stack of the semiconductor wafer and the attached glass substrate is cut to separate the semiconductor devices.
    Type: Grant
    Filed: May 15, 2013
    Date of Patent: August 25, 2015
    Assignee: Infineon Technologies AG
    Inventors: Carsten von Koblinski, Ulrike Fastner, Peter Zorn, Markus Ottowitz
  • Publication number: 20140339694
    Abstract: A method for manufacturing semiconductor devices includes providing a stack having a semiconductor wafer and a glass substrate with openings and at least one trench attached to the semiconductor wafer. The semiconductor wafer includes a plurality of semiconductor devices. The openings of the glass substrate leave respective areas of the semiconductor devices uncovered by the glass substrate and the trench connects the openings. A metal layer is formed at least on exposed walls of the trench and the openings and on the uncovered areas of the semiconductor devices of the semiconductor wafer. A metal region is formed by electroplating metal in the openings and the trench and by subsequently grinding the glass substrate to remove the trenches. The stack of the semiconductor wafer and the attached glass substrate is cut to separate the semiconductor devices.
    Type: Application
    Filed: May 15, 2013
    Publication date: November 20, 2014
    Inventors: Carsten von Koblinski, Ulrike Fastner, Peter Zorn, Markus Ottowitz
  • Patent number: 4927100
    Abstract: An airfoil having two (2) basic components, a sail and spoiler, associated with the leading edge of the sail, is herein disclosed. This unique airfoil design has application in flexible wing aircraft (i.e., ultralites), sport parachutes and sport kites. In the typical sport kite embodiment of this invention, there will generally be at least three (3) aerodynamic flight control surfaces: a sail, a keel, and a flexible resilient spoiler attached to the leading edge of the sail. The sail material is itself resilient, however, sufficiently rigid to maintain a preset configuration without the need for struts, spars or extrinsic physical support. A spoiler, which is located along the entire leading edge of the sail, provides additional structural reinforcement to the sail while undergoing controlled deformation in gusty or high winds. The effect of such deformation of the spoiler causes the sail to stall before any physical damage can occur.
    Type: Grant
    Filed: November 11, 1988
    Date of Patent: May 22, 1990
    Assignee: Patrician Corporation
    Inventors: Eugene F. Provenzo, Jr., Peter A. Zorn