Patents by Inventor Peter Zung

Peter Zung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7528420
    Abstract: Image sensing devices and methods for fabricating the same are provided. An exemplary image sensing device includes a first substrate having a first side and a second side opposing each other. A plurality of image sensing elements is formed in the first substrate at the first side. A conductive via is formed through the first substrate, having a first surface exposed by the first substrate at the first side and a second surface exposed by the first substrate at the second side. A conductive pad overlies the conductive via at the first side and is electrically connecting the image sensing elements. A conductive layer overlies the conductive via at the second side and electrically connects with the conductive pad. A conductive bump is formed over a portion of the conductive layer. A second substrate is bonded with the first substrate at the first side.
    Type: Grant
    Filed: May 23, 2007
    Date of Patent: May 5, 2009
    Assignee: Visera Technologies Company Limited
    Inventors: Jui-Peng Weng, Tzu-Han Lin, Pai-Chun Peter Zung
  • Publication number: 20090032893
    Abstract: An image sensor package and method for fabricating the same is provided. The image sensor package includes a first substrate comprising a via hole therein, a driving circuit and a first conductive pad thereon. A second substrate comprising a photosensitive device and a second conductive pad thereon is bonded to the first substrate, so that the driving circuit, formed on the first substrate, can electrically connect to and further control the photosensitive device, formed on the second substrate. A solder ball is formed on a backside of the first substrate and electrically connects to the via hole for transmitting a signal from the driving circuit. Because the photosensitive device and the driving circuit are fabricated individually on the different substrates, fabrication and design thereof is more flexible. Moreover, the image sensor package is relatively less thick, thus, the dimensions thereof are reduced.
    Type: Application
    Filed: August 1, 2007
    Publication date: February 5, 2009
    Inventors: Jui-Ping Weng, Jang-Cheng Hsieh, Tzu-Han Lin, Pai-Chung Peter Zung
  • Publication number: 20090001495
    Abstract: The invention provides an image sensor package and method for fabricating the same. The image sensor package comprises a first substrate comprising a sensor device thereon and a hole therein. A bonding pad comprising a first opening is formed on an upper surface of the first substrate. A second substrate comprising a spacer element with a second opening therein is disposed on the first substrate. A conductive plug is formed in the hole and passes through the first and second openings to the second substrate to electrically contact with the bonding pad. A conductive layer is formed on a lower surface of the first substrate and electrically connects to the conductive plug. A solder ball is formed on the conductive layer and electrically connects to the bonding pad by the conductive plug. The image sensor package further comprises a second substrate bonding to the first substrate. The image sensor package is relatively less thick, thus, the dimensions thereof are relatively reduced.
    Type: Application
    Filed: June 29, 2007
    Publication date: January 1, 2009
    Inventors: Jui-Ping Weng, Jang-Cheng Hsieh, Tzu-Han Lin, Pai-Chun Peter Zung
  • Publication number: 20080303109
    Abstract: An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.
    Type: Application
    Filed: August 9, 2008
    Publication date: December 11, 2008
    Inventors: Hsiao-Wen Lee, Peter Zung, Tzu-Han Lin, Tzy-Ying Lin, Chia-Yang Chang, Chien-Pang Lin
  • Publication number: 20080290438
    Abstract: Image sensing devices and methods for fabricating the same are provided. An exemplary image sensing device comprises a first substrate having a first side and a second side opposing each other. A plurality of image sensing elements is formed in the first substrate at the first side. A conductive via is formed through the first substrate, having a first surface exposed by the first substrate at the first side and a second surface exposed by the first substrate at the second side. A conductive pad overlies the conductive via at the first side and is electrically connecting the image sensing elements. A conductive layer overlies the conductive via at the second side and electrically connects with the conductive pad. A conductive bump is formed over a portion of the conductive layer. A second substrate is bonded with the first substrate at the first side.
    Type: Application
    Filed: May 23, 2007
    Publication date: November 27, 2008
    Applicant: VISERA TECHNOLOGIES COMPANY LIMITED
    Inventors: Jui-Peng Weng, Tzu-Han Lin, Pai-Chun Peter Zung
  • Patent number: 7433555
    Abstract: An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.
    Type: Grant
    Filed: May 22, 2006
    Date of Patent: October 7, 2008
    Assignee: Visera Technologies Company Ltd
    Inventors: Hsiao-Wen Lee, Peter Zung, Tzu-Han Lin, Tzy-Ying Lin, Chia-Yang Chang, Chien-Pang Lin
  • Publication number: 20080198481
    Abstract: Aspheric lens structures with dual aspheric surfaces and fabrication methods thereof are disclosed. An aspheric lens structure includes a first lens component with an aspheric top surface disposed on a second lens component, wherein the interface between the first lens component and the second lens component is spherical. The second lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the second lens component. The second lens component may also include a planar back surface with a third lens component disposed on the planar back surface of the second component. The third lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the third lens component.
    Type: Application
    Filed: February 15, 2007
    Publication date: August 21, 2008
    Inventors: Pai-Chun Peter Zung, Shin-Chang Shiung, Wei-Ko Wang, Chia-Yang Chang, Chien-Pang Lin
  • Publication number: 20080164550
    Abstract: A package module for an image sensor device is disclosed. The package module comprises a device chip disposed between lower and upper substrates. A first conductive layer is over a first sidewall of the lower substrate and insulated from the device chip. A first protective layer is on the first conductive layer and exposes a portion of the first conductive layer over the first sidewall of the lower substrate. A first pad is on the bottom surface of the lower substrate and is electrically connected to the first conductive layer. The invention also discloses an electronic assembly for an image sensor device and a fabrication method thereof.
    Type: Application
    Filed: February 16, 2007
    Publication date: July 10, 2008
    Inventors: Teng-Sheng Chen, Pai-Chun Peter Zung, Tzu-Han Lin, Shin-Chang Shiung
  • Publication number: 20070279520
    Abstract: A package module for an image sensing device is provided. The package module includes a substrate having thereon a photoelectric element array, a first optical element array formed on the photoelectric element array, a package lid having thereon a second optical element array opposite to the first optical element array and having an arrangement corresponding to that of the first optical element array; and a spacer disposed on a bonding area between the package lid and the substrate for adjusting a distance between the package lid and the substrate.
    Type: Application
    Filed: February 20, 2007
    Publication date: December 6, 2007
    Applicant: VISERA TECHNOLOGIES COMPANY, LTD.
    Inventors: Hsiao-Wen Lee, Chih-Kung Chang, Pai-Chun Peter Zung, Chien-Pang Lin
  • Publication number: 20070267647
    Abstract: An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.
    Type: Application
    Filed: May 22, 2006
    Publication date: November 22, 2007
    Inventors: Hsiao-Wen Lee, Peter Zung, Tzu-Han Lin, Tzy-Ying Lin, Chia-Yang Chang, Chien-Pang Lin
  • Publication number: 20070166029
    Abstract: An image sensor module comprises an image sensor chip, at least one lens layer, and at least one bonding layer. The image sensor chip has an image capturing zone manufactured with an image capturing element, and a partition zone surrounding the image capturing zone. The at least one lens layer is stacked on the image sensor chip, having a transparent substrate and a lens mounted on the transparent substrate and adapted to focus the projected image onto the image capturing zone of the image sensor chip. The at least one bonding layer is arranged corresponding to the partition zone of the image sensor chip and bonded between the image sensor chip and the at least one lens layer, mixing of a glue agent and a plurality of spacer elements with which the height of each the spacer elements is determined to be the height of the bonding layer.
    Type: Application
    Filed: January 16, 2007
    Publication date: July 19, 2007
    Applicant: Visera Technologies, Co. Ltd.
    Inventors: Hsiao-Wen Lee, Tzu-Han Lin, Pai-Chun Peter Zung, Chien-Pang Lin
  • Publication number: 20070070511
    Abstract: A wafer level image module includes a photo sensor for outputting an electrical signal upon receiving light, a lens set for focusing incident light onto the photo sensor, and an adjustment member disposed between the photo sensor and the lens set for controlling the distance between the photo sensor and the lens set to compensate the focus offset of the photo sensor for enabling the lens set to accurately focus the incident light onto the photo sensor in an in-focus manner so as to provide a high image quality.
    Type: Application
    Filed: September 28, 2006
    Publication date: March 29, 2007
    Applicant: VISERA TECHNOLOGIES, COMPANY LTD.
    Inventors: Hsiao-Wen Lee, Pai-Chun Peter Zung, Tzu-Han Lin
  • Publication number: 20060289733
    Abstract: An image sensor module includes an image-sensing unit having a first surface, a second surface and a plurality of first conductive contacts arranged at the second surface, a signal processing unit mounted on the first surface of the image-sensing unit and provided with a plurality of second conductive contacts respectively electrically connected to the first conductive contacts of the image-sensing unit, a plurality of solder balls respectively electrically connected to the second conductive contacts of the signal processing unit for mounting in an external circuit board, and a lens set mounted on the second surface of the image-sensing unit and covering the first conductive contacts of the image-sensing unit.
    Type: Application
    Filed: September 15, 2005
    Publication date: December 28, 2006
    Applicant: VISERA TECHNOLOGIES, COMPANY LTD.
    Inventors: Peter Zung, Tzu-Han Lin, Fang-Chang Liu