Abstract: Process for the production of at least one solderable surface in selected solder regions and of at least one functional surface in function regions differing from the solder regions on circuit carriers provided as well as of corresponding circuit carriers.

Abstract: The inventive method provides solderable areas in addition to bondable areas on circuit carriers, wherein solderability is not impaired by exposing the circuit carriers to the effects of temperature. The inventive method comprises the following steps: solderable surfaces are produced by deposition of a solderable metal layer (5), the solder areas are covered by a mask (6), functional surfaces (7, 8) are created in the functional areas and the covering mask (6) is finally removed.

Abstract: The present invention describes a method of producing gold coating on a workpiece having a palladium surface, having the steps of: a) making an aqueous solution containing at least one compound selected from the group of compounds containing gold(I) and gold(III) ions and additionally at least one organic compound selected from the group consisting of formic acid, aromatic carboxylic acids having the chemical formula: where R1, . . . , R4=H, alkyl, alkenyl, alkynyl, OH, and the salts, esters or amides of these compounds; b) adjusting the pH of the solution to 1 to 6 using pH adjusting agents; and c) bringing the workpiece into contact with the solution such that gold coating is plated onto the palladium surface.