Abstract: The invention relates to a laser assembly (1) comprising a diode laser bar (2), a heat sink (4) and at least one cover (7). The laser bar is located between the heat sink and the cover. The heat sink and/or the cover is/are coated with nanowires (16) or nanotubes via which the contact between the laser bar and the heat sink and/or the cover is established.

Abstract: The invention relates to a laser assembly (1) comprising a diode laser bar (2), a heat sink (4) and at least one cover (7). The laser bar is located between the heat sink and the cover. The heat sink and/or the cover is/are coated with nanowires (16) or nanotubes via which the contact between the laser bar and the heat sink and/or the cover is established.

Abstract: A diode laser comprising a plurality of laser bars. The laser bars are constructed as a laser stack with heat conducting bodies arranged between the bars. The laser bars are arranged in an interior of a housing. The housing is formed from a frame fitted on the multilayer substrate and a window. The empty volume is less than half of the total volume of the interior.

Abstract: A diode laser comprising a plurality of laser bars. The laser bars are constructed as a laser stack with heat conducting bodies arranged between the bars. The laser bars are arranged in an interior of a housing. The housing is formed from a frame fitted on the multilayer substrate and a window. The empty volume is less than half of the total volume of the interior.

Abstract: The invention relates to thermally contacting a semiconductor component arrangement, wherein at least one of two heat conducting bodies disposed on opposite sides of the semiconductor component arrangement is brought into contact with a contact surface of the semiconductor component arrangement by means of a metal layer under the application of a force, wherein the metal layer melts during solidification of a locking agent, forming an adhesive bond between the two heat transfer bodies over the entire region thereof.

Abstract: The invention relates to thermally contacting a semiconductor component arrangement, wherein at least one of two heat conducting bodies disposed on opposite sides of the semiconductor component arrangement is brought into contact with a contact surface of the semiconductor component arrangement by means of a metal layer under the application of a force, wherein the metal layer melts during solidification of a locking agent, forming an adhesive bond between the two heat transfer bodies over the entire region thereof.

Abstract: A laser radiation source which is scalable with respect to output is designed in such a way that laser diode elements can be arranged on a carrier so as to be stacked equidistantly and with low stress at a low manufacturing cost. The laser radiation source comprises a vertical stack of laser diode elements contacted on both sides via electrically conductive substrate layers, and at least one multi-layer carrier comprising a first and a second metallic layer which are separated by at least one electrically insulating layer of nonmetallic material. At least one of the metallic layers is divided into metallic layer regions which are arranged adjacent to one another and at a distance from one another. Oppositely polarized substrate layers of adjacent laser diode elements are arranged on common layer regions of a metallic layer. Collimating lenses serve to collimate the radiation emitted by the laser diode elements.

Abstract: In a diode laser module and a method for the production thereof, there is a need to fix the optical elements required for collimating, beam shaping and/or beam rearrangement of the radiation of a laser diode element with high reproducibility and long-term stability in an optically aligned manner, wherein the optically aligned state is produced by a successive adjustment of the optical elements in the beam of the switched-on laser diode element. It must be ensured that the fixing can be carried out in a process that is at least partially automated. At least one intermediate carrier is arranged on a heat-dissipating carrier serving to cool the laser diode element. The heat conductivity of the intermediate carrier is less than that of the heat-dissipating carrier, and the alignment of the optical components and fixation by sequential soldering is carried out on the surface of the intermediate carrier.

Abstract: A laser radiation source which is scalable with respect to output is designed in such a way that laser diode elements can be arranged on a carrier so as to be stacked equidistantly and with low stress at a low manufacturing cost. The laser radiation source comprises a vertical stack of laser diode elements contacted on both sides via electrically conductive substrate layers, and at least one multi-layer carrier comprising a first and a second metallic layer which are separated by at least one electrically insulating layer of nonmetallic material. At least one of the metallic layers is divided into metallic layer regions which are arranged adjacent to one another and at a distance from one another. Oppositely polarized substrate layers of adjacent laser diode elements are arranged on common layer regions of a metallic layer. Collimating lenses serve to collimate the radiation emitted by the laser diode elements.

Abstract: In a diode laser module and a method for the production thereof, there is a need to fix the optical elements required for collimating, beam shaping and/or beam rearrangement of the radiation of a laser diode element with high reproducibility and long-term stability in an optically aligned manner, wherein the optically aligned state is produced by a successive adjustment of the optical elements in the beam of the switched-on laser diode element. It must be ensured that the fixing can be carried out in a process that is at least partially automated. At least one intermediate carrier is arranged on a heat-dissipating carrier serving to cool the laser diode element. The heat conductivity of the intermediate carrier is less than that of the heat-dissipating carrier, and the alignment of the optical components and fixation by sequential soldering is carried out on the surface of the intermediate carrier.

Abstract: The invention refers to a novel semiconductor module with at least one semiconductor element in the form of a laser diode or laser diode arrangement, whereby the semiconductor element is provided with an area of a multi-layer substrate, which at least in a partial area is designed as a micro-cooler through which cooling medium flows, and which has connectors for supplying and discharging cooling medium.

Abstract: A diode laser arrangement is disclosed wherein a radiation source is designed which can be scaled with respect to power such that different types of cooling can be applied and the configuration of the radiation field is suitable for adapting to different tasks in a simple manner. For this purpose, every diode laser is connected to a thermal contact surface of a separate, heat-spreading carrier which is fastened to a cooling surface of a common cooling element so as to be electrically insulated. The carriers are arranged adjacently in such a way that the line-shaped emission regions of the diode lasers are adjacent in series and the p-n junction planes extend parallel to the thermal contact surfaces. The diode laser arrangement is particularly suitable as a pump light source.

Abstract: The invention refers to a novel semiconductor module with at least one semiconductor element in the form of a laser diode or laser diode arrangement, whereby the semiconductor element is provided with an area of a multi-layer substrate, which at least in a partial area is designed as a micro-cooler through which cooling medium flows, and which has connectors for supplying and discharging cooling medium.

Abstract: A diode laser arrangement is disclosed wherein a radiation source is designed which can be scaled with respect to power such that different types of cooling can be applied and the configuration of the radiation field is suitable for adapting to different tasks in a simple manner. For this purpose, every diode laser is connected to a thermal contact surface of a separate, heat-spreading carrier which is fastened to a cooling surface of a common cooling element so as to be electrically insulated. The carriers are arranged adjacently in such a way that the line-shaped emission regions of the diode lasers are adjacent in series and the p-n junction planes extend parallel to the thermal contact surfaces. The diode laser arrangement is particularly suitable as a pump light source.