Abstract: The thermoplastic molding composition comprises, based on the thermoplastic molding composition, a) at least one polyamide, copolyamide or a polyamide-comprising polymer blend as component A, b) from 0.1 to 10% by weight of carbon nanotubes, graphenes or mixtures thereof as component B, c) from 0.1 to 3% by weight of ionic liquids as component C, wherein the thermoplastic molding composition does not comprise any polyamide-12 units.

Abstract: A polyamide composition contains the following components: (a) at least 40 parts by weight PA12; (b) 0.1-15 parts by weight of at least one salt with a non-metallic cation; (c) 0.1-25% by weight of at least one dispersant based on esters or amides; (d) a quantity of carbon nanotubes that produces in the molding compound a specific surface resistance according to IEC standard 60167 of maximum 10?1-1010?; (e) 0-5 parts by weight of at least one metal salt; and optionally (f) conventional auxiliary substances and additives, the sum of the parts by weight of components (a) to (f) amounting to 100. The polyamide composition can be used for manufacturing moldings with improved electrical conductivity and improved surface quality.

Abstract: A polyamide composition which provides moldings having a significantly reduced percolation threshold and an improved electrical conductivity is provided. The composition contains a) at least 40 parts by weight of a polyamide; b) from 0.15 to 25 parts by weight of an electrically conductive carbon; c) from 0.3 to 8 parts by weight of an oligofunctional compound; and, optionally, d) conventional auxiliaries and additives, wherein the electrically conductive carbon comprises at least one of carbon nanotubes and graphene, the oligofunctional compound comprises at least one functional group reactive with reactive groups on a surface of the electrically conductive carbon and at least one functional group reactive with an end group of the polyamide, and the sum of the parts by weight of the components a) to d) is 100.

Abstract: A polyamide composition which provides moldings having a significantly reduced percolation threshold and an improved electrical conductivity is provided. The composition contains a) at least 40 parts by weight of a polyamide; b) from 0.15 to 25 parts by weight of an electrically conductive carbon; c) from 0.3 to 8 parts by weight of an oligofunctional compound; and, optionally, d) conventional auxiliaries and additives, wherein the electrically conductive carbon comprises at least one of carbon nanotubes and graphene, the oligofunctional compound comprises at least one functional group reactive with reactive groups on a surface of the electrically conductive carbon and at least one functional group reactive with an end group of the polyamide, and the sum of the parts by weight of the components a) to d) is 100.

Abstract: A polyamide composition contains the following components: (a) at least 40 parts by weight PA12; (b) 0.1-15 parts by weight of at least one salt with a non-metallic cation; (c) 0.1-25% by weight of at least one dispersant based on esters or amides; (d) a quantity of carbon nanotubes that produces in the moulding compound a specific surface resistance according to IEC standard 60167 of maximum 10?1-1010?; (e) 0-5 parts by weight of at least one metal salt; and optionally (f) conventional auxiliary substances and additives, the sum of the parts by weight of components (a) to (f) amounting to 100. The polyamide composition can be used for manufacturing mouldings with improved electrical conductivity and improved surface quality.

Abstract: The thermoplastic molding composition comprises, based on the thermoplastic molding composition, a) as component A, at least one polyamide or copolyamide, or one polymer blend comprising polyamide, b) as component B, from 3 to 20% by weight of carbon black or graphite, or a mixture thereof, c) as component C, from 0.1 to 3% by weight of ionic liquids.

Abstract: The thermoplastic molding composition comprises, based on the thermoplastic molding composition, a) at least one polyamide, copolyamide or a polyamide-comprising polymer blend as component A, b) from 0.1 to 10% by weight of carbon nanotubes, graphenes or mixtures thereof as component B, c) from 0.1 to 3% by weight of ionic liquids as component C, wherein the thermoplastic molding composition does not comprise any polyamide-12 units.