Abstract: A lighting device comprises a support comprising a mounting section having at least one mounting face. The at least one mounting face has an arrangement direction and comprising at least two contact sections along the arrangement direction. The support further comprises a body section adjacent to the mounting section. The support further comprises a plurality of layered conductors connecting the body section to the at least one mounting face. The lighting device comprises at least one light-emitting element mounted along the arrangement direction of the at least one mounting face such that the at least one light-emitting element is in electrical contact to the at least two contact sections.

Abstract: A lighting device comprises a support comprising a mounting section having at least one mounting face. The at least one mounting face has an arrangement direction and comprising at least two contact sections along the arrangement direction. The support further comprises a body section adjacent to the mounting section. The support further comprises a plurality of layered conductors connecting the body section to the at least one mounting face. The lighting device comprises at least one light-emitting element mounted along the arrangement direction of the at least one mounting face such that the at least one light-emitting element is in electrical contact to the at least two contact sections.

Abstract: A support for light-emitting elements is disclosed. The support comprises a mounting section comprising at least one mounting face. The at least one mounting face has an arrangement direction and is configured to accommodate at least one light-emitting element along the arrangement direction. The support comprises a body section adjacent to the mounting section and having a length that extends parallel to the arrangement direction. The body section protrudes sidewards from the at least one mounting face. The support comprises a plurality of conductors connecting the body section to the at least one mounting face. Each contact section corresponds to a conductor. The plurality of conductors are a layered structure of conductors. An extension direction of the layered structure of the conductors extends substantially perpendicular to the arrangement direction of the at least one mounting face. The layered structure of conductors comprises an angled section.

Abstract: A lighting device, a method of manufacturing a lighting device and a support are described. A support includes a layered structure of alternating conductors and insulating layers. The layered structure includes a mounting section and a body section adjacent the mounting section. The mounting section includes at least one mounting face that has an arrangement direction and at least three alternating contact sections along the arrangement direction. Each contact section is electrically coupled to one of the conductors and separated from a neighboring one of the contact sections by one of the insulating layers. The body section has a width that protrudes sidewards from the at least one mounting face and a length that extends substantially parallel to the arrangement direction.

Abstract: A method of manufacturing an LED assembly is described. The method includes providing an LED package comprising one or more LEDs arranged in a support body and thermal and electrical contact regions on one or more surfaces of the support body. The method further includes providing a heatpipe and forming a thermal contact between a contact region of the LED package and a first end region of the heatpipe. An LED package, an LED assembly, and an LED lighting arrangement are also described.

Abstract: A method for applying at least one electronic component to a surface is described. The method includes placing a component stencil on a support. At least one electronic component is arranged in a corresponding opening of the component stencil with a top surface of the electronic component on the support. A contact material stencil is positioned on the component stencil such that at least one opening in the contact material stencil is over a corresponding contact region on the bottom surface of the at least one electronic component. A contact material is applied on the at least one contact region of the at least one electronic component within the corresponding opening of the contact material stencil. The contact material stencil is removed from the component stencil. The component stencil is removed from the support. The at least one electronic component is applied to the surface.

Abstract: A support for light-emitting elements is disclosed. The support comprises a mounting section comprising at least one mounting face. The at least one mounting face has an arrangement direction and is configured to accommodate at least one light-emitting element along the arrangement direction. The support comprises a body section adjacent to the mounting section and having a length that extends parallel to the arrangement direction. The body section protrudes sidewards from the at least one mounting face. The support comprises a plurality of conductors connecting the body section to the at least one mounting face. Each contact section corresponds to a conductor. The plurality of conductors are a layered structure of conductors. An extension direction of the layered structure of the conductors extends substantially perpendicular to the arrangement direction of the at least one mounting face. The layered structure of conductors comprises an angled section.

Abstract: A method of manufacturing an LED assembly is described. The method includes providing an LED package comprising one or more LEDs arranged in a support body and thermal and electrical contact regions on one or more surfaces of the support body. The method further includes providing a heatpipe and forming a thermal contact between a contact region of the LED package and a first end region of the heatpipe. An LED package, an LED assembly, and an LED lighting arrangement are also described.

Abstract: A method for applying at least one electronic component to a surface is described. The method includes placing a component stencil on a support. At least one electronic component is arranged in a corresponding opening of the component stencil with a top surface of the electronic component on the support. A contact material stencil is positioned on the component stencil such that at least one opening in the contact material stencil is over a corresponding contact region on the bottom surface of the at least one electronic component. A contact material is applied on the at least one contact region of the at least one electronic component within the corresponding opening of the contact material stencil. The contact material stencil is removed from the component stencil. The component stencil is removed from the support. The at least one electronic component is applied to the surface.

Abstract: A lighting device, a method of manufacturing a lighting device and a support are described. A support includes a layered structure of alternating conductors and insulating layers. The layered structure includes a mounting section and a body section adjacent the mounting section. The mounting section includes at least one mounting face that has an arrangement direction and at least three alternating contact sections along the arrangement direction. Each contact section is electrically coupled to one of the conductors and separated from a neighboring one of the contact sections by one of the insulating layers. The body section has a width that protrudes sidewards from the at least one mounting face and a length that extends substantially parallel to the arrangement direction.