Abstract: A method (200, 300, 500) for producing an electrically conductive pattern on substrate (202, 402), comprising: providing electrically conductive solid particles onto an area of the substrate in a predefined pattern (508), where the pattern (403) comprises a contact area (404B) for connecting to an electronic component and a conductive structure (404A) having at least a portion (414) adjacent to the contact area, heating the conductive particles to a temperature higher than a characteristic melting point of the particles to establish a melt (510), and pressing the melt against the substrate in a nip, the temperature of the contact portion of which being lower than the aforesaid characteristic melting point so as to solidify the particles into essentially electrically continuous layer within the contact area and within the conductive structure in accordance with the pattern (512), wherein the thermal masses of the contact area and the at least adjacent portion of the conductive structure are configured substant

Abstract: A cleaning arrangement for a coater that has a plate cylinder, the cleaning arrangement having a cleaning web, a tangential moving mechanism configured to controllably move the cleaning web in at least one direction in a plane defined by the cleaning web, a radial moving mechanism configured to controllably move the cleaning web in at least one direction out of the plane, and a controller coupled to the tangential and radial moving mechanisms which is configured to control the moving of the cleaning web into and out of contact with the plate cylinder in conformity with input signals received by the controller.

Abstract: A method and an arrangement are disclosed for transferring electrically conductive material in fluid form onto a substrate. Said substrate is preheated to a first temperature, and of said electrically conductive material there is produced fluid electrically conductive material. The fluid electrically conductive material is sprayed onto the preheated substrate to form a pattern of predetermined kind. The substrate onto which said fluid electrically conductive material was sprayed is cooled to a third temperature, which is lower than the melting point of said electrically conductive material.

Abstract: A method (200, 300, 500) for producing an electrically conductive pattern on substrate (202, 402), comprising: providing electrically conductive solid particles onto an area of the substrate in a predefined pattern (508), where the pattern (403) comprises a contact area (404B) for connecting to an electronic component and a conductive structure (404A) having at least a portion (414) adjacent to the contact area, heating the conductive particles to a temperature higher than a characteristic melting point of the particles to establish a melt (510), and pressing the melt against the substrate in a nip, the temperature of the contact portion of which being lower than the aforesaid characteristic melting point so as to solidify the particles into essentially electrically continuous layer within the contact area and within the conductive structure in accordance with the pattern (512), wherein the thermal masses of the contact area and the at least adjacent portion of the conductive structure are configured substant

Abstract: A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point.

Abstract: A chip attached to and electrically connected with a printed conductive surface, whereby the chip is heated to a temperature, which is lower than what the chip can stand without being damaged by the heat, the heated chip is then pressed against the printed conductive surface with a pressing force, whereby a combination of said temperature and said pressing force is sufficient to at least partly melt the material of at least one of the printed conductive surface, the contact point on the chip, or both, thereby attaching and electrically connecting the chip to the printed conductive surface.

Abstract: A coating unit is located after a sheet-fed digital printer on a manufacturing line. As a response to a workpiece entering the coating unit from the printer, coating substance is dosed onto a plate cylinder, and said plate cylinder is rotated to transfer said coating substance onto the workpiece, which is then transferred further on the manufacturing line. As a response to a first time limit expiring after transferring the workpiece further without a subsequent workpiece entering the coating unit, the rotation of the plate cylinder is stopped.

Abstract: The invention refers to a method to produce a packaging material comprising the steps of; treating at least one surface of a paperboard substrate with a binder and with a metal salt, printing at least a part of said treated surface with ink, and applying at least one polymer layer on said printed surface. The packaging material produced in accordance with the invention shows good printability and simultaneously good adhesion of the applied polymer layer.

Abstract: A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point.

Abstract: A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point.

Abstract: An apparatus comprises a stacker configured to stack planar workpieces into stacks, and a cutter configured to cut preforms out of planar workpieces. The cutter is located downstream of said stacker on a manufacturing line, and a conveyor exists between said stacker and cutter. The apparatus comprises a conveyor controller, which is configured to, after transferring a stack from said conveyor to a feeder section of said cutter; rewind the conveyor to place a foremost free location after existing stacks on the conveyor to a position where it is ready to receive a stack from said stacker.

Abstract: A coating unit is located after a sheet-fed digital printer on a manufacturing line. As a response to a workpiece entering the coating unit from the printer, coating substance is dosed onto a plate cylinder, and said plate cylinder is rotated to transfer said coating substance onto the workpiece, which is then transferred further on the manufacturing line. As a response to a first time limit expiring after transferring the workpiece further without a subsequent workpiece entering the coating unit, the rotation of the plate cylinder is stopped.

Abstract: An apparatus comprises a stacker configured to stack planar workpieces into stacks, and a cutter configured to cut preforms out of planar workpieces. The cutter is located downstream of said stacker on a manufacturing line, and a conveyor exists between said stacker and cutter. The apparatus comprises a conveyor controller, which is configured to, after transferring a stack from said conveyor to a feeder section of said cutter; rewind the conveyor to place a foremost free location after existing stacks on the conveyor to a position where it is ready to receive a stack from said stacker.

Abstract: A cleaning arrangement for a coater that has a plate cylinder, the cleaning arrangement having a cleaning web, a tangential moving mechanism configured to controllably move the cleaning web in at least one direction in a plane defined by the cleaning web, a radial moving mechanism configured to controllably move the cleaning web in at least one direction out of the plane, and a controller coupled to the tangential and radial moving mechanisms which is configured to control the moving of the cleaning web into and out of contact with the plate cylinder in conformity with input signals received by the controller.

Abstract: A method and an arrangement are disclosed for transferring electrically conductive material in fluid form onto a substrate. Said substrate is preheated to a first temperature, and of said electrically conductive material there is produced fluid electrically conductive material. The fluid electrically conductive material is sprayed onto the preheated substrate to form a pattern of predetermined kind. The substrate onto which said fluid electrically conductive material was sprayed is cooled to a third temperature, which is lower than the melting point of said electrically conductive material.

Abstract: A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point.

Abstract: An apparatus, a method, a planar insulating substrate and a chipset have been presented, comprising at least one module configured to establish a predefined pattern on a planar insulating substrate so that conductive particles can gather according to the predefined pattern. At least one another module is configured to transfer the conductive particles to the planar insulating substrate, wherein the conductive particles are arranged to gather according to the predefined pattern. A sintering module is configured to fuse the conductive particles on the planar insulating substrate, wherein the conductive particles are arranged to fuse according to the predefined pattern to establish a conductive plane on the planar insulating substrate. Embodiment of the invention relate to printable or printing electronics on a fibrous web.

Abstract: A chip is attached to a printed conductive surface. The chip is first heated to a first temperature, which is lower than what the chip can stand without being damaged by the heat. The heated chip is pressed against the printed conductive surface with a first pressing force. A combination of said first temperature and said first pressing force is sufficient to at least partly melt the material of at least one of: the printed conductive surface, contact point on the chip.

Abstract: Packages are manufactured in a digitally controlled process. A digital printing machine (101) produces printed workpieces and a cutting machine (104) cuts packaging blanks (105) from them. A conveyor line (107) transfers the printed work-pieces automatically from the digital printing machine (101) to the cutting machine (104). A digital control system (109) exchanges digital control information with at least the digital printing machine (101) and the cutting machine (104).

Abstract: A chip attached to and electrically connected with a printed conductive surface, whereby the chip is heated to a temperature, which is lower than what the chip can stand without being damaged by the heat, the heated chip is then pressed against the printed conductive surface with a pressing force, whereby a combination of said temperature and said pressing force is sufficient to at least partly melt the material of at least one of the printed conductive surface, the contact point on the chip, or both, thereby attaching and electrically connecting the chip to the printed conductive surface.