Abstract: The present invention relates to a method for manufacturing an organic electronic device, comprising providing by electro-deposition an electrode to a surface of an electro-active material—the electro-active material comprising an organic electro-active compound—or providing said electrode to a surface of a substrate for said electro-active material, after which the electro-active material is applied to a surface of the electrode, wherein the electro-deposition comprises the use of a plating liquid comprising an ionic liquid and metal or metalloid ions which metal or metalloid ions are reduced and deposited to form the electrode.

Abstract: The invention is directed to a method for preparing a deposition on a substrate and to a method for manufacturing an electronic or optoelectronic device. The method of the invention comprises —providing an anode comprising electrolytically ionisable material and a cathode both in contact with an electrically conductive liquid, comprising anions capable of forming a molecule with the electrolytically ionised material; —electrolytically oxidising the ionisable material under formation of cations that dissolve in the liquid; —evaporating the molecules formed from the cations and the anions from the liquid; and —depositing the molecules on the substrate.

Abstract: The present invention relates to a method for manufacturing an organic electronic device, comprising providing by electro-deposition an electrode to a surface of an electro-active material—the electro-active material comprising an organic electro-active compound—or providing said electrode to a surface of a substrate for said electro-active material, after which the electro-active material is applied to a surface of the electrode, wherein the electro-deposition comprises the use of a plating liquid comprising an ionic liquid and metal or metalloid ions which metal or metalloid ions are reduced and deposited to form the electrode.

Abstract: The invention relates to a method for manufacturing an article comprising a barrier layer, the method comprising—providing an metallic or metalloid layer to a surface of a substrate by electro-deposition, using a plating liquid comprising an ionic liquid and metal ions or metalloid ions, which metal ions or metalloid ions are reduced and deposited to form the metallic or metalloid layer during the electro-deposition; and—preferably at least partially oxidising the metallic or metalloid layer.