Abstract: Systems and methods for processing wafers, a combined post expose bake and chill unit, and an interface are disclosed. An exemplary system includes a lithography tool, local track, transfer device, transfer device handler, interface unit, and controller to schedule processing. An exemplary combined post expose bake and chill unit includes an enclosure having an opening in its side, and a bake unit and a chill unit in the enclosure. An exemplary interface includes a plurality of enclosures arranged around robot(s) that transfer wafers among the enclosures, one of the plurality of enclosures being an integrated bake and chill unit.

Abstract: Systems and methods for processing wafers, a combined post expose bake and chill unit, and an interface are disclosed. An exemplary system includes a lithography tool, local track, transfer device, transfer device handler, interface unit, and controller to schedule processing. An exemplary combined post expose bake and chill unit includes an enclosure having an opening in its side, and a bake unit and a chill unit in the enclosure. An exemplary interface includes a plurality of enclosures arranged around robot(s) that transfer wafers among the enclosures, one of the plurality of enclosures being an integrated bake and chill unit.

Abstract: A support device comprises a first and a second bearing unit for guiding the support device along a base surface and a straight guide extending parallel to the base surface, respectively. The support device has an object table which is coupled to a rigidification member and which is displaceable relative to the two bearing units in a z-direction transverse to the base surface and is tiltable about at least one axis of rotation directed parallel to the base surface by three force actuators. The rigidification member is coupled to the second bearing unit by a coupling member which is elastically deformable in the z-direction, and coupled to the first bearing unit via the force actuators, whereby a statically determined coupling of the rigidification member and the object table to the two bearing units is obtained. The support device is particularly suitable for displacements of an object in the sub-micron range, such as, for example, in an optical lithographic device.