Patents by Inventor Pey Eik Foo

Pey Eik Foo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE, LEADFRAME AND METHOD OF ENCAPSULATING
    Publication number: 20100193920
    Abstract: A semiconductor device is disclosed having a leadframe comprising a first chip island and a second chip island. Each chip island of the leadframe has a first face and a second face. A first chip is attached to the first face of the first chip island and a second chip attached to the first face of the second chip island. A layer of encapsulation material forming an encapsulation material layer covers the second faces of the first and second chip islands where the thickness of the encapsulation material layer along the second face of the first chip island is different from the thickness of the encapsulation material layer along the second face of the second chip island.
    Type: Application
    Filed: January 30, 2009
    Publication date: August 5, 2010
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Yong Chern Poh, Yang Hong Heng, Pey Eik Foo