Abstract: An embodiment is a technique to classify a flash device. Test data to a flash device are accessed in unscramble and scramble modes under a test mode. Error correcting code (ECC) results are recorded on the test data for the unscramble and scramble modes. A device quality figure is calculated based on the ECC results for the unscramble and scramble modes. The flash device is classified using the device quality figure.

Abstract: A side clip has a clip base attached to a socket connector and a first clip member and a second clip member extending from the clip base. The first clip member has a terminal for attaching to a printed circuit board. The second clip member is spaced in parallel from the first member and connected to the first clip member by a distal segment to form an opening. A side retainer has a retainer base having first and second ends and first, second, third, and fourth retainer members extending vertically from the retainer base. The first retainer member fits a hole on a board held by the side clip. The second retainer member is located at the first end and has an inward hook. The fourth retainer member is located on the second end and has an outward hook.

Abstract: An embodiment is a technique to classify a flash device. Test data to a flash device are accessed in unscramble and scramble modes under a test mode. Error correcting code (ECC) results are recorded on the test data for the unscramble and scramble modes. A device quality figure is calculated based on the ECC results for the unscramble and scramble modes. The flash device is classified using the device quality figure.

Abstract: A side clip has a clip base attached to a socket connector and a first clip member and a second clip member extending from the clip base. The first clip member has a terminal for attaching to a printed circuit board. The second clip member is spaced in parallel from the first member and connected to the first clip member by a distal segment to form an opening. A side retainer has a retainer base having first and second ends and first, second, third, and fourth retainer members extending vertically from the retainer base. The first retainer member fits a hole on a board held by the side clip. The second retainer member is located at the first end and has an inward hook. The fourth retainer member is located on the second end and has an outward hook.

Abstract: An embodiment is a method and apparatus to provide thermal management for a memory module with a heat sink. A top element has a first portion with a top area covering a substantial top surface of the memory module and a second portion bent at an angle that is substantially perpendicular to the first portion and having a height that is approximately equal to thickness of the memory module. A bottom element has a third portion with a bottom area covering a substantial bottom surface of a memory module and a fourth portion bent at an angle that is substantially perpendicular to the third portion and having a height that is approximately equal to the thickness of the memory module. The fourth portion is attached to the second portion.

Abstract: An embodiment is a method and apparatus to provide a side lock assembly for a memory module with a heat sink A side clip has a clip base attached to a socket connector and a first clip member and a second clip member extending from the clip base. The first clip member has a terminal for attaching to a printed circuit board. The second clip member is spaced in parallel from the first member to form an opening. A side lock has a lock base and first and second lock members that form a slot. The first and second lock members flank the second clip member such that the second clip member fits into the slot and the first lock member fits into the opening.

Abstract: An embodiment is a method and apparatus to provide an insertion tool for a memory module. First and second spacers are located at a predetermined distance. Each has a flat top surface and a bottom surface with a longitudinal opening having a narrow width that accommodates a first thickness of a printed circuit board (PCB). First and second guides are attached to sides of the first and second spacers, respectively, such that a guide distance between the first and second guides corresponds to a combined thickness of the first thickness and side thicknesses of a socket connector into which the PCB is inserted. Each of the first and second guides has two end portions that extend downward by a height.