Abstract: An embodiment is a method and apparatus to stack devices. A first finished package level (FPL) device having a first grounded tested die (GTD) is reduced to nearly size of the first GTD. The first FPL has a first plurality of solder balls. The reduced first FPL device is attached to a first substrate to form a first device assembly.

Abstract: An embodiment of the present invention is a technique to stack multiple devices using an interconnecting element. A board has a periphery and top and bottom surfaces. The top surface has top contact pads to attach to a first device. The bottom surface is milled down to form a cavity confined by vertical walls around the periphery. The cavity fits a second device. Bottom contact pads are formed on bottom side of the vertical walls. The bottom contact pads are raised with respect to the bottom side of the vertical walls. Traces internal to the board connect the bottom contact pads to the top contact pads.

Abstract: An embodiment is a method and apparatus to save data during power failure. A power supply generator generates operating voltages to a circuit from a generator supply source. A power monitor monitors a normal supply voltage and a backup supply voltage to provide a normal supply voltage to the generator supply source in a normal mode and to provide a backup supply voltage to the generator supply source in a power failure mode. A data transfer circuit transfers data from a volatile memory in the circuit to a non-volatile memory during the power failure mode.

Abstract: An embodiment is a method and apparatus to provide a multi-function module. A circuit board has a form factor and a connector edge corresponding to a first interface standard. The connector edge includes first and second groups of pin-outs that are mapped to pin-out assignments compatible with the first interface standard and a second interface standard, respectively. A first interface is provided on the circuit board for a first set of devices connected to the first group of pin-outs to operate according to the first interface standard. A second interface is provided on the circuit board for a second set of devices connected to the second group of pin-outs to operate according to the second interface standard.

Abstract: An embodiment is a method and apparatus to save data during power failure. A power supply generator generates operating voltages to a circuit from a generator supply source. A power monitor monitors a normal supply voltage and a backup supply voltage to provide a normal supply voltage to the generator supply source in a normal mode and to provide a backup supply voltage to the generator supply source in a power failure mode. A data transfer circuit transfers data from a volatile memory in the circuit to a non-volatile memory during the power failure mode.

Abstract: An embodiment is a method and apparatus to stack devices. A first finished package level (FPL) device having a first grounded tested die (GTD) is reduced to nearly size of the first GTD. The first FPL has a first plurality of solder balls. The reduced first FPL device is attached to a first substrate to form a first device assembly.

Abstract: An embodiment of the present invention is a technique to stack multiple devices using an interconnecting element. A board has a periphery and top and bottom surfaces. The top surface has top contact pads to attach to a first device. The bottom surface is milled down to form a cavity confined by vertical walls around the periphery. The cavity fits a second device. Bottom contact pads are formed on bottom side of the vertical walls. The bottom contact pads are raised with respect to the bottom side of the vertical walls. Traces internal to the board connect the bottom contact pads to the top contact pads.

Abstract: An embodiment is a method and apparatus to provide a multi-function module. A circuit board has a form factor and a connector edge corresponding to a first interface standard. The connector edge includes first and second groups of pin-outs that are mapped to pin-out assignments compatible with the first interface standard and a second interface standard, respectively. A first interface is provided on the circuit board for a first set of devices connected to the first group of pin-outs to operate according to the first interface standard. A second interface is provided on the circuit board for a second set of devices connected to the second group of pin-outs to operate according to the second interface standard.

Abstract: An embodiment of the present invention is a technique to stack multiple devices using an interconnecting element. A board has a periphery and top and bottom surfaces. The top surface has top contact pads to attach to a first device. The bottom surface is milled down to form a cavity confined by vertical walls around the periphery. The cavity fits a second device. Bottom contact pads are formed on bottom side of the vertical walls. The bottom contact pads are raised with respect to the bottom side of the vertical walls. Traces internal to the board connect the bottom contact pads to the top contact pads.

Abstract: An embodiment is a method and apparatus to provide a multi-function module. A circuit board has a form factor and a connector edge corresponding to a first interface standard. The connector edge includes first and second groups of pin-outs that are mapped to pin-out assignments compatible with the first interface standard and a second interface standard, respectively. A first interface is provided on the circuit board for a first set of devices connected to the first group of pin-outs to operate according to the first interface standard. A second interface is provided on the circuit board for a second set of devices connected to the second group of pin-outs to operate according to the second interface standard.

Abstract: An embodiment is a method and apparatus to provide a multi-function module. A circuit board has a form factor and a connector edge corresponding to a first interface standard. The connector edge includes first and second groups of pin-outs that are mapped to pin-out assignments compatible with the first interface standard and a second interface standard, respectively. A first interface is provided on the circuit board for a first set of devices connected to the first group of pin-outs to operate according to the first interface standard. A second interface is provided on the circuit board for a second set of devices connected to the second group of pin-outs to operate according to the second interface standard.

Abstract: One embodiment of the invention includes a flexible circuit and a stiffener. The flexible circuit has first, second, and third portions. The first portion is folded on an upper surface of the third portion and has first contact elements attached to a first device. The second portion is folded on the first device and has second contact elements attached to a second device. The stiffener is attached to the upper surface of the third portion and located between the upper surface of the third portion and the first portion.

Abstract: In one embodiment of the invention, a stacking element includes a printed circuit board (PCB) and a plurality of solder bumps. The PCB has a top side and a bottom side. The top side is attached to first pins of a first device. The plurality of solder bumps are on the bottom side and attached to upper areas of second pins of a second device to provide electrical connections between the first pins and the second pins.

Abstract: In one embodiment of the invention, a stacking element includes a printed circuit board (PCB) and a plurality of solder bumps. The PCB has a top side and a bottom side. The top side is attached to first pins of a first device. The plurality of solder bumps are on the bottom side and attached to upper areas of second pins of a second device to provide electrical connections between the first pins and the second pins.

Abstract: In one embodiment of the invention, a stacking element includes a printed circuit board (PCB) and a plurality of solder bumps. The PCB has a top side and a bottom side. The top side is attached to first pins of a first device. The plurality of solder bumps are on the bottom side and attached to upper areas of second pins of a second device to provide electrical connections between the first pins and the second pins.