Patents by Inventor Phang Kah Yuan

Phang Kah Yuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical communications device having electrical bond pads that are protected by a protective coating, and a method for applying the protective coating
    Patent number: 9086553
    Abstract: A protective coating encapsulates bond pads disposed on a substrate of an optical communications module and extends in between the bond pads. The protective coating has characteristics that (1) increase the dielectric resistances between adjacent bond pads on the substrate, (2) protect the bond pads from moisture in the environment, and (3) prevents, or at least reduces, ion migration between adjacent bond pads. In this way, the protective coating prevents, or at least reduces, corrosion growth that can lead to impedance degradation and electrical shorts between adjacent bond pads.
    Type: Grant
    Filed: June 27, 2011
    Date of Patent: July 21, 2015
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Goh Han Peng, Phang Kah Yuan, De Mesa Eduardo Alicaya
  • OPTICAL COMMUNICATIONS DEVICE HAVING ELECTRICAL BOND PADS THAT ARE PROTECTED BY A PROTECTIVE COATING, AND A METHOD FOR APPLYING THE PROTECTIVE COATING
    Publication number: 20120328303
    Abstract: A protective coating encapsulates bond pads disposed on a substrate of an optical communications module and extends in between the bond pads. The protective coating has characteristics that (1) increase the dielectric resistances between adjacent bond pads on the substrate, (2) protect the bond pads from moisture in the environment, and (3) prevents, or at least reduces, ion migration between adjacent bond pads. In this way, the protective coating prevents, or at least reduces, corrosion growth that can lead to impedance degradation and electrical shorts between adjacent bond pads.
    Type: Application
    Filed: June 27, 2011
    Publication date: December 27, 2012
    Applicant: AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD.
    Inventors: Goh Han Peng, Phang Kah Yuan, De Mesa Eduardo Alicaya