Abstract: Technologies for memory on package with reduced package thickness are disclosed. In the illustrative embodiment, a die assembly includes a substrate with a processor die mounted on the top surface and a memory die mounted on the bottom surface. The die assembly is mounted on another substrate, such as a mainboard. A cavity is defined in the mainboard, and the memory die mounted on the bottom surface of the die assembly is positioned in the cavity. Positioning the memory die on the bottom surface of the die assembly can reduce the overall thickness of the die assembly and, therefore, can reduce the overall thickness of a device that incorporates the die assembly.

Abstract: Methods for automatic calibration of a braille interface. In embodiments, a user begins typing braille characters in 2×3 matrix into an interface without an initial calibration step. The implementing system detects the patterns of the keystrokes and determines the orientation and placement of the user's hands by comparing the keystrokes against known braille characters, identifying which row and column of the 2×3 matrix within which each finger is positioned. The interface is then calibrated based on the identified positions of the fingers within the 2×3 matrix. For touch interfaces, the surface area of each finger may also be used to enhance identification of fingers. Other embodiments may be described and/or claimed.

Abstract: A computing device with a closable lid and camera on the lid has a reflector arranged to use the camera while the lid of the computing device is closed.