Abstract: Aspects of a storage device including a memory and controller are provided which allow for erase voltages applied during erase operations to be adaptively changed at elevated temperatures to reduce erase time and prevent erase failures. In response to detecting a lower temperature of the memory, the controller applies a first erase voltage to cells in a block of a die, and in response to detecting a higher temperature of the memory, the controller applies a second erase voltage larger than the first erase voltage to the cells in the block of the die. The controller may apply the different erase voltages depending on whether the temperature of the die falls within respective temperature ranges or meets a respective temperature threshold, which may change for different dies. As a result, successful erase operations at higher temperatures may be achieved.

Abstract: A memory controller includes, in one embodiment, a memory interface and a controller circuit. The memory interface is configured to interface with a memory having a plurality of wordlines. The controller circuit is configured to program, with foggy-fine programming, a first portion of the plurality of wordlines to store first program data, program, with the foggy-fine programming, one or more wordlines of the plurality of wordlines in a non-fine state, the one or more wordlines neighboring the first portion, and program, with the foggy-fine programming, a second portion of the plurality of wordlines to store second program data, the second portion neighboring the one or more wordlines.

Abstract: Aspects of a storage device including a memory and controller are provided which allow for erase voltages applied during erase operations to be adaptively changed at elevated temperatures to reduce erase time and prevent erase failures. In response to detecting a lower temperature of the memory, the controller applies a first erase voltage to cells in a block of a die, and in response to detecting a higher temperature of the memory, the controller applies a second erase voltage larger than the first erase voltage to the cells in the block of the die. The controller may apply the different erase voltages depending on whether the temperature of the die falls within respective temperature ranges or meets a respective temperature threshold, which may change for different dies. As a result, successful erase operations at higher temperatures may be achieved.

Abstract: A memory controller includes, in one embodiment, a memory interface and a controller circuit. The memory interface is configured to interface with a memory having a plurality of wordlines. The controller circuit is configured to program, with foggy-fine programming, a first portion of the plurality of wordlines to store first program data, program, with the foggy-fine programming, one or more wordlines of the plurality of wordlines in a non-fine state, the one or more wordlines neighboring the first portion, and program, with the foggy-fine programming, a second portion of the plurality of wordlines to store second program data, the second portion neighboring the one or more wordlines.