Abstract: In accordance with the present invention, an ear tip for increasing mid-range frequency perception of an earpiece is provided. The ear tip includes a hollow main body having a first end defining a first opening and a second end defining a second opening for coupling to a coupling portion of a housing of the earpiece, and a peripheral portion integrally coupled to an outer surface of the first opening and shaped to conform to a surface of an ear canal. The peripheral portion has an outer edge with a plurality of wedge-shaped apertures formed integrally and spaced around the outer edge. The second opening and/or the coupling portion of the housing are adapted to be acoustically coupled with each other.

Abstract: In accordance with the present invention, an ear tip for increasing mid-range frequency perception of an earpiece is provided. The ear tip includes a hollow main body having a first end defining a first opening and a second end defining a second opening for coupling to a coupling portion of a housing of the earpiece, and a peripheral portion integrally coupled to an outer surface of the first opening and shaped to conform to a surface of an ear canal. The peripheral portion has an outer edge with a plurality of wedge-shaped apertures formed integrally and spaced around the outer edge. The second opening and/or the coupling portion of the housing are adapted to be acoustically coupled with each other.

Abstract: Systems and methods are provided herein for implementing a programmable integrated circuit device that enables high-speed FPGA boot-up through a significant reduction of configuration time. By enabling high-speed FPGA boot-up, the programmable integrated circuit device will be able to accommodate applications that require faster boot-up time than conventional programmable integrated circuit devices are able to accommodate. In order to enable high-speed boot-up, dedicated address registers are implemented for each data line segment of a data line, which in turn significantly reduces configuration random access memory (CRAM) write time (e.g., by a factor of at least two).

Abstract: Systems and methods are provided herein for implementing a programmable integrated circuit device that enables high-speed FPGA boot-up through a significant reduction of configuration time. By enabling high-speed FPGA boot-up, the programmable integrated circuit device will be able to accommodate applications that require faster boot-up time than conventional programmable integrated circuit devices are able to accommodate. In order to enable high-speed boot-up, dedicated address registers are implemented for each data line segment of a data line, which in turn significantly reduces configuration random access memory (CRAM) write time (e.g., by a factor of at least two).

Abstract: Systems and methods are provided herein for implementing a programmable integrated circuit device that enables high-speed FPGA boot-up through a significant reduction of configuration time. By enabling high-speed FPGA boot-up, the programmable integrated circuit device will be able to accommodate applications that require faster boot-up time than conventional programmable integrated circuit devices are able to accommodate. In order to enable high-speed boot-up, dedicated address registers are implemented for each data line segment of a data line, which in turn significantly reduces configuration random access memory (CRAM) write time (e.g., by a factor of at least two).

Abstract: Systems and methods are provided herein for implementing a programmable integrated circuit device that enables high-speed FPGA boot-up through a significant reduction of configuration time. By enabling high-speed FPGA boot-up, the programmable integrated circuit device will be able to accommodate applications that require faster boot-up time than conventional programmable integrated circuit devices are able to accommodate. In order to enable high-speed boot-up, dedicated address registers are implemented for each data line segment of a data line, which in turn significantly reduces configuration random access memory (CRAM) write time (e.g., by a factor of at least two).

Abstract: Systems and methods are provided herein for implementing a programmable integrated circuit device that enables high-speed FPGA boot-up through a significant reduction of configuration time. By enabling high-speed FPGA boot-up, the programmable integrated circuit device will be able to accommodate applications that require faster boot-up time than conventional programmable integrated circuit devices are able to accommodate. In order to enable high-speed boot-up, dedicated address registers are implemented for each data line segment of a data line, which in turn significantly reduces configuration random access memory (CRAM) write time (e.g., by a factor of at least two).

Abstract: Systems and methods are provided herein for implementing a programmable integrated circuit device that enables high-speed FPGA boot-up through a significant reduction of configuration time. By enabling high-speed FPGA boot-up, the programmable integrated circuit device will be able to accommodate applications that require faster boot-up time than conventional programmable integrated circuit devices are able to accommodate. In order to enable high-speed boot-up, dedicated address registers are implemented for each data line segment of a data line, which in turn significantly reduces configuration random access memory (CRAM) write time (e.g., by a factor of at least two).

Abstract: A first riser card of an apparatus in an example substantially axially connects with a first serial connection external interface of a printed circuit board (PCB) and at least in part laterally connects with a parallel connection external interface of a first memory module. The first riser card supports the first memory module with avoidance of abutment of the first memory module with a second memory module supported by a second riser card that is adjacent to the first riser card.

Abstract: A first riser card of an apparatus in an example substantially axially connects with a first serial connection external interface of a printed circuit board (PCB) and at least in part laterally connects with a parallel connection external interface of a first memory module. The first riser card supports the first memory module with avoidance of abutment of the first memory module with a second memory module supported by a second riser card that is adjacent to the first riser card.

Abstract: A laser annealing method includes forming a nitrogen-doped layer on a semiconductor layer, the nitrogen-doped layer having a nitrogen concentration of at least 3×1020 atoms/cc, irradiating a first area of the nitrogen-doped layer in a low oxygen environment with a laser beam and irradiating a second area of the nitrogen-doped layer in a low oxygen environment with a laser beam, a part of the second area overlapping with the first area.

Abstract: A fan holder includes a casing structure having a first side and a second side. The casing structure includes a base, fan compartments extending from the base, and cable channels extending from the first side to the second side within the base. Each of the cable channels is configured to removably secure at least one of a plurality of cables.

Abstract: A tissue retractor for retracting tissue opened by an incision, the tissue retractor including a base support unit having a topside and an underside. The topside has at least one securing mechanism and the underside is conformable and removably attachable to a surface proximate to the incision. The tissue retractor has a tissue hook having a tissue engagement portion and a mounting portion, the tissue engagement portion capable of engaging at least the periphery of the incision. The tissue retractor has a retractable member substantially inelastic in its central longitudinal axis and bendable in any axes deviating from the central longitudinal axis. The retractable member receives the mounting portion of the tissue hook, the retractable member being removably attachable to said securing mechanism on the topside of the base support unit, and being retractable away from the incision, such that the tissue engagement portion retracts tissue engaged thereto.

Abstract: A first riser card of an apparatus in an example substantially axially connects with a first serial connection external interface of a printed circuit board (PCB) and at least in part laterally connects with a parallel connection external interface of a first memory module. The first riser card supports the first memory module with avoidance of abutment of the first memory module with a second memory module supported by a second riser card that is adjacent to the first riser card.

Abstract: A laser annealing method includes forming a nitrogen-doped layer on a semiconductor layer, the nitrogen-doped layer having a nitrogen concentration of at least 3×1020 atoms/cc, irradiating a first area of the nitrogen-doped layer in a low oxygen environment with a laser beam and irradiating a second area of the nitrogen-doped layer in a low oxygen environment with a laser beam, a part of the second area overlapping with the first area.

Abstract: A first riser card of an apparatus in an example substantially axially connects with a first serial connection external interface of a printed circuit board (PCB) and at least in part laterally connects with a parallel connection external interface of a first memory module. The first riser card supports the first memory module with avoidance of abutment of the first memory module with a second memory module supported by a second riser card that is adjacent to the first riser card.

Abstract: A laser annealing method includes forming a nitrogen-doped layer on a semiconductor layer, the nitrogen-doped layer having a nitrogen concentration of at least 3×1020 atoms/cc, irradiating a first area of the nitrogen-doped layer in a low oxygen environment with a laser beam and irradiating a second area of the nitrogen-doped layer in a low oxygen environment with a laser beam, a part of the second area overlapping with the first area.

Abstract: A fan holder includes a casing structure having a first side and a second side. The casing structure includes a base, fan compartments extending from the base, and cable channels extending from the first side to the second side within the base. Each of the cable channels is configured to removably secure at least one of a plurality of cables.

Abstract: A laser annealing method includes forming a nitrogen-doped layer on a semiconductor layer, the nitrogen-doped layer having a nitrogen concentration of at least 3×1020 atoms/cc, irradiating a first area of the nitrogen-doped layer in a low oxygen environment with a laser beam and irradiating a second area of the nitrogen-doped layer in a low oxygen environment with a laser beam, a part of the second area overlapping with the first area.

Abstract: A first riser card of an apparatus in an example substantially axially connects with a first serial connection external interface of a printed circuit board (PCB) and at least in part laterally connects with a parallel connection external interface of a first memory module. The first riser card supports the first memory module with avoidance of abutment of the first memory module with a second memory module supported by a second riser card that is adjacent to the first riser card.