Abstract: Power amplifier supply networks with harmonic terminations are disclosed. In certain embodiments, a power amplifier system includes a first power amplifier that amplifies a first radio frequency (RF) signal of a first fundamental frequency, a second power amplifier that amplifies a second RF signal of a second fundamental frequency, and a power amplifier supply network that distributes a power amplifier supply voltage to the first power amplifier at a first distribution node and to the second power amplifier at a second distribution node. The power amplifier supply network includes a first harmonic termination circuit connected to the first distribution node that provide an open circuit at about twice the first fundamental frequency, and a second harmonic termination circuit connected to the second distribution node and that provides an open circuit at about twice the fundamental frequency.

Abstract: Described herein are systems configured for carrier aggregation. Systems include a multiplexing circuit having a filter assembly, switching circuit with a switching path, and a switchable impedance. The filters can be designed so that when operated simultaneously (e.g., during multi-band operation) the same inductance can be used allowing the switching network to switch in a particular inductance into the path. The described systems can include an inductance that is coupled to an output port so that when operating in single-band mode, the different paths share the same inductance. Relative to other solutions, the described systems can improve performance (e.g., reduce insertion loss), reduce the number of components in the associated module, reduce manufacturing costs, and the like.

Abstract: Described herein are systems configured for carrier aggregation. Systems include a multiplexing circuit having a filter assembly, switching circuit with a switching path, and a switchable impedance. The filters can be designed so that when operated simultaneously (e.g., during multi-band operation) the same inductance can be used allowing the switching network to switch in a particular inductance into the path. The described systems can include an inductance that is coupled to an output port so that when operating in single-band mode, the different paths share the same inductance. Relative to other solutions, the described systems can improve performance (e.g., reduce insertion loss), reduce the number of components in the associated module, reduce manufacturing costs, and the like.

Abstract: Described herein are systems configured for inter-band carrier aggregation. Systems include a multiplexing circuit having a switching network and diplexers wherein the switching network is configured to share inductors between multiple paths of the multiplexing circuit. The filters can be designed so that when operated simultaneously (e.g., during multi-band operation) the same inductance can be used allowing the switching network to switch in a particular inductance into the path. The described systems can include an inductance that is coupled to an output port so that when operating in single-band mode, the different paths share the same inductance. Relative to other solutions, the described systems can improve performance (e.g., reduce insertion loss), reduce the number of components in the associated module, reduce manufacturing costs, and the like.

Abstract: Described herein are systems configured for inter-band carrier aggregation. Systems include a multiplexing circuit having a switching network and diplexers wherein the switching network is configured to share inductors between multiple paths of the multiplexing circuit. The filters can be designed so that when operated simultaneously (e.g., during multi-band operation) the same inductance can be used allowing the switching network to switch in a particular inductance into the path. The described systems can include an inductance that is coupled to an output port so that when operating in single-band mode, the different paths share the same inductance. Relative to other solutions, the described systems can improve performance (e.g., reduce insertion loss), reduce the number of components in the associated module, reduce manufacturing costs, and the like.