Patents by Inventor Phil Frausto

Phil Frausto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170076923
    Abstract: A sputter target assembly comprising a Si target and a backing plate is provided wherein the backing plate is bonded to the target. The Si target comprises a smooth, mirror-like surface and has a surface roughness of less than about 15.0 Angstroms. Methods are provided for producing silicon target/backing plate assemblies wherein a silicon blank is processed to remove scratches from the blank surface resulting in a mirror like surface on the target, and a surface roughness of 15.0 Angstroms or less. The method comprises a first and second cleaning step with the first step being performed before the scratch removal step, and the second step being performed after the scratch removal.
    Type: Application
    Filed: November 29, 2016
    Publication date: March 16, 2017
    Inventors: Yongwen Yuan, Eugene Y. Ivanov, Yang Liu, Phil Frausto, Weifang Miao
  • Patent number: 9566618
    Abstract: A sputter target assembly comprising a Si target and a backing plate is provided wherein the backing plate is bonded to the target. The Si target comprises a smooth, mirror-like surface and has a surface roughness of less than about 15.0 Angstroms. Methods are provided for producing silicon target/backing plate assemblies wherein a silicon blank is processed to remove scratches from the blank surface resulting in a mirror like surface on the target, and a surface roughness of 15.0 Angstroms or less. The method comprises a first and second cleaning step with the first step being performed before the scratch removal step, and the second step being performed after the scratch removal.
    Type: Grant
    Filed: November 7, 2012
    Date of Patent: February 14, 2017
    Assignee: Tosoh SMD, Inc.
    Inventors: Yongwen Yuan, Eugene Y. Ivanov, Yang Liu, Phil Frausto, Weifang Miao
  • Publication number: 20140311900
    Abstract: A sputter target assembly comprising a Si target and a backing plate is provided wherein the backing plate is bonded to the target. The Si target comprises a smooth, mirror-like surface and has a surface roughness of less than about 15.0 Angstroms. Methods are provided for producing silicon target/backing plate assemblies wherein a silicon blank is processed to remove scratches from the blank surface resulting in a mirror like surface on the target, and a surface roughness of 15.0 Angstroms or less. The method comprises a first and second cleaning step with the first step being performed before the scratch removal step, and the second step being performed after the scratch removal.
    Type: Application
    Filed: November 7, 2012
    Publication date: October 23, 2014
    Inventors: Yongwen Yuan, Eugene Y. Ivanov, Yang Liu, Phil Frausto, Weifang Miao