Abstract: An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

Abstract: Examples described herein relate to a cold plate. In some examples, the cold plate includes a surface with fins and at least two channels, wherein a first channel is shaped with a first opening extending towards the surface, a second opening proximate and across a first fin attached to the surface, and a third opening from the surface and extending away from the surface. In some examples, when a fluid is provided to the first opening, the first opening directs the fluid towards the surface, the second opening directs the fluid across the first fin, and the third opening directs the fluid away from the surface. In some examples, the second opening comprises split openings around opposite sides of the first fin.

Abstract: Damping structures in integrated circuit (IC) devices, and techniques for forming the structures are discussed. An IC device includes, between an IC package and a socket, both a spring force and a damping structure adjacent an array of pins and corresponding lands. The damping structure may be of a dissipative, viscous, or viscoelastic material. The damping structure may be between the IC package and socket. The damping structure may be within a periphery of the socket. The damping structure may be coupled to the IC package or the socket by an adhesive or a press fit. A heatsink or a heat spreader may be coupled to the IC package over the socket.

Abstract: Integrated circuit packages with dampeners to reduce vibration effects are disclosed. An example apparatus comprises a substrate, a semiconductor die carried by the substrate, and a dampener carried by the substrate. Further, the example dampener is dimensioned to interface with a heatsink when the heatsink is thermally coupled to the semiconductor die.

Abstract: Damping assemblies for heat sinks and related methods are disclosed. An example apparatus includes a chassis; a first heat sink associated with an electronic component in the chassis; a second heat sink coupled to the first heat sink, the second heat sink spaced apart from the first heat sink in the chassis; and damping material proximate to the second heat sink.

Abstract: In some embodiments, an immersion cooling system comprises a spring damper, a crumple block, a frictional layer, and/or preloaded spring-based mounts to mitigate the effects of seismic events. In other embodiments, the combined mass of liquids in the immersion tank and a compensation tank is kept constant to maintain the system's response to seismic events. In still other embodiments, an immersion cooling system comprises a tunable mass to provide an active response to seismic events. In yet other embodiments, an immersion tank is located within a housing pallet and is moveable within the palette. Spring dampers dampen tank movement within the pallet and shutoff switches housed in the pallet cause power to components in the tank to be shut off in response to tank movement. Cooling liquid can be transferred from the tank to a secondary reservoir to avoid cooling liquid loss and protect the tank.

Abstract: A retainer to inhibit movement of dual in-line memory modules (DIMMs) that are removably inserted into connectors attached to a printed circuit board (PCB) of a system. Inhibiting movement of the DIMMs, especially taller DIMMs, such as the higher height 2 U and 4 U DIMMs, mitigates the effects of operational vibration causing intermittent electrical discontinuity between DIMM and the PCB. The retainer inhibits movement of DIMMs at the connector component level by constraining all or a portion of top edges of DIMMs inserted into connectors. The retainer is implemented independently of the design of the system-level chassis. The retainer is shaped into any of a bracket or frame from multiple rigid horizontal, vertical and oblique members that permit airflow to the DIMMs and connectors retained therein.

Abstract: A multi-entry socket power delivery structure is attachable to a printed circuit board to provide improved delivery of one or more power supply signals to a socket. The power delivery structure provides an additional path for power supply signals to be delivered to a socket (in addition to the “power corridor” of the printed circuit board). The power delivery structure comprises one or more portions, with individual portions comprising a printed circuit board connection portion that attaches to the printed circuit board to receive a power supply signal generated by a voltage regulator, and a socket connection portion that attaches to the printed circuit board to deliver the power supply signal to the socket via the printed circuit board. The power delivery structure can be located in the recess of a reinforced backplate that provides structural integrity to a processor stack and associated thermal management solution loading mechanism.

Abstract: An embodiment of a latch apparatus for a circuit board comprises a first latch body with a retention mechanism for the circuit board, a second latch body with a coupling mechanism for a connector, and a spring mechanism mechanically coupled between the first latch body and the second latch body. Other embodiments are disclosed and claimed.

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed for socket interconnect structures and related methods. An example socket interconnect apparatus includes a housing defining a plurality of first openings and a plurality of second openings and a ground structure coupled to the housing. The ground structure defines a plurality of third openings. The third openings of the ground structure align with the second openings of the housing when the ground structure is coupled to the housing. A plurality of ground pins are located in respective ones of the second openings and third openings. The ground structure is to electrically couple the ground pins. A plurality of signal pins are located in respective ones of the first openings of the housing. The signal pins are electrically isolated from the ground structure.

Abstract: An apparatus is described. The apparatus includes a semiconductor chip package, a main cooling mass, a heat pipe and a remote cooling mass. The apparatus further includes: a) a channel in one of the main and remote cooling masses into which the heat pipe is inserted, the channel being wide enough to allow movement of the heat pipe within the channel in response to relative movement of the main and remote cooling masses, wherein, the main cooling mass comprises a chamber with liquid, the heat pipe comprises a fluidic channel that is coupled to the chamber and vapor from the liquid is to be condensed within the heat pipe; b) a flexible region integrated into the heat pipe; and/or, c) a flexible connector into which the heat pipe is inserted.

Abstract: An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

Abstract: An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

Abstract: Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate, and a die coupled to the package substrate. In an embodiment, the electronic package further comprises a stiffener on the package substrate surrounding the die. In an embodiment, the stiffener is a ring with one or more corner regions and one or more beams. In an embodiment, each beam is between a pair of corner regions, and the one or more corner regions have a first thickness and the one or more beams have a second thickness that is greater than the first thickness.

Abstract: A standalone top cover retention mechanism can attach to the top of an array of tall (e.g., 2U) DIMMs to provide structural support. In one example, the DIMM cover is attached to two or more DIMMs without attaching to the chassis. The DIMM cover can mitigate shock and vibration related failures at the DIMM level without significant interference with platform thermal mechanical solutions.

Abstract: An apparatus is described. The apparatus includes a DIMM cooling assembly. The DIMM cooling assembly includes first and second heat spreaders to be respectively disposed on first and second sides of the DIMM's circuit board. The first and second sides having respective memory chips. The DIMM cooling assembly includes a heat dissipative structure. The DIMM's circuit board is to be disposed between the heat dissipative structure and a printed circuit board that the DIMM is to be plugged into. The DIMM cooling assembly includes fixturing elements to apply compressive forces toward the respective side edges of the DIMM's circuit board to the heat spreaders.

Abstract: A connector includes mounting tabs that are extended relative to traditional mounting tabs. On a back side of the printed circuit board (PCB), the mounting tabs connect to a back plate. The mounting tabs extend through the PCB and connect with the back plate, which provides improved structural integrity. Depending on the connector, the use of the mounting tabs can use existing mounting holes for the connector and remove the need for additional mounting holes.

Abstract: Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a heatsink, a base of the heatsink to be thermally coupled to a semiconductor device, and a rigid plate to be coupled to the semiconductor device and the base of the heatsink, the rigid plate stiffer than the base, the rigid plate distinct from a bolster plate to which the heatsink is to be coupled.

Abstract: Methods, systems, apparatus, and articles of manufacture to crimp a tube are disclosed. An example crimp disclosed herein includes a first crimp section extending between a first end of the crimp and a point along the crimp between the first end and a second end, a first inner diameter of the first crimp section constant between the first end and the point, and a second crimp section adjacent the first crimp section, the second crimp section extending between the point and the second end, a second inner diameter of the second crimp section to increase from the point to the second end.

Abstract: Back plates to support integrated circuit packages in sockets on printed circuit boards and associated methods are disclosed. An example back plate includes a ceramic substrate having a first surface and a second surface opposite the first surface. The example back plate further includes metal coupled to the ceramic substrate. At least a portion of the metal is disposed between planes defined by the first and second surfaces of the ceramic substrate.