Abstract: A method of making an inkjet printhead comprises forming a first patterned layer 20 on a surface of a first substrate 10, forming a second patterned layer 28 on a surface of a second substrate 100, bonding the first and second layers in intimate face-to-face contact, and removing the second substrate 100 from the second patterned layer 28. The first and second patterned layers 20, 28 together define at least one ink ejection chamber having at least one ink ejection nozzle.

Abstract: A method of making an inkjet printhead comprising providing a substrate having first and second opposite surfaces, providing a support member, bonding the second surface of the substrate to the support member, and, after the substrate and support member are bonded together, forming a plurality of ink ejection elements on the first surface of the substrate, the method further including forming communicating ink supply slots passing respectively through the substrate and support member to provide fluid communication between an ink supply and the ink ejection elements.

Abstract: A hardwearing inkjet printhead comprises a substrate 10 having an ink ejection circuit 12 and a patterned glass frit planarization layer 22 on its surface. A ceramic body 28 has a substantially flat surface 28B intimately bonded to the planarization layer. The ceramic body and planarization layer together define at least one ink ejection chamber 18 and associated ink ejection nozzle 38 with the nozzle and at least the major part of the height of the chamber formed in the ceramic body.

Abstract: A method of manufacturing an electronic component comprising at least one n- or p-doped portion, comprising the steps of: co-depositing inorganic semi-conducting nanoparticles and dopant on a substrate, the nanoparticles being a group four element such as silicon or germanium; fusing the nanoparticles by heating to form a continuous layer; and subsequently; and, recrystallising the layer.

Abstract: A method of making an inkjet printhead for surface mounting comprises providing a substrate 10 having a plurality of ink ejection elements and a plurality of electrical contacts 18 formed on a first surface, the contacts being connected to the ink ejection elements to allow selective energisation of the elements. A plurality of through-holes 26 are formed in the substrate each extending from the opposite surface of the substrate fully through the thickness of the substrate to meet the underside of a respective electrical contact 18 on the first surface. Each through-hole is substantially completely filled with a conductive material 36 by electroplating. Finally, a further plurality of electrical contacts (solder mounds) 38 are provided on the second surface of the substrate each in contact with the conductive material in a respective through-hole.

Abstract: A method of making an inkjet printhead comprises forming at least one ink ejection element 18 on a surface 14 of a substrate 10 and forming a slot 12 in the substrate to provide fluid communication between an ink supply and the ink ejection element. A protective coating 26 is applied to the surface of the substrate prior to forming the slot. The protective coating comprises a non-polymeric material which is capable of forming a covalent bond with the substrate and is removed from the substrate without damaging the ink ejection element following slot formation.

Abstract: A method of making an inkjet printhead comprises forming at least one ink ejection element 18 on a surface 14 of a substrate 10 and forming a slot 12 in the substrate to provide fluid communication between an ink supply and the ink ejection element. A protective coating 26 is applied to the surface of the substrate prior to forming the slot. The protective coating comprises a non-polymeric material which is capable of forming a covalent bond with the substrate and is removed from the substrate without damaging the ink ejection element following slot formation.

Abstract: A method of making an inkjet printhead comprising providing a substrate having first and second opposite surfaces, providing a support member, bonding the second surface of the substrate to the support member, and, after the substrate and support member are bonded together, forming a plurality of ink ejection elements on the first surface of the substrate, the method further including forming communicating ink supply slots passing respectively through the substrate and support member to provide fluid communication between an ink supply and the ink ejection elements.

Abstract: A method of making an inkjet printhead comprising providing a substrate having first and second opposite surfaces, providing a support member, bonding the second surface of the substrate to the support member, and, after the substrate and support member are bonded together, forming a plurality of ink ejection elements on the first surface of the substrate, the method further including forming communicating ink supply slots passing respectively through the substrate and support member to provide fluid communication between an ink supply and the ink ejection elements.

Abstract: An inkjet printhead having a substrate and having at least one ink supply slot extending through the thickness thereof and providing fluid communication between an ink supply and a plurality of ink ejection elements, wherein the ink supply slot is filled to at least part of its depth with a selectively exposed and developed resist material having a plurality of ink feed holes therethrough forming a filter.

Abstract: A method of manufacturing an electronic component comprising at least one n- or p-doped portion, comprising the steps of: co-depositing inorganic semi-conducting nanoparticles and dopant on a substrate, the nanoparticles being a group four element such as silicon or germanium; fusing the nanoparticles by heating to form a continuous layer; and subsequently; and, recrystallising the layer.

Abstract: A method of making an inkjet printhead comprises forming a first patterned layer 20 on a surface of a first substrate 10, forming a second patterned layer 28 on a surface of a second substrate 100, bonding the first and second layers in intimate face-to-face contact, and removing the second substrate 100 from the second patterned layer 28. The first and second patterned layers 20, 28 together define at least one ink ejection chamber having at least one ink ejection nozzle.

Abstract: A method of making an inkjet printhead comprises forming at least one ink ejection element 18, 36 on a surface 14 of a substrate 10, forming a slot 12 in the substrate to provide fluid communication between an ink supply and the ink ejection element, and subjecting the slotted substrate to an isotropic etch.

Abstract: A method of making an inkjet printhead for surface mounting comprises providing a substrate 10 having a plurality of ink ejection elements and a plurality of electrical contacts 18 formed on a first surface, the contacts being connected to the ink ejection elements to allow selective energisation of the elements. A plurality of through-holes 26 are formed in the substrate each extending from the opposite surface of the substrate fully through the thickness of the substrate to meet the underside of a respective electrical contact 18 on the first surface. Each through-hole is substantially completely filled with a conductive material 36 by electroplating. Finally, a further plurality of electrical contacts (solder mounds) 38 are provided on the second surface of the substrate each in contact with the conductive material in a respective through-hole.

Abstract: A hardwearing inkjet printhead comprises a substrate 10 having an ink ejection circuit 12 and a patterned glass frit planarization layer 22 on its surface. A ceramic body 28 has a substantially flat surface 28B intimately bonded to the planarization layer. The ceramic body and planarization layer together define at least one ink ejection chamber 18 and associated ink ejection nozzle 38 with the nozzle and at least the major part of the height of the chamber formed in the ceramic body.

Abstract: A method of making an inkjet printhead comprises forming at least one ink ejection element 18 on a surface 14 of a substrate 10 and forming a slot 12 in the substrate to provide fluid communication between an ink supply and the ink ejection element. A protective coating 26 is applied to the surface of the substrate prior to forming the slot. The protective coating comprises a non-polymeric material which is capable of forming a covalent bond with the substrate and is removed from the substrate without damaging the ink ejection element following slot formation.

Abstract: A method of making an inkjet printhead comprising providing a substrate having first and second opposite surfaces, providing a support member, bonding the second surface of the substrate to the support member, and, after the substrate and support member are bonded together, forming a plurality of ink ejection elements on the first surface of the substrate, the method further including forming communicating ink supply slots passing respectively through the substrate and support member to provide fluid communication between an ink supply and the ink ejection elements.

Abstract: An inkjet printhead having a substrate and having at least one ink supply slot extending through the thickness thereof and providing fluid communication between an ink supply and a plurality of ink ejection elements, wherein the ink supply slot is filled to at least part of its depth with a selectively exposed and developed resist material having a plurality of ink feed holes therethrough forming a filter.

Abstract: A method of fabricating a printhead for an inkjet printer involves generating ink supply slots (12) in a substrate (10) and depositing thin film circuitry and resistors (16) on a front surface (14) of the substrate, before covering this front surface (including the opening for the ink supply slots) with a conformal tape (28). The ink supply slots are then back-filled with a filler material (32) which hardens to generate a false surface (29a) coplanar with the front surface (14) of the substrate. This false surface allows a thin photoresist layer (34) to be spun across the front surface. The photoresist is selectively exposed to create structures defining both thermal ejection chambers bounding the resistors in a lateral direction and the upper surfaces of these chambers, including ink droplet ejection orifices, thereby obviating the need for a separate nozzle plate and reducing the thickness of the printhead.