Patents by Inventor Phil Neal

Phil Neal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and materials useful for chip stacking, chip and wafer bonding
    Patent number: 8816485
    Abstract: Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: August 26, 2014
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventors: Chris Apanius, Robert A. Shick, Hendra Ng, Andrew Bell, Wei Zhang, Phil Neal
  • Methods And Materials Useful For Chip Stacking, Chip And Wafer Bonding
    Publication number: 20120175721
    Abstract: Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues.
    Type: Application
    Filed: January 18, 2012
    Publication date: July 12, 2012
    Applicant: PROMERUS LLC
    Inventors: Chris Apanius, Robert A. Shick, Hendra Ng, Andrew Bell, Wei Zhang, Phil Neal
  • Methods and materials useful for chip stacking, chip and wafer bonding
    Patent number: 8120168
    Abstract: Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues.
    Type: Grant
    Filed: September 20, 2007
    Date of Patent: February 21, 2012
    Assignee: Promerus LLC
    Inventors: Chris Apanius, Robert A. Shick, Hendra Ng, Andrew Bell, Wei Zhang, Phil Neal
  • Methods and materials useful for chip stacking, chip and wafer bonding
    Patent number: 7932161
    Abstract: Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues.
    Type: Grant
    Filed: March 21, 2007
    Date of Patent: April 26, 2011
    Assignee: Promerus LLC
    Inventors: Chris Apanius, Robert A. Shick, Hendra Ng, Andrew Bell, Wei Zhang, Phil Neal
  • Methods and materials useful for chip stacking, chip and wafer bonding
    Publication number: 20080073741
    Abstract: Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues.
    Type: Application
    Filed: September 20, 2007
    Publication date: March 27, 2008
    Applicant: Promerus LLC
    Inventors: Chris Apanius, Robert Shick, Hendra Ng, Andrew Bell, Wei Zhang, Phil Neal
  • Methods and materials useful for chip stacking, chip and wafer bonding
    Publication number: 20070232026
    Abstract: Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues.
    Type: Application
    Filed: March 21, 2007
    Publication date: October 4, 2007
    Applicant: Promerus LLC
    Inventors: Chris Apanius, Robert Shick, Hendra Ng, Andrew Bell, Wei Zhang, Phil Neal