Patents by Inventor Phil Saint-Erne

Phil Saint-Erne has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High output power density radio frequency transistor amplifiers in flat no-lead overmold packages
    Patent number: 11784613
    Abstract: Packaged RF transistor amplifiers are provided that include a flat no-lead overmold package that includes a die pad, a plurality of terminal pads and an overmold encapsulation that at least partially covers the die pad and the terminal pads and an RF transistor amplifier die mounted on the die pad and at least partially covered by the overmold encapsulation. These packaged RF transistor amplifiers may have an output power density of at least 3.0 W/mm2.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: October 10, 2023
    Assignee: Wolfspeed, Inc.
    Inventors: Phil Saint-Erne, William Pribble, Warren Brakensiek, Bradley Millon
  • HIGH OUTPUT POWER DENSITY RADIO FREQUENCY TRANSISTOR AMPLIFIERS IN FLAT NO-LEAD OVERMOLD PACKAGES
    Publication number: 20220311392
    Abstract: Packaged RF transistor amplifiers are provided that include a flat no-lead overmold package that includes a die pad, a plurality of terminal pads and an overmold encapsulation that at least partially covers the die pad and the terminal pads and an RF transistor amplifier die mounted on the die pad and at least partially covered by the overmold encapsulation. These packaged RF transistor amplifiers may have an output power density of at least 3.0 W/mm2.
    Type: Application
    Filed: March 26, 2021
    Publication date: September 29, 2022
    Inventors: Phil Saint-Erne, William Pribble, Warren Brakensiek, Bradley Millon