Patents by Inventor Phil Slight

Phil Slight has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bi-directional heatsink dampening force system
    Patent number: 10903140
    Abstract: A circuit board includes a heatsink configured to be coupled to the circuit board via a first coupling mechanism, the first coupling mechanism providing an asymmetrical downward force for coupling the heatsink to the circuit board. The circuit board further includes a second coupling mechanism configured to provide a counter force to the asymmetrical downward force of the first coupling mechanism. The counter force can be configured on an overhang portion of the heatsink that does not cover a circuit on the circuit board.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: January 26, 2021
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Phil Slight, Vic Chia
  • BI-DIRECTIONAL HEATSINK DAMPENING FORCE SYSTEM
    Publication number: 20190244877
    Abstract: A circuit board includes a heatsink configured to be coupled to the circuit board via a first coupling mechanism, the first coupling mechanism providing an asymmetrical downward force for coupling the heatsink to the circuit board. The circuit board further includes a second coupling mechanism configured to provide a counter force to the asymmetrical downward force of the first coupling mechanism. The counter force can be configured on an overhang portion of the heatsink that does not cover a circuit on the circuit board.
    Type: Application
    Filed: April 15, 2019
    Publication date: August 8, 2019
    Inventors: Phil Slight, Vic Chia
  • Bi-directional heatsink dampening force system
    Patent number: 10262919
    Abstract: A circuit board includes a heatsink configured to be coupled to the circuit board via a first coupling mechanism, the first coupling mechanism providing an asymmetrical downward force for coupling the heatsink to the circuit board. The circuit board further includes a second coupling mechanism configured to provide a counter force to the asymmetrical downward force of the first coupling mechanism. The counter force can be configured on an overhang portion of the heatsink that does not cover a circuit on the circuit board.
    Type: Grant
    Filed: February 1, 2017
    Date of Patent: April 16, 2019
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Phil Slight, Vic Chia
  • BI-DIRECTIONAL HEATSINK DAMPENING FORCE SYSTEM
    Publication number: 20180220521
    Abstract: A circuit board includes a heatsink configured to be coupled to the circuit board via a first coupling mechanism, the first coupling mechanism providing an asymmetrical downward force for coupling the heatsink to the circuit board. The circuit board further includes a second coupling mechanism configured to provide a counter force to the asymmetrical downward force of the first coupling mechanism. The counter force can be configured on an overhang portion of the heatsink that does not cover a circuit on the circuit board.
    Type: Application
    Filed: February 1, 2017
    Publication date: August 2, 2018
    Inventors: Phil Slight, Vic Chia