Abstract: Methods and devices for solar cell interconnection are provided. In one embodiment, the method includes physically alloying the ink metal to the underlying foil (hence excellent adhesion and conductivity with no pre-treatment), and by fusing the solid particles in the ink on the surface (eliminating any organic components) so that the surface is ideally suited for good conductivity and adhesion to an overlayer of finger ink, which is expected to be another adhesive. In some embodiments, contact resistance of conductive adhesives are known to be much lower on gold or silver than on any other metals.

Abstract: Methods and devices are described for thin film solar cell manufacturing.

Abstract: Methods and devices are described for thin film solar cell manufacturing. In one embodiment, the method includes displacing the residual insulator in vias with the pins of the present invention, which may greatly reduce the amount of material to be removed and hence make the laser more cost-effective. It is still desirable to use a laser or other device to completely clear the bottom of the via of residual material (to prepare for making a good electrical connection) but the film remaining under the pins would be microns in thickness, compared to the hundreds of microns of via depth.

Abstract: Methods and devices for solar cell interconnection are provided. In one embodiment, the method includes physically alloying the ink metal to the underlying foil (hence excellent adhesion and conductivity with no pre-treatment), and by fusing the solid particles in the ink on the surface (eliminating any organic components) so that the surface is ideally suited for good conductivity and adhesion to an overlayer of finger ink, which is expected to be another adhesive. In some embodiments, contact resistance of conductive adhesives are known to be much lower on gold or silver than on any other metals.