Abstract: An end effector for carrying a wafer or a wafer assembly placed thereon. The end effector is integrated with, may attach to, a robotic arm. The end effector includes a peripheral mount radially outside of a base portion, the peripheral mount includes at least a first mount section and a second mount section. The base portion has a substantially flat horizontal upper surface. Each mount section of the peripheral mount has a substantially flat horizontal upper surface being elevated with respect to the upper surface of the base portion. The end effector may hold a wafer assembly bridging the upper surfaces of the mount sections at a first height above the base portion. There is a step region between the base portion and the peripheral mount at each mount section. The end effector may hold a wafer bridging the support surfaces at a second height above the base portion.

Abstract: Apparatus for processing a semiconductor substrate having one or more semiconductor substrate handling devices through which a semiconductor substrate can be introduced to and/or removed from the apparatus, a plurality of process chambers for processing the semiconductor substrate; and a transport module for transporting the semiconductor substrate under vacuum conditions between the semiconductor substrate handling devices and the plurality of process chambers.

Abstract: A transfer vacuum chamber for handling a substrate under vacuum conditions is in communication with at least two substrate modules connected to the transfer vacuum chamber by a respective connection slot. The at least two substrate modules can receive at least one substrate. At least one of the at least two substrate modules is a substrate processing module. At least two load lock chambers are in vacuum communication with the transfer vacuum chamber. The transfer vacuum chamber includes at least two transfer robots disposed within the transfer vacuum chamber configured to transfer a substrate between the at least two load lock chambers and the at least one substrate processing module under vacuum conditions.