Abstract: Techniques are described that allow an air traffic display of an aircraft to display the relative motion of air traffic proximate to the aircraft. The air traffic display may be switched between a first display mode in which absolute motion of air traffic is displayed (e.g., motion of air traffic targets relative to a fixed point on the earth's surface or relative to an apparently fixed celestial point is displayed) and a second display mode in which motion of air traffic targets is displayed relative to the aircraft. The techniques further facilitate the selection of individual traffic targets from a displayed traffic depiction to activate a third display mode in which additional information about the relative motion of the selected target, such as its estimated closest point of approach (CPA) to the aircraft and the estimated time it will take the selected target to reach the CPA are shown.

Abstract: Embodiments disclosed herein generally relate to a process of depositing a transparent conductive oxide layer over a substrate. The transparent oxide layer is sometimes deposited onto a substrate for later use in a solar cell device. The transparent conductive oxide layer may be deposited by a “cold” sputtering process. In other words, during the sputtering process, a plasma is ignited in the processing chamber which naturally heats the substrate. No additional heat is provided to the substrate during deposition such as from the susceptor. After the transparent conductive oxide layer is deposited, the substrate may be annealed and etched, in either order, to texture the transparent conductive oxide layer. In order to tailor the shape of the texturing, different wet etch chemistries may be utilized. The different etch chemistries may be used to shape the surface of the transparent conductive oxide and the etch rate.

Abstract: Embodiments disclosed herein generally relate to a process of depositing a transparent conductive oxide layer over a substrate. The transparent oxide layer is sometimes deposited onto a substrate for later use in a solar cell device. The transparent conductive oxide layer may be deposited by a “cold” sputtering process. In other words, during the sputtering process, a plasma is ignited in the processing chamber which naturally heats the substrate. No additional heat is provided to the substrate during deposition such as from the susceptor. After the transparent conductive oxide layer is deposited, the substrate may be annealed and etched, in either order, to texture the transparent conductive oxide layer. In order to tailor the shape of the texturing, different wet etch chemistries may be utilized. The different etch chemistries may be used to shape the surface of the transparent conductive oxide and the etch rate.

Abstract: A method and apparatus for physical vapor deposition of films on a substrate is provided. The apparatus comprises a series of connected sputtering chambers through which a substrate passes to undergo sequential deposition processes. The chambers have passages through which the substrates move, and through which process gases may leak. Target gas flows to each chamber are established by operating each chamber while adjacent chambers are idle, measuring the extent of gas communication between the chambers, and reducing the flows by an amount based on the extent of gas leakage.

Abstract: Embodiments disclosed herein generally relate to a process of depositing a transparent conductive oxide layer over a substrate. The transparent oxide layer is sometimes deposited onto a substrate for later use in a solar cell device. The transparent conductive oxide layer may be deposited by a “cold” sputtering process. In other words, during the sputtering process, a plasma is ignited in the processing chamber which naturally heats the substrate. No additional heat is provided to the substrate during deposition such as from the susceptor. After the transparent conductive oxide layer is deposited, the substrate may be annealed and etched, in either order, to texture the transparent conductive oxide layer. In order to tailor the shape of the texturing, different wet etch chemistries may be utilized. The different etch chemistries may be used to shape the surface of the transparent conductive oxide and the etch rate.

Abstract: Embodiments disclosed herein generally relate to a process of depositing a transparent conductive oxide layer over a substrate. The transparent oxide layer is sometimes deposited onto a substrate for later use in a solar cell device. The transparent conductive oxide layer may be deposited by a “cold” sputtering process. In other words, during the sputtering process, a plasma is ignited in the processing chamber which naturally heats the substrate. No additional heat is provided to the substrate during deposition such as from the susceptor. After the transparent conductive oxide layer is deposited, the substrate may be annealed and etched, in either order, to texture the transparent conductive oxide layer. In order to tailor the shape of the texturing, different wet etch chemistries may be utilized. The different etch chemistries may be used to shape the surface of the transparent conductive oxide and the etch rate.

Abstract: A method and apparatus for performing physical vapor deposition on a large-area substrate is provided. One or more sputtering targets are disposed in a chamber, with each sputtering target comprising a magnet assembly. Each magnet assembly may comprise a plurality of magnet units aligned such that the magnetic polarity of the magnet units is complementary, and the magnetic fields of the magnet units couple. Each magnet unit thus comprises a plurality of magnets arranged such that the polarity of each magnet is opposite that of adjacent magnets in the same magnet unit. Alternately, each magnet assembly may comprise a plurality of magnets individually oriented to complement the magnetic fields of its neighbors. A substrate support having an insulating surface may also be provided.

Abstract: A method and apparatus for physical vapor deposition of films on a substrate is provided. The apparatus comprises a series of connected sputtering chambers through which a substrate passes to undergo sequential deposition processes. The chambers have passages through which the substrates move, and through which process gases may leak. Target gas flows to each chamber are established by operating each chamber while adjacent chambers are idle, measuring the extent of gas communication between the chambers, and reducing the flows by an amount based on the extent of gas leakage.

Abstract: A variable size endotracheal tube (VSET) is described for use in intubation of a body lumen. The VSET includes a flexible, tubular member with a distal end and a proximal end. The proximal end includes a tube adapter configured to be coupled to a gas source. In one embodiment, a stent-like infrastructure runs substantially longitudinally along the length of the tubular member. The stent-like infrastructure is configured to variably expand a cross-section of the inner surface of the tubular member along substantially the full length of the tubular member. Furthermore, the stent-like infrastructure is arranged to maintain the variable expansion of the cross-section to substantially prevent stenosis of the body lumen, while the body is intubated.

Abstract: A variable size endotracheal tube (VSET) is described for use in intubation of a body lumen. The VSET includes a flexible, tubular member with a distal end and a proximal end. The proximal end includes a tube adapter configured to be coupled to a gas source. In one embodiment, a stent-like infrastructure runs substantially longitudinally along the length of the tubular member. The stent-like infrastructure is configured to variably expand a cross-section of the inner surface of the tubular member along substantially the full length of the tubular member. Furthermore, the stent-like infrastructure is arranged to maintain the variable expansion of the cross-section to substantially prevent stenosis of the body lumen, while the body is intubated.

Abstract: A variable size endotracheal tube (VSET) is described for use in intubation of a body lumen. The VSET includes a flexible, tubular member with a distal end and a proximal end. The proximal end includes a tube adapter configured to be coupled to a gas source. In one embodiment, a stent-like infrastructure runs substantially longitudinally along the length of the tubular member. The stent-like infrastructure is configured to variably expand a cross-section of the inner surface of the tubular member along substantially the full length of the tubular member. Furthermore, the stent-like infrastructure is arranged to maintain the variable expansion of the cross-section to substantially prevent stenosis of the body lumen, while the body is intubated.

Abstract: A support assembly for the magnetic array in a cylindrical magnetron that greatly reduces the stress placed on the assembly and on the end blocks of the magnetron. The support assembly and method also reduce the time necessary for properly positioning the magnetic array in relation to the target tube, and result in uniform positioning of the magnetic array along the length of the target tube. A cylindrical magnetron incorporating such an assembly produces uniform coatings and requires less adjustment and maintenance.

Abstract: A portable pad including a primary pad section and secondary pad sections defining an indentation for receiving a vehicle tire with the secondary pad sections adapted to be disposed on opposite sides of the tire.