Patents by Inventor Philip A. Marvin

Philip A. Marvin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8161633
    Abstract: A method for forming a circuit board is provided. The method includes forming a circuit board substrate (112) from a circuit board material. The method also includes positioning the circuit board substrate on a rigid structure (114) having a three dimensional contoured surface (300). The method further includes applying heat and applying pressure to the circuit board substrate to at least partially conform the circuit board substrate to the three dimensional contoured surface. If the circuit board substrate (112) is a clad circuit board substrate, then a circuit pattern is formed on the circuit board substrate prior to the steps of applying heat and applying pressure. However, if the circuit board substrate (112) is an unclad circuit board substrate, then a circuit pattern is disposed on the circuit board substrate after the steps of applying heat and applying pressure.
    Type: Grant
    Filed: April 3, 2007
    Date of Patent: April 24, 2012
    Assignee: Harris Corporation
    Inventors: Lawrence W. Shacklette, Louis J. Rendek, Paul B. Jaynes, Philip A. Marvin
  • Publication number: 20080244898
    Abstract: A method for forming a circuit board is provided. The method includes forming a circuit board substrate (112) from a circuit board material. The method also includes positioning the circuit board substrate on a rigid structure (114) having a three dimensional contoured surface (300). The method further includes applying heat and applying pressure to the circuit board substrate to at least partially conform the circuit board substrate to the three dimensional contoured surface. If the circuit board substrate (112) is a clad circuit board substrate, then a circuit pattern is formed on the circuit board substrate prior to the steps of applying heat and applying pressure. However, if the circuit board substrate (112) is an unclad circuit board substrate, then a circuit pattern is disposed on the circuit board substrate after the steps of applying heat and applying pressure.
    Type: Application
    Filed: April 3, 2007
    Publication date: October 9, 2008
    Applicant: HARRIS CORPORATION
    Inventors: Lawrence W. Shacklette, Louis J. Rendek, Paul B. Jaynes, Philip A. Marvin
  • Patent number: 6281930
    Abstract: A system and method for control of the field of view of one or more cameras for providing that one or more subjects are to be in a single field of view (“share view”) wherein the system will automatically calculate the values for the various field of view variables to provide the appropriate camera operation. Various computer-controlled programs are included to operate the system including programs for the integration of camera operation and automatic tracking of the subjects present. The system is designed for video and it can automatically add and remove subjects from a share view.
    Type: Grant
    Filed: February 4, 1999
    Date of Patent: August 28, 2001
    Assignee: ParkerVision, Inc.
    Inventors: Jeffrey L. Parker, Philip A. Marvin
  • Patent number: 5963250
    Abstract: A system and method for control of the field of view of one or more cameras for providing that one or more subjects are to be in a single field of view ("share view") wherein the system will automatically calculate the values for the various field of view variables to provide the appropriate camera operation. Various computer-controlled programs are included to operate the system including programs for the integration of camera operation and automatic tracking of the subjects present. The system is designed for video and it can automatically add and remove subjects from a share view.
    Type: Grant
    Filed: October 20, 1995
    Date of Patent: October 5, 1999
    Assignee: ParkerVision, Inc.
    Inventors: Jeffrey L. Parker, Philip A. Marvin