Abstract: A fabrication method which forms vertical capacitors in a substrate. The method is preferably an all-dry process, comprising forming a through-substrate via hole in the substrate, depositing a first conductive material layer into the via hole using atomic layer deposition (ALD) such that it is electrically continuous across the length of the via hole, depositing an electrically insulating, continuous and substantially conformal isolation material layer over the first conductive layer using ALD, and depositing a second conductive material layer over the isolation material layer using ALD such that it is electrically continuous across the length of the via hole. The layers are arranged such that they form a vertical capacitor. The present method may be successfully practiced at temperatures of less than 200° C., thereby avoiding damage to circuitry residing on the substrate that might otherwise occur.

Abstract: The present invention relates to a method for adjusting the resonant frequencies of a vibrating microelectromechanical (MEMS) device. In one embodiment, the present invention is a method for adjusting the resonant frequencies of a vibrating mass including the steps of patterning a surface of a device layer of the vibrating mass with a mask, etching the vibrating mass to define a structure of the vibrating mass, determining a first set of resonant frequencies of the vibrating mass, determining a mass removal amount of the vibrating mass and a mass removal location of the vibrating mass to obtain a second set of resonant frequencies of the vibrating mass, removing the mask at the mass removal location, and etching the vibrating mass to remove the mass removal amount of the vibrating mass at the mass removal location of the vibrating mass.

Abstract: An through-substrate via fabrication method requires forming a through-substrate via hole in a semiconductor substrate, depositing an electrically insulating, continuous and substantially conformal isolation material onto the substrate and interior walls of the via using ALD, and depositing a conductive material into the via and over the isolation material using ALD such that it is electrically continuous across the length of the via hole. The isolation material may be prepared by activating it with a seed layer deposited by ALD. The via hole is preferably formed by dry etching first and second cavities having respective diameters into the substrate's top and bottom surfaces, respectively, to form a single continuous aperture through the substrate. The present method may be practiced at temperatures of less than 200° C. The basic fabrication method may be extended to provide vias with multiple conductive layers, such as coaxial and triaxial vias.

Abstract: Provided is a chip-scale atomic clock having a folded optic configuration or physics package. In particular, the physics package includes a vapor cell for containing gaseous alkali atoms and a VCSEL for generating a laser light One or more heating elements are positioned to simultaneously heat both the vapor cell and VCSEL to the required operating temperature. A micro-lens element, positioned between the VCSEL and a reflector, is used to first expand the beam of light, and then to subsequently collimate the light after it is once reflected. Collimated, reflected light passes through the vapor cell wherein the alkali atoms are excited and a percentage of the reflected light is absorbed. A detector, located opposite the reflector and micro-lens array, detects light passing through the cell. An error signal is generated and the output voltage of a local voltage oscillator is successively stabilized.

Abstract: Provided is a chip-scale atomic clock having a folded optic configuration or physics package. In particular, the physics package includes a vapor cell for containing gaseous alkali atoms and a VCSEL for generating a laser light. One or more heating elements are positioned to simultaneously heat both the vapor cell and VCSEL to the required operating temperature. A micro-lens element, positioned between the VCSEL and a reflector, is used to first expand the beam of light, and then to subsequently collimate the light after it is once reflected. Collimated, reflected light passes through the vapor cell wherein the alkali atoms are excited and a percentage of the reflected light is absorbed. A detector, located opposite the reflector and micro-lens array, detects light passing through the cell. An error signal is generated and the output voltage of a local voltage oscillator is successively stabilized.

Abstract: Embodiments of the present invention are directed to a process for forming small diameter vias at low temperatures. In preferred embodiments, through-substrate vias are fabricated by forming a through-substrate via; and depositing conductive material into the via by means of a flowing solution plating technique, wherein the conductive material releases a gas that pushes the conductive material through the via to facilitate plating the via with the conductive material. In preferred embodiments, the fabrication of the substrate is conducted at low temperatures.

Abstract: A disc resonator gyroscope (DRG) and method of manufacture. The DRG has a surrounding pattern of bond metal having a symmetry related to the symmetry of a resonator device wafer that enables more even dissipation of heat from a resonator device wafer of the DRG during an etching operation. The metal bond frame eliminates or substantially reduces the thermal asymmetry that the resonator device wafer normally experiences when a conventional, square bond frame is used, which in turn can cause geometric asymmetry in the widths of the beams that are etched into the resonator device wafer of the DRG.

Abstract: A microelectromechanical (MEM) device per the present invention comprises a semiconductor wafer—typically an SOI wafer, a substrate, and a high temperature bond which bonds the wafer to the substrate to form a composite structure. Portions of the composite structure are patterned and etched to define stationary and movable MEM elements, with the movable elements being mechanically coupled to the stationary elements. The high temperature bond is preferably a mechanical bond, with the wafer and substrate having respective bonding pads which are aligned and mechanically connected to form a thermocompression bond to effect the bonding. A metallization layer is typically deposited on the composite structure and patterned to provide electrical interconnections for the device. The metallization layer preferably comprises a conductive refractory material such as platinum to withstand high temperature environments.

Abstract: A process for fabricating a MEMS device comprises the steps of depositing and patterning on one side of a wafer a layer of material having a preselected electrical resistivity; bonding a substrate to the one side of the wafer using an adhesive bonding agent, the substrate overlying the patterned layer of material; selectively removing portions of the wafer from the side opposite the one side to define stationary and movable MEMS elements; and selectively removing the adhesive bonding agent to release the movable MEMS element, at least a portion of the layer of material being disposed so as to be attached to the movable MEMS element.

Abstract: A microelectromechanical (MEM) fluid health sensing device comprises a viscosity sensor which provides an output that varies with the viscosity of a fluid in which it is immersed, and at least one other sensor which provides an output that varies with another predetermined parameter of the fluid. The viscosity sensor is preferably a MEM device fabricated by means of a “deep etch” process. The sensors are preferably integrated together on a common substrate, though they might also be fabricated separately and packaged together to form a hybrid device. A data processing means may be included which receives the sensor outputs and provides one or more outputs indicative of the health of the fluid. Sensor types which may be part of the present device include, for example, a temperature sensor, a MEM electrochemical sensor, a MEM accelerometer, a MEM contact switch lubricity sensor, and/or an inductive metallic wear sensor.

Abstract: A MEM viscosity sensor comprises a substrate, with first and second support structures affixed to the substrate and spaced-apart. A compliant member is affixed to the support structures such that it is suspended above and can flex vertically with respect to the substrate. The member has a high density of perforations, through which a fluid whose viscosity is to be sensed can flow. The sensor includes a drive means to apply a force to the member, and a sensing means to sense the vertical motion of the member in response to the applied force. The member's perforations ensure that its resistance to motion will be shear in nature, and minimizes sensitivity to particulates. The substrate is also preferably perforated to further reduce non-shear forces and facilitate fluid exchange.

Abstract: A microelectromechanical (MEM) device per the present invention comprises a semiconductor wafer—typically an SOI wafer, a substrate, and a high temperature bond which bonds the wafer to the substrate to form a composite structure. Portions of the composite structure are patterned and etched to define stationary and movable MEM elements, with the movable elements being mechanically coupled to the stationary elements. The high temperature bond is preferably a mechanical bond, with the wafer and substrate having respective bonding pads which are aligned and mechanically connected to form a thermocompression bond to effect the bonding. A metallization layer is typically deposited on the composite structure and patterned to provide electrical interconnections for the device. The metallization layer preferably comprises a conductive refractory material such as platinum to withstand high temperature environments.

Abstract: Embodiments of the present invention are directed to a MEM viscosity sensor that is configured to be operated submerged in a liquid. The MEMS viscosity sensor comprises a MEMS variable capacitor comprising a plurality of capacitor plates capable of being submerged in a liquid. An actuator places a driving force on the variable capacitor which causes relative movement between the plates, where the movement creates a shear force between each moving plate and the liquid, which damps the movement of the plate and increases the capacitor's response time to the applied force in accordance with the liquid's viscosity. To determine the actual viscosity of the liquid, a sensor is coupled to the variable capacitor for sensing the response time of the plates as an indicator of the liquid's viscosity.

Abstract: A method for diagnosing a fluid includes sensing a property of the fluid and the temperature of the fluid at the time the property is sensed, then determining the status of the fluid from the sensing. The sample volume may be small in comparison to the total fluid volume.

Abstract: A micromirror apparatus includes a device layer having a recess, a multilayer thin-film dielectric reflector coupled to and structurally supported by the device layer on the opposite side of the device layer from said recess, and a stress compensator seated in the recess, with the stress compensator operable to resist device layer bending moments resulting from intrinsic and thermal mismatch stresses between the multilayer thin-film dielectric reflector and the device layer.

Abstract: A micromirror apparatus includes a device layer having a recess, a multilayer thin-film dielectric reflector coupled to and structurally supported by the device layer on the opposite side of the device layer from said recess, and a stress compensator seated in the recess, with the stress compensator operable to resist device layer bending moments resulting from intrinsic and thermal mismatch stresses between the multilayer thin-film dielectric reflector and the device layer.

Abstract: A microelectromechanical (MEM) fluid health sensing device comprises a viscosity sensor which provides an output that varies with the viscosity of a fluid in which it is immersed, and at least one other sensor which provides an output that varies with another predetermined parameter of the fluid. The viscosity sensor is preferably a MEM device fabricated by means of a “deep etch” process. The sensors are preferably integrated together on a common substrate, though they might also be fabricated separately and packaged together to form a hybrid device. A data processing means may be included which receives the sensor outputs and provides one or more outputs indicative of the health of the fluid. Sensor types which may be part of the present device include, for example, a temperature sensor, a MEM electrochemical sensor, a MEM accelerometer, a MEM contact switch lubricity sensor, and/or an inductive metallic wear sensor.

Abstract: A MEM viscosity sensor comprises a substrate, with first and second support structures affixed to the substrate and spaced-apart. A compliant member is affixed to the support structures such that it is suspended above and can flex vertically with respect to the substrate. The member has a high density of perforations, through which a fluid whose viscosity is to be sensed can flow. The sensor includes a drive means to apply a force to the member, and a sensing means to sense the vertical motion of the member in response to the applied force. The member's perforations ensure that its resistance to motion will be shear in nature, and minimizes sensitivity to particulates. The substrate is also preferably perforated to further reduce non-shear forces and facilitate fluid exchange.

Abstract: A microelectromechanical (MEM) device per the present invention comprises a semiconductor wafer—typically an SOI wafer, a substrate, and a high temperature bond which bonds the wafer to the substrate to form a composite structure. Portions of the composite structure are patterned and etched to define stationary and movable MEM elements, with the movable elements being mechanically coupled to the stationary elements. The high temperature bond is preferably a mechanical bond, with the wafer and substrate having respective bonding pads which are aligned and mechanically connected to form a thermocompression bond to effect the bonding. A metallization layer is typically deposited on the composite structure and patterned to provide electrical interconnections for the device. The metallization layer preferably comprises a conductive refractory material such as platinum to withstand high temperature environments.

Abstract: Embodiments of the present invention are directed to a process for forming small diameter vias at low temperatures. In preferred embodiments, through-substrate vias are fabricated by forming a through-substrate via; and depositing conductive material into the via by means of a flowing solution plating technique, wherein the conductive material releases a gas that pushes the conductive material through the via to facilitate plating the via with the conductive material. In preferred embodiments, the fabrication of the substrate is conducted at low temperatures.