Patents by Inventor Philip Adamson

Philip Adamson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • REFILLABLE ION CHAMBER WITH AUTOMATED PURGING SYSTEM
    Publication number: 20230260738
    Abstract: An apparatus includes an ion chamber and a valve assembly. The ion chamber may include a housing enclosing a gas and one or more electrodes. The valve assembly is coupled to the ion chamber allowing control of replacement of the gas within the housing.
    Type: Application
    Filed: April 25, 2023
    Publication date: August 17, 2023
    Applicant: Varian Medical Systems, Inc.
    Inventors: Amir SHOJAEI, Philip ADAMSON, Flavio POEHLMANN-MARTINS
  • Refillable ion chamber with automated purging system
    Patent number: 11651931
    Abstract: An apparatus includes an ion chamber and a valve assembly. The ion chamber may include a housing enclosing a gas and one or more electrodes. The valve assembly is coupled to the ion chamber allowing control of replacement of the gas within the housing.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: May 16, 2023
    Assignee: VARIAN MEDICAL SYSTEMS, INC.
    Inventors: Amir Shojaei, Philip Adamson, Flavio Poehlmann-Martins
  • REFILLABLE ION CHAMBER WITH AUTOMATED PURGING SYSTEM
    Publication number: 20220285122
    Abstract: An apparatus includes an ion chamber and a valve assembly. The ion chamber may include a housing enclosing a gas and one or more electrodes. The valve assembly is coupled to the ion chamber allowing control of replacement of the gas within the housing.
    Type: Application
    Filed: March 8, 2021
    Publication date: September 8, 2022
    Inventors: Amir Shojaei, Philip Adamson, Flavio Poehlmann-Martins
  • Contact pad structure for flip chip semiconductor die
    Patent number: 7821133
    Abstract: A flip chip Schottky die is provided, which includes three contact bumps extending from a top surface of the die for electrically connecting with a board, a first and second bump being cathode contacts, and a third bump being an anode contact and having a larger surface than each of the first and second bumps for a 0.5 ampere device. Each bump is substantially rectangular at its base, but may have a curved or arched top surface on a square die. Also, provided is a contact bump useful in a flip chip device, such as a MOSFET or diode for a current of 1.0 amperes that includes a solder body of PbSn or a solder body free of lead comprising SnAgCu. Such a contact bump is substantially rectangular, and a height of approximately 120 ?m.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: October 26, 2010
    Assignee: International Rectifier Corporation
    Inventors: Hazel D. Schofield, Slawomir Skocki, Philip Adamson
  • Contact pad structure for flip chip semiconductor die
    Publication number: 20070096316
    Abstract: A flip chip Schottky die is provided, which includes three contact bumps extending from a top surface of the die for electrically connecting with a board, a first and second bump being cathode contacts, and a third bump being an anode contact and having a larger surface than each of the first and second bumps for a 0.5 ampere device. Each bump is substantially rectangular at its base, but may have a curved or arched top surface on a square die. Also, provided is a contact bump useful in a flip chip device, such as a MOSFET or diode for a current of 1.0 amperes that includes a solder body of PbSn or a solder body free of lead comprising SnAgCu. Such a contact bump is substantially rectangular, and a height of approximately 120 ?m.
    Type: Application
    Filed: October 26, 2006
    Publication date: May 3, 2007
    Inventors: Hazel Schofield, Slawomir Skocki, Philip Adamson