Abstract: A circuit arrangement has a chip arrangement in the form of an embedded Wafer Level Ball Grid Array (eWLB) arrangement with solder contacts on one side and a thermal interface on a side of the chip arrangement facing away from the solder contacts which is designed to dissipate heat from the semiconductor chip. In examples, the thermal interface has a thermally and electrically conductive material, wherein in a top view of the chip arrangement, a contact area in which the thermally and electrically conductive material is in thermal contact with the chip arrangement is limited to the fan-out area. In examples, the thermal interface has at least one RF absorption layer which is designed to absorb electromagnetic radiation at an operating frequency of the semiconductor chip.

Abstract: Detecting insider trading of financial instruments is described. In an embodiment news event data is received from a sentiment index where each news event has at least one associated rating of a relationship between the news event and the financial instrument. For example, a numerical rating of confidence that the news event will influence volatility of the financial instrument and a numerical rating of how related a news event is to a particular company. In examples the news events are filtered using the ratings and remaining news events are used to identify potential insider trading where a price of an order within a time period before the news event differs by more than a threshold amount from a characteristic of the market after the news event. Parameters such as the time period and the threshold may be automatically adjusted using feedback data or may be dynamically user adjusted.