Patents by Inventor Philip B. Cullen

Philip B. Cullen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Silicon wafers bonded to insulator substrates by low viscosity epoxy wicking
    Publication number: 20020134503
    Abstract: A process and assembly of a silicon-on-insulator substrate or handle incorporates a low initial viscosity epoxy adhesive having a high cross-linking density. The assembly is formed by distributing the epoxy adhesive at the interstice between a silicon wafer and the handle and heating the assembly so that the epoxy adhesive wicks by capillary action between the silicon wafer and the handle. The heating causes the epoxy adhesive to cross-link so that a strong adhesion is effectuated between the silicon and handle. The simply controllable process affords a high yield at relatively low cost.
    Type: Application
    Filed: March 20, 2001
    Publication date: September 26, 2002
    Applicant: AccuCorp Technical Services, Inc.
    Inventors: Keith R. Hussinger, Philip B. Cullen